友電舎 Product Lineup

At Yudensha Co., Ltd., we are working on cost reduction through improved wear resistance of silver plating. By increasing hardness to enhance sliding properties and wear resistance, we have achieved a reduction in silver usage while maintaining performance, thereby lowering costs. In addition to conventional hard silver and ultra-hard silver plating, we have realized various performance enhancements such as wear resistance, sliding properties/conductivity/thermal resistance, and antimony-free options, allowing for a wide variety of silver plating solutions. 【Features】 ■ Capable of 50μm thick silver plating ■ Supports high hardness silver plating that is free of antimony ■ Low-friction silver plating treatment with excellent sliding properties due to carbon content ■ Capable of both barrel plating and rack (hanging) plating depending on product shape and size ■ Equipped with facilities capable of mass production *For more details, please download the PDF or feel free to contact us.

• Surface treatment contract service

At Yudensha Co., Ltd., we are engaged in the development of technologies and applications for high-adhesion plating on various ceramic materials. Currently, we are forming adhesion-promoting plating with glazes on lithium-based ceramics and barium titanate. For barium titanate, we create patterns using a laser after the plating is formed. We accept prototype requests. If you are considering prototype plating on ceramics, please feel free to contact us. 【Plating Specifications (Development and Prototype Achievements): Lithium-based Ceramics】 ■ Electroless Nickel-Boron (Ni-B): up to 0.2μ ■ Silver plating (Ag) on Electroless Nickel-Boron (Ni-B) plating: 20-30μ ■ Material of resin: Lithium-based ceramics *For more details, please download the PDF or feel free to contact us.

• Other contract services

At our company, which handles a large amount of electrolytic gold plating, we have established an electrolytic Ni, Au, and Pd plating method to meet customer needs. By converting from electroless Ni (nickel), Pd (palladium), and Au (gold) plating to electrolytic plating, we eliminate the disadvantages of electroless plating. By introducing a Pd plating layer as a barrier layer in between, we can more effectively control the exposure of Ni to the Au surface. Additionally, by incorporating a Pd layer, we can reduce the thickness of the Au plating, which enhances secondary mounting capability with solder. 【Features】 ■ More effectively control the exposure of Ni to the Au surface ■ Enhance secondary mounting capability with solder ■ Electrolytic Ni ・No thickness limitations ・Can accommodate underlying Cu plating for non-magnetic purposes *For more details, please download the PDF or feel free to contact us.

• Plating Equipment

By providing a Pd plating layer as a barrier layer in between, the exposure of Ni to the Au surface can be more effectively controlled. Additionally, by incorporating a Pd layer, the Au plating can be made thinner, which enhances the secondary mounting capability with solder. This addresses the disadvantages of electroless Ni-Pd-Au plating. 【Disadvantages of Electroless Plating】 - Cannot achieve thick film deposition. - Material loss occurs due to liquid renewal. - Long processing time leads to poor productivity. - There are limitations on the specifications of the electroless Ni substrate. ↓ ↓ ↓ 【Electrolytic Plating】 - Processing is possible regardless of film thickness. - Low material loss results in lower running costs. - Short processing time allows for improved productivity and reduced processing costs. - No restrictions on the substrate, allowing for options beyond Ni. 【Features】 - Electrolytic Ni: No restrictions on film thickness; can accommodate non-magnetic purposes even with a Cu substrate. - Electrolytic Pd: Film thickness can be adjusted according to specifications; prevents diffusion of the underlying Ni layer due to heat resistance (barrier layer). - Electrolytic Au: No restrictions on film thickness; good WB properties and solder joint reliability; suitable for semiconductor components.

• Surface treatment contract service
• Processing Contract
• Printed Circuit Board

This is silver plating for parts of EVs (electric vehicles) and PHVs (plug-in hybrid vehicles). It achieves various performance improvements such as wear resistance, sliding properties, conductivity, and thermal resistance, and can accommodate a wide variety of Ag plating options, including hard silver, super hard silver, antimony-free, and graphite composite. It also supports thick silver plating. Cost reduction is possible through improved wear resistance. 【Variations】 - Soft pure silver plating (hardness: 90Hv / Features: Sb-free) - Hard silver plating (hardness: 140Hv) - Super hard silver plating (hardness: 180Hv) - Antimony-free silver plating (hardness: 180Hv / Features: Sb-free) - Graphite composite silver plating (hardness: 90Hv / Features: Sb-free, excellent wear resistance) 【Features】 - Capable of 50μm thick silver plating - Unique thickness suppression technology for thick plating allows for material cost reduction - Supports high hardness silver plating that is antimony-free - Low-friction silver plating treatment with excellent sliding properties due to carbon content - Capable of both barrel plating and rack (hanging) plating depending on the shape and size of the product - Equipped with facilities capable of mass production

• Surface treatment contract service
• Automotive Connectors

Heat sinks, heat spreaders, and lead pins for semiconductors and various electronic components are often made from copper or iron materials that have been processed through pressing and header processing. In this case, nickel plating (Ni) is mainly used for rust prevention, while silver plating (Ag) is utilized to ensure solder wettability. On the other hand, tin plating, which is inexpensive and provides both rust prevention and wettability, is sometimes avoided because products can easily stick together, even though it would be desirable to use. Our company can provide functional Sn plating with rust prevention and solder wettability at a low cost, without worsening yield due to sticking. This is a technology for application development based on the establishment of mass production facilities tailored to customer needs.

• Processing Contract

**Features** - Currently capable of plating on polyimide (PI) and Teflon (PTFE). - PI allows for the formation of a smooth plating film. (Development of PTFE and others is ongoing) **Technical Summary** We are developing a method for ensuring adhesion between the resin and the plating film through the formation of a chemical bonding layer, rather than relying on the anchor effect from roughening. **Conventional Technology** Adhesion between the resin and the electroless plating layer is achieved through an anchor structure. **New Technology (Under Development)** Adhesion between the resin and the electroless plating layer is achieved through strong chemical bonding. **Summary of Advantages of the Technology Under Development** We aim to directly plate a smooth plating film on various resins, primarily engineering plastics. **Conventional Technology** - Adhesion Mechanism: Anchor structure - Adhesion Strength: Low strength - Applicable Materials: Limited to materials like ABS (only those that can be roughened) - Smoothness of Plated Surface: Rough (remnants of the anchor structure's unevenness) - Environmental Compliance: Use of hexavalent chromium compounds **New Technology (Under Development)** - Adhesion Mechanism: Chemical bonding - Adhesion Strength: High strength - Applicable Materials: Can be applied to various resins and ceramics - Smoothness of Plated Surface: Smooth, mirror finish possible (no anchor structure needed) - Environmental Compliance: Chromium-free

• Processing Contract

【Features】 1. Low-cost plating treatment is possible by reducing material costs. 2. Even with electroplating, the thickness difference between the metal base and lead pins can be minimized. 3. There is less variation in film thickness due to individual differences in products. 4. A specialized plating solution that ensures wire bonding (WB) properties is used for gold plating. (Customizable depending on the project) 5. Supports multi-pins that are prone to tangling and long lead pins, as well as connectors. 6. Can accommodate difficult-to-handle small items (stem diameter φ2 and lead pin φ0.25). 7. Can also accommodate ceramic stem bases. (Plating only for lead pins)

• Processing Contract

With this technology, new performance enhancements and longevity for aluminum processed parts that are used without plating are expected. When plating aluminum processed products, it is common to hang each piece on a jig for plating (known as "rack plating" or "octopus plating"). This is due to the specific pretreatment processes required for aluminum materials. As a result, challenges arise such as "fine processed products cannot be plated," "plating costs are inevitably high," and "large quantities cannot be accommodated." In response to these challenges, our company addresses needs such as: "We want to apply functional plating (conductivity, corrosion resistance) to precision and fine processed parts made of aluminum for weight reduction." "We do not want jig marks (unplated areas) left on the plating." "We want to secure suppliers that can handle large-scale plating processing." Our company, which originally specializes in plating precision and fine metal processed products (such as copper, iron, KOV, SUS, etc.), has developed a technology that allows for large-scale plating of aluminum processed and molded products as well. *For more details, please refer to the PDF materials or feel free to contact us. *Web meetings are available.

• Surface treatment contract service

This is a thick silver plating required for contacts, connectors, and terminal components of breakers that operate under high voltage. The thickness of the silver plating can be tailored to requests ranging from 50 to 100 micrometers, and it is used in power transmission and distribution equipment, semiconductor devices, and connection components for electric vehicles.

• Processing Contract

"Yaki-tsuka Nut/Yaki-tsuka Bolt" is a user-friendly anti-seizing product composed of high-quality stainless steel nuts and bolts manufactured by Kishiwada Stainless and a unique multi-layer plating developed by Yuden-sha. Manufacturer: Kishiwada Stainless, Yuden-sha Distributor: Yura Sansho It prevents efficiency loss in various piping and electrical work, as well as maintenance tasks for various devices and equipment, contributing to the preservation of the fastened objects. Additionally, by being adopted by machine and equipment manufacturers, it helps reduce the burden of maintenance and preservation tasks performed by end users (improving customer satisfaction). Thanks to the smooth tin plating finish, the friction coefficient of the screw surface and seating surface is low during tightening, which enhances axial force. Since the friction coefficient is not too low, the risk of over-torque caused by anti-seizing agents is minimal, and it does not get dirty. 【Features】 ■ Dry finish (no coating, no drips, does not get dirty) ■ Excellent adhesion of plating! Difficult to peel off even after repeated use ■ If you use a yaki-tsuka nut, any bolt will work ■ If you don't use a nut, use a "yaki-tsuka bolt"! ■ With the contract processing service "YK Coat," anti-seizing treatment is possible for all fastening parts.

• bolt
• nut

To ensure the conductivity of finely patterned substrates and connectors, gold (Au) plating is often required. In such cases, electroplating is commonly used, but there are instances where electroplating cannot be applied. "For the sake of the substrate pattern, it is not possible to ensure conductivity for plating." "The shape is complex, leading to variations in film thickness with electroplating." "Plating is desired on the terminal parts while in a resin-molded state." In such cases, electroless gold (Au) plating can be utilized. In particular, our company can deposit gold plating with almost uniform film thickness on finely patterned substrates, even on independent patterns. This means that the issues associated with traditional electroplating, such as ensuring contact, occurrence of non-deposition, and variations in film thickness, can be resolved with our electroless gold plating. The base plating is electroless nickel (Ni-p), and it is also possible to add an electroless palladium (Pd) intermediate layer, with proven results in mass production. Currently, we are engaged in technological development aimed at further enhancing functionality and performance. We can also accommodate prototype and sample creation. Please feel free to consult with us.

• Surface treatment contract service

It is utilized as a plating for metal processed products that serve as "covers" to seal ceramic packages for mainly crystal devices, SAW filters, and various sensors, processing hundreds of millions of units per month. The size is small, measuring 1.47×1.07mm (0.05t). Even with large-scale processing, there is almost no "overlap" caused by plating. For press-cut products, plating treatment resolves issues such as "remaining overlap marks or incomplete coverage" and "drying stains." Additionally, contamination countermeasures are well-developed, assuming post-processing will be implemented and assembled in a clean room. 【Burr Countermeasures by Pressing】 Resolved through a unique chemical polishing treatment. 【Ensuring Solder Wetting Properties】 - Introduction of a unique plating solution management method through dedicated line processing. - If necessary, an additional treatment process to enhance wettability can be added. 【Types of Plating】 1. Nickel Plating (Ni, Ni-p) Finish Electrolytic plating: Matte Electroless plating (Ni-p: medium phosphorus type): Glossy 2. Gold Plating (Au) Finish Electrolytic plating: Matte (soft)

• Processing Contract

This is a hard silver plating that achieves both low cost through wear resistance and reduced film thickness. Even with a thin film thickness, it ensures sufficient hardness. Even if the film thickness is increased, the surface of the plated film maintains smoothness suitable for terminals and connectors (proven: up to 100μ). The thickness and hardness of the silver plating film are managed with measuring instruments, characterized by small variations in measurement values. If silver plating is needed for terminals and connectors... "We need to make the film thick to ensure hardness, which increases the plating cost." "If we make the film thick, the plating film won't be smooth." These challenges can be overcome. We can solve the concern of wanting to reduce the thickness of hard silver plating while still needing hardness. 【Features】 ■ Well-equipped mass production facilities that maintain high quality ■ The surface of the plating film maintains the necessary smoothness for terminals even with increased thickness ■ No cracking or peeling of the plating film ■ Small variations in thickness and hardness of the plating film even in mass production ■ Also used for movable/fixed terminals and seal rings/gaskets (up to φ400) ■ Partial plating is possible, plating only where needed.

• Surface treatment contract service

Our company has been developing surface treatment technologies (industrial functional plating, precision degreasing and cleaning, insulation, printing, chemical polishing, special coatings, etc.) as core technologies since its establishment, and we are expanding our business to accommodate consistent production from pre-processing based on customer requests. We are also actively developing surface treatment technologies for new and difficult materials, making the impossible possible with our unique methods. Since we can design and manufacture surface treatment equipment in-house, we continuously improve and update our equipment to meet the times, ensuring that we maintain high quality while adhering to management standards. We are equipped with analysis and evaluation devices, allowing us to address various issues from identifying causes to providing satisfactory solutions. 【Business Content】 ■ General surface treatment (industrial functional plating, precision degreasing and cleaning, painting, insulation, printing, chemical polishing, heat treatment, etc.) ■ Development of surface treatment technologies for new and difficult materials ■ Special coatings that require the establishment of unique technologies ■ Design and manufacturing of surface treatment plants, pressing, painting, assembly of industrial functional parts, etc. ■ Sales of finished and semi-finished products such as electronic components and industrial functional parts *For more details, please download the PDF or feel free to contact us.

• Surface treatment contract service
• Processing Contract
• Contract manufacturing

The processing of applying a metallic film to metallic materials or non-metallic materials such as resins is generally referred to as "plating." Our company applies functional plating to various metallic materials as well as finely processed components and parts. Additionally, we have developed unique technologies that enable us to plate difficult materials that were traditionally considered challenging to plate, as well as shapes that are prone to "catching" or "overlapping." If you have any questions regarding the types of plating or materials, please feel free to contact us.

• Surface treatment contract service

Our company has established environmentally friendly black plating technology to meet market needs. We propose various surface treatment technologies with excellent color tone and functionality for a wide range of applications. We have revamped the conventional electrolytic Ni-Zn black and electroless Ni-P black treatments to enable a deeper black finish. In addition to the existing electrolytic Ni-Zn black and electroless Ni-P black, we have newly added electrolytic Ni-Sn black, increasing the variety of black options. Our products are lead-free and comply with environmental regulations such as the RoHS directive. 【Features】 ■ Electroless Ni-P Black - Excellent dimensional accuracy with uniform film thickness - Superior thermal stability ■ Electrolytic Ni-Sn Black - Low-cost mass production due to electrolytic plating *For more details, please refer to the PDF document or feel free to contact us.

• Surface treatment contract service

This is our unique mass production technology for glossy silver plating that prevents the brightness (reflectivity/glossiness) of high-brightness LED packages (ceramic substrate/resin + metal) from degrading due to thermal stress during the manufacturing process and while in use. It is particularly utilized in high-end LED packages.

• Surface treatment contract service
• Plating Equipment

Our company has established a surface modification technology that instantly improves the wettability of various materials to meet market needs, thereby enhancing adhesion, painting, and plating properties. This technology enables "printing," "adhesion," and "plating" on so-called difficult materials. By simply exposing the target object to a flame using gas, the surface is activated, allowing for improved wettability. 【Features】 ■ Instant activation of the surface and improvement of wettability by simply exposing it to a flame ■ Long-lasting surface modification effects ■ Applicable to various materials *For more details, please refer to the PDF document or feel free to contact us.

• Surface treatment contract service