ボンマーク Product Lineup

This document introduces a list of products handled by Bonmark Co., Ltd. It presents products categorized by type, including ink and marking-related items, masks for circuit board printing, rubber stamps, and seals. It also includes the email addresses of various locations such as sales offices and factories. [Contents] ■ Ink and marking-related products ■ Laser marking stencils ■ Masks for circuit board printing ■ Accessories for mask printing ■ Foil and plating masks, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing
• Other machine elements

Introducing a new squeegee made of SUS304 material, featuring a surface with dimple processing and a special surface coating. Utilizing thixotropy, we have enhanced the rolling capability. The amount of solder required is reduced to one-third of the conventional amount, resulting in improved productivity. Additionally, the increased rolling of cream solder leads to a decrease in solder viscosity (greater fluidity), enhancing the release properties. 【Features】 ■ Dimple processing and special surface coating on the surface ■ Improved rolling capability ■ Enhanced release properties ■ Increased productivity ■ Cost reduction and resource conservation *For more details, please refer to the PDF document or feel free to contact us.

• Other machine elements

Bonmark Co., Ltd., which develops, manufactures, and sells metal masks for electronic component mounting and masks for displays, responds swiftly to the rapidly changing needs of modern society and industry based on its unique technology. Through the act of printing, we connect people to people, companies to companies, and societies to societies with trust, creating a more advanced society and a more comfortable living environment through the application of that technology. To better practice this philosophy, Bonmark will continue to think from both micro and macro perspectives. 【Business Activities】 ■ Rubber stamps and inks for marking product names, lot numbers, etc., on electronic components and semiconductor packages ■ Development, manufacturing, and sales of metal masks for electronic component mounting ■ Development, manufacturing, and sales of peripheral devices and systems related to electronic component mounting ■ Development, manufacturing, and sales of precision plates for semiconductor packages ■ Development, manufacturing, and sales of masks for displays ■ Precision processing and prototyping through etching, plating, and laser technology ■ Other technical services related to the above *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing
• Other machine elements

"Wiper Roll" is a cleaning paper for metal masks. It is manufactured using the spunbond method, featuring "Type P," which minimizes dust and fluff, and "Type T," produced using the spunlace method, focusing on wipe performance and ecology. We offer a variety of products compatible with different printing machines and look forward to your orders. 【Features of Type P】 ■ Lightweight and excellent heat resistance ■ Superior chemical resistance ■ Glossy finish ■ The special uneven surface pattern enables efficient wiping of various types of cream solder (soft and hard) *For more details, please refer to the PDF materials or feel free to contact us.

• Other consumables
• others

"Bon Plate" is a substrate backup fixture for component mounting during the printing of high-density printed circuit boards. It raises printing conditions and reduces defect rates. In addition to being compatible with various printing machine manufacturers, it also resolves issues related to difficult pin vertical alignment during high-density mounting. It is suitable for thin substrates as well. If you provide CAD (mask, silk data, etc.), it will be in your hands in five days. Please consult us separately regarding short delivery times. 【Features】 ■ Compatible with various printing machine manufacturers ■ Reduction of defect rates through high printing conditions ■ Short delivery times available *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing
• Processing Jig

The "Half Etching Mask" is compatible with etching, laser, and additive masks. This product adjusts the solder volume for large components and fine components during mixed assembly, enabling the combination of large components (such as connector parts) and 0603 chips, achieving optimal surface mounting. 【Full Half Type (with some protrusions remaining)】 - Ensured an appropriate amount of solder for large components during mixed printing of large and small parts, enabling stable mounting. 【Local Half Type】 - By setting the board thickness of fine pattern sections arbitrarily, stable printability during fine pitch printing has been achieved. *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing
• Other machine elements

The "Additive Mask" is a mask produced using the electroforming method. The material is nickel, and the metal thickness can be freely selected. It allows for fine openings and enables screen printing processes that are difficult with conventional printing methods, such as dot printing and through-hole printing, in addition to SMT applications. Our company also handles "Laser Metal Masks," which are suitable for high-density substrates with high positional accuracy and large sizes. 【Features】 ■ Compatible with fine pitch QFP ■ High release performance for solder paste ■ Flat and smooth cross-sectional shape ■ Customizable board thickness *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing
• Other machine elements

The "Chip On Board Mask" is a metal mask developed for solder paste printing on printed circuit boards that already have components mounted or have uneven surfaces. The mask is designed with protrusions to match the position and shape of the mounted components, and it is used to protect these components. Our COB metal mask is made from a special Ni alloy, which enhances toughness, making it durable and resistant to cracking and chipping. 【Features】 ■ Can directly apply SMT equipment and technology ■ Shortens the process and reduces costs ■ Ensures stable mounting quality and production planning ■ Manufactured as a single unit using additive methods, resulting in excellent durability and printability *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing
• Other machine elements

Our company offers manufacturing technology for 'metal masks' capable of supplying masks that can handle bump molding printing for BGA & CSP. We propose masks that can accommodate next-generation ultra-small size chips like 0402 chips and narrow pitches of 100μm for BGA & CSP, among others. Please feel free to contact us if you have any requests. 【Metal Mask Manufacturing Methods】 ■ Additive Mask ■ Laser Mask ■ Etching Mask *For more details, please download the PDF or feel free to contact us.

• Processing Contract
• Contract manufacturing
• Other machine elements