石川金属 List of Products and Services

Background Copper is widely used in automobiles and electronic components, but its price has significantly increased from July 2020 to the present. The rising demand for copper due to the proliferation of electric vehicles (EVs) is one factor driving up prices. Consequently, there is an accelerating movement to switch the materials of busbars and coils from copper to aluminum. Furthermore, the aspect of weight reduction is also drawing attention to the transition from copper to aluminum. → From copper to aluminum For details on dip soldering to aluminum coils, please see the information below.

The rosin used in flux varies in color depending on the variety, ranging from colorless and transparent to brown. Additionally, some active agents and additives can change color due to the heat during soldering. In LED lighting equipment, a white resist is applied over the entire substrate, and if the flux residue is brown, it can detract from the product's appearance. Furthermore, on substrates with silk-screened markings, brown flux residue can flow into the marked areas, reducing visibility and increasing the burden during visual inspection processes. We offer solder materials that minimize the color of flux residue by using light-colored rosin and low-color active agents. For samples, please contact us through our website below. 【Product Introduction】 ■ Rosin-containing solder, splash prevention type MYK series ■ Solder paste (bottle), colorless residue, LED compatible type 8860 series

Currently, the introduction of low-silver solder with reduced Ag content and silver-free solder is progressing. The Ag in solder plays roles such as lowering the melting point of the alloy, improving wettability, and increasing mechanical strength, fatigue strength, and creep strength. We offer solder pastes and flux-cored solders compatible with low-Ag and no-Ag options, so please feel free to contact us. 【Product Introduction】 ■ Solder Paste (Bottle) Wettability-focused 1001 Series ■ Flux-Cored Solder Wettability-focused MFJ Series ■ Flux-Cored Solder Splash Prevention MYK Series *For more details, please feel free to contact us.

In the case of solder materials, halogens such as Cl and Br are used in the flux to enhance the wettability and workability of the solder. However, incinerating electronic substrates containing halogens like Cl and Br can produce harmful dioxins to living organisms. To address this issue, the regulation of halogens used in electronic substrates is what is meant by halogen-free. Our company offers a variety of rosin-containing solder and solder paste that meet various halogen-free standards, so please feel free to contact us. 【Product Introduction】 ■ Rosin-containing solder → High reliability, halogen-free standard compliant HRK series ■ Rosin-containing solder → Completely halogen-free type HFC series ■ Solder paste (bottle) → Splash prevention, halogen-free standard compliant type 8850 series ■ Solder paste (bottle) → Completely halogen-free standard compliant 7100 series *For more details, please feel free to contact us.

Infrared lasers are used for soldering. There is a characteristic that organic materials have a higher absorption rate than metals. As a result, during soldering, the temperature of the flux becomes higher, and phenomena such as the evaporation or degradation of the flux can be observed before the solder alloy reaches the required temperature. Laser soldering faces the following challenges associated with optical heating and rapid heating over a short period of time: - Insufficient wetting - Flux and solder scattering - Decreased laser output due to lens contamination For laser soldering materials, specialized rosin-core solder and solder paste are available. In the case of rosin-core solder, using a base material that is less volatile can help, and for solder paste, adding materials that are less prone to thermal sagging at high temperatures can address these issues. We offer solder materials tailored to various mounting forms such as point soldering, SMT, printing, and dispensing, so please feel free to contact us. *For more details, please do not hesitate to contact us.

【Overview】 Stainless steel is a base material that can be soldered. The Sn in the solder bonds with the Fe and Ni in the stainless steel to complete the joint. The difficulty of soldering is due to the behavior of the oxide film on stainless steel. While the oxide film on stainless steel serves to prevent rust, it also hinders soldering. During soldering, the oxide film on the stainless surface is removed by the flux, but a new oxide film grows due to heat and oxygen in the air. Therefore, it is necessary to complete the soldering in a short time before the oxide film grows too thick. 【Three Features】 - Strong wettability - Stainless steel can also be soldered - Compatible with no-clean *Test reports are also included in the catalog! *We offer solder with flux for stainless steel, so please contact us!

Copper erosion and fine wire erosion This phenomenon occurs when soldering coil wires for relay components, earphones, microphones, etc., causing the wire to become thinner. Depending on the severity, it can lead to defects such as wire breakage. Causes of copper erosion Copper erosion occurs when the copper in the coil wire forms compounds with Sn in the solder and diffuses into the solder. Pb-free solder contains a higher amount of Sn, making it more susceptible to erosion. Countermeasures for copper erosion By adding a large amount of Cu to the solder alloy, it is possible to reduce the diffusion rate of Cu from the coil wire, thereby decreasing copper erosion. We offer solder with resin for copper erosion countermeasures and bar solder, so please contact us for more information.

About the Price and Characteristics of Aluminum The price of aluminum is about one-third that of copper, which can reduce procurement costs. Additionally, its weight is also about one-third, allowing for a reduction in transportation costs and environmental impact related to delivery. The characteristics of aluminum are that it is both ecological and economical. Soldering Aluminum We have made it possible to solder aluminum, which has been difficult until now. The surface of aluminum has a strong oxide film, and common fluxes cannot remove this oxide film. No-Clean Compatibility In our tar-containing solder EAN series, we have successfully used a special fluorine compound activator to remove the strong oxide film on aluminum. Just like our previous tar-containing solders, it can be used without the need to clean flux residues. *For more details, please feel free to contact us.

Applications of Low Melting Point Solder Low melting point solder is used for the assembly of heat-sensitive components such as camera modules. Until now, these components have been retrofitted using resin-based solder, but further efforts are being made to lower temperatures and automate processes through the use of low-temperature solder and laser heating. Challenges of Low Melting Point Soldering Low melting point solder requires dedicated flux that matches its melting point, so it cannot be directly applied to what is currently in use. Additionally, since the alloy contains bismuth, caution is needed when using it in areas that require high reliability, such as automotive parts, medical devices, and industrial equipment. Ishikawa Metal's Low Melting Point Solder We already offer a variety of syringe-type solder pastes with proven market performance, including halogen-free syringe-type solder paste, so please contact us for more information. *For more details, feel free to contact us.*

The particle size of solder powder used in solder paste must be selected appropriately according to the mounted components. As miniaturization of components used in small mounted products progresses, it is necessary to narrow the inner diameter of the metal mask openings and dispensing nozzles to stably apply a small amount of solder to the mounting substrate, which requires the use of fine powders. Fine powders not only have a smaller diameter but also have an increased surface area per unit weight. As a result, issues arise such as: - Decreased wettability - Increased solder balls - Decreased stability during use (continuous application) These challenges necessitate the development of specialized fluxes to address them. We offer a syringe-type solder paste using Type 5 (10-25) powder, which resolves the above issues, and it has already been adopted by our users. *For more details, please feel free to contact us.

With the miniaturization of various implemented products and the fine-pitching of circuit boards, precise adjustments in solder supply amounts are required. Ultra-fine solder is used in small components such as camera modules, OIS modules, and fine cables. Our ultra-fine solder with flux can accommodate wire diameters down to 0.10mm and can also have a flux content of 6%. This allows for more precise adjustments in solder supply amounts and significantly expands the range of applications. It is possible to create ultra-fine wires with various types of flux-cored solder, including anti-splash flux-cored solder and stainless steel-compatible flux-cored solder. *For more details, please feel free to contact us.