石川金属 List of Products and Services

Rich automotive track record For over 15 years since its release, it has been used by many users, including those in the automotive sector. For screen printing - Chip stand-off prevention type "BT02B878C" The metal composition expands the melting point by adding silver to the eutectic solder, preventing the chip stand-off phenomenon. It increases the adhesive properties of the binder, suppressing the movement of small chips. As a silver-containing effect, it also prevents silver dissolution, improving solder joint strength, thereby enhancing mounting quality. - Standard type "BH63B878C" Developed a solder paste that achieves no-cleaning using conventional reflow. Compared to nitrogen reflow furnace compatible solder paste, it exhibits almost the same characteristics, but since the solid content in the flux is slightly higher, there is a minor drawback in pin contact performance. *For more details, please refer to the PDF document or feel free to contact us.*

This is a high melting point type of solder paste. It is ideal for mounting components with high heat generation, such as power semiconductors. It has good adhesion after printing and suppresses solder ball formation during heating. This allows for more stable mounting.