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  1. Home
  2. Ferrous/Non-ferrous metals
  3. 石川金属
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Ferrous/Non-ferrous metals
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石川金属

EstablishmentMarch 27, 1952
number of employees44
addressOsaka/Nishi-ku, Sakai-shi/7-21 Takahama Nishimachi, Chukou
phone072-268-1155
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last updated:Jul 30, 2025
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石川金属 List of Products and Services

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Lead-free solder Lead-free solder
Solder bath anti-oxidant Solder bath anti-oxidant
Lead-free solder paste (bottle) Lead-free solder paste (bottle)
Lead-free solder paste (syringe) Lead-free solder paste (syringe)
Aluminum solder Aluminum solder
Lead-containing solder Lead-containing solder
Lead-containing solder paste (bottle) Lead-containing solder paste (bottle)
Lead-containing solder paste (syringe) Lead-containing solder paste (syringe)
Soldering defect Soldering defect
Special purpose case examples Special purpose case examples
Soldering

Soldering defect

I will introduce "soldering defects."

Soldering defect: wet defect (solder paste)

Introducing the wet defect of solder paste.

Issues with Poor Wetting When solder wetting is poor, the bonding area decreases, leading to reduced joint reliability. Causes of poor wetting include issues with the reflow profile and degradation of components and substrates. Concept of the Reflow Profile A method called the "trapezoidal profile" is employed, which involves a long preheating and main heating process. While the heat resistance temperature of components is around 250°C, the melting point of solder is approximately 220°C. By extending the preheating zone, temperature differences due to the size of components are eliminated, preventing wetting failures due to insufficient heat in large components and failures due to overheating in small components. Degradation of Solder Paste During Preheating The typical preheating temperature is between 150°C and 180°C, with a preheating time of 90 to 120 seconds. During preheating, the flux in the solder paste begins to react due to heat, gradually losing its activity and reducing wettability. Therefore, it is ideal to conduct preheating at the lowest possible temperature and for the shortest time, within a range where the component temperature rises to about 240°C during main heating. Wetting Measures with Solder Materials The flux in solder paste contains activators tailored to the preheating and main heating temperatures. Our company offers pastes that demonstrate good wettability across a wide range of preheating temperatures and various components.

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Soldering defect: void (solder paste)

I will introduce the void in the implementation with solder paste.

Void Issues Voids in solder joints are phenomena where gas generated during soldering remains trapped inside the solder joint. According to the industry standard IPC-A-610, voids up to 25% of the joint area are permissible, but for components such as power devices, reducing voids is necessary to improve heat dissipation efficiency and ensure joint reliability. Causes of Voids The causes of voids include: - Air bubbles trapped in non-wet areas - Decomposition gases from residual flux in the solder - Decomposition gases trapped in non-wet areas Measures Against Voids To prevent voids, it is essential to avoid creating non-wet areas on the substrate and components. It is important to manage them properly to prevent deterioration due to oxidation or moisture absorption during storage. Our company offers void-reducing solder paste made from materials with good wettability and low gas generation, so please contact us for more information.

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[Soldering Defects] Wet defects, bridges, horns (solder with flux)

I will introduce you to wet defects, bridges, and horns (solder with flux).

The details below include information regarding "wet defects, bridges, and horns" in solder containing flux, so please check them.

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Soldering defects: Flux scattering, solder balls (solder with resin)

We will introduce flux dispersion and solder balls (solder with resin).

The details below include information regarding "wet defects, bridges, and spikes" in solder with flux, so please check.

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Soldering defect: Flux scattering (solder paste)

I will introduce you to flux dispersion (solder paste).

The following detailed information describes the flux dispersion in solder paste, so please check it.

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Soldering defect: Residue cracking (solder with flux, solder paste)

I will introduce you to residue cracking (solder with flux, solder paste).

The details below describe the cracking of flux residue in solder with flux and solder paste, so please check them.

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Soldering defect: printing defect (solder paste)

I will introduce the issue of printing defects (solder paste).

The details below describe the cracking of flux residues in solder with rosin and solder paste, so please check them.

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