Supports narrow pitch of 100μm for 0402 chips, BGA, CSP, and other ultra-small size chips!
Our company offers manufacturing technology for 'metal masks' capable of supplying masks that can handle bump molding printing for BGA & CSP. We propose masks that can accommodate next-generation ultra-small size chips like 0402 chips and narrow pitches of 100μm for BGA & CSP, among others. Please feel free to contact us if you have any requests. 【Metal Mask Manufacturing Methods】 ■ Additive Mask ■ Laser Mask ■ Etching Mask *For more details, please download the PDF or feel free to contact us.
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basic information
【Metal Mask Lineup】 ■ Additive Masks ・Foil Metal Masks ・SMT ・COB Masks ■ Laser Masks ・SMT ・NEO Laser Masks ■ Etching Masks ・SMT ・Parts ・Half Etching *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
Company information
At Bonmark Co., Ltd., we primarily engage in the development, manufacturing, and sales of metal masks for electronic component mounting, peripheral equipment and systems related to electronic component mounting, precision boards for semiconductor packaging, and masks for displays. Additionally, we also accept precision processing and prototyping through etching, plating, and laser techniques. Please feel free to contact us if you have any requests.
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