ピュアオンジャパン List of Products and Services

At Pureon, we propose a rapid thinning process that combines IRINO-PROSiC and diamond slurry PURE-DS-RT for high-speed grinding of SiC wafers, achieving significant cost reductions compared to conventional processing methods. This innovative combination not only ensures excellent surface quality but also guarantees a high processing rate, making it suitable for applications that require a smooth transition to the CMP process. The back side features a self-adhesive tape, allowing IRINO-PROSiC to be easily attached to existing metal plates, enhancing the usability and efficiency of SiC grinding tools. Whether you seek superior surface quality or high processing rates, IRINO-PROSiC is the ideal product for advanced SiC processing. 【Features】 ■ Innovative grinding pad suitable for the Rapid Thinning process ■ Optimal for grinding SiC ■ Surface finish at Ra 1 nm level ■ Highly competitive compared to conventional grinding processes ■ Flat finish that does not cause edge surface degradation ■ Usable on single-sided/double-sided polishing machines with flat plates (dressing required)

OPW is a water-soluble diamond suspension designed for final polishing of optical components, ceramics, metals, and more. It can be used immediately upon arrival. The OPW suspension delivers optimal performance in finishing processes from 3 microns to 0.1 microns. We offer products suitable for polishing on pads and pitch plates/PU foils. 【Features】 ■ Tailor-made specifications You can freely choose the type of diamond, grain size, and concentration. ■ Aggregate-free processing Excellent usability due to reliable dispersion. ■ Maintains a high polishing rate through cooling and lubrication. ■ Environmentally friendly and easy to maintain. *For more details, please feel free to contact us.

WSG is a glycol-based diamond slurry suitable for high-performance multi-wire saws. It can be used immediately upon arrival. Our unique additives promote adhesion between the slurry and the wire, enhancing cutting speed. 【Features】 ■ Tailor-made specifications You can freely choose the type of diamond, particle size, and concentration. ■ High polishing rate It has optimal adhesion to the wire, maintaining a high polishing rate. ■ High reproducibility Thanks to our unique formulation, no dispersion processing is required. ■ Water-soluble, environmentally friendly, and easy to maintain *For more details, please feel free to contact us.