アサヒテック Product Lineup

The "Laser Metal Mask" is a high-precision metal mask processed by laser to match the desired shape. It enables stable and high-precision solder printing on printed circuit boards and other applications. Since it is directly processed from SUS material using a laser processing machine, no film is required. Processing can be done with just the data. We respond to your desired delivery dates with a flexible production system. We also offer an F2 treatment (special secondary processing) type that is suitable for assembly using lead-free solder. 【Features】 ■ Minimum hole diameter φ20μm (plate thickness 20μm) ■ High pitch accuracy within ±10μm (for a pitch of 200mm) ■ Uniform and stable solder volume ■ Compatible with various shape data ■ Comprehensive quality assurance ■ Support for various other masks *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Printing Machinery
• Other processing machines

The "Metal Mask for Micro Solder Ball Array" is a mask used for the formation of solder bumps necessary for the connection between the substrate and semiconductor package. Micro solder balls are used when higher density and uniform height are required compared to traditional solder paste printing for bump formation, and precision is also required for the array mask and black printing. 【Features】 ■ It has a two-layer structure. ■ Layer B has high adhesion to the substrate. ■ Depending on the design of Layer B, it is possible to further increase adhesion. *For more details, please download the PDF or feel free to contact us.

• Photomask
• Processing Contract