Metal mask for micro solder ball array

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last updated：Dec 21, 2018

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Layer B has a high adhesion to the substrate, and depending on the design, it is also possible to further increase the adhesion.

The "Metal Mask for Micro Solder Ball Array" is a mask used for the formation of solder bumps necessary for the connection between the substrate and semiconductor package. Micro solder balls are used when higher density and uniform height are required compared to traditional solder paste printing for bump formation, and precision is also required for the array mask and black printing. 【Features】 ■ It has a two-layer structure. ■ Layer B has high adhesion to the substrate. ■ Depending on the design of Layer B, it is possible to further increase adhesion. *For more details, please download the PDF or feel free to contact us.

Related Link - http://www.asahitec-j.co.jp/metal-mask/solder-ball

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【Specifications】 ■Opening dimensions: ±3μm ■Pitch: ±20μm ■Layer A thickness: 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm 　(±5% / Min: 2μm) ■Layer B thickness: 10~60μm (optional) (±5μm) ■Layer A - Layer B alignment accuracy: ±0.3mm (including Layer B pattern size accuracy) *For more details, please download the PDF or feel free to contact us.