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  3. ディ・アイジャパン
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Electronic Components and Semiconductors
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ディ・アイジャパン

addressTokyo/Chiyoda-ku/3-18-19 Sanbancho, Arte Building, 5th Floor
phone03-3239-9096
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last updated:Nov 20, 2019
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ディ・アイジャパン Product Lineup

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EMI implementation gasket

Surface mountable, EMI SMT gasket, compatible with automatic placement and reflow, specifications suitable for televisions, mobile phones, wireless communication devices, etc.

- Excellent conductivity, resilience, and heat resistance - Supply of reel-type form for automatic mounting - Applicable to lead-free solder reflow - Cost reduction possible through process improvement - Provision of various product dimensions

  • EMC countermeasure products

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Burn-In Board

A lineup including Hi-Fix boards that guarantee intricate docking and high reliability!

We would like to introduce the "Burn-In Board" handled by Di-I Japan Co., Ltd. Our lineup includes the "HI-FIX BOARD," which guarantees precise docking and high reliability, and the essential part "Wafer Mother Board," which connects the tester's station and probe card during wafer testing to relay signals and power. 【Lineup】 ■ BIB for MEMORY ■ BIB for LOGIC ■ Wafer Mother Board ■ HI-FIX BOARD * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Other semiconductor manufacturing equipment

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Logic Burn-In Tester

A lineup that includes a burn-in system that achieves a reduction in initial defects!

We would like to introduce the 'Logic Burn-In Tester' handled by Di-I Japan Co., Ltd. Our lineup includes the high-performance logic burn-in system "DL1100E," as well as the high-temperature and low-temperature operation models "DL1100A" and "DP4100," which achieves high reliability and reduces initial defects. 【Lineup (excerpt)】 ■ DL1100E ■ DL1100A ■ DL800F ■ DL600 ■ DP4100 * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.

  • Semiconductor inspection/test equipment

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Test Burn-In Tester

A wide variety of package burn-in test systems are available!

The "Test Burn-In Tester" inherits Ando Electric's burn-in testing and is a package burn-in test system that realizes diverse testing conditions and functions through upgrades tailored to new customer needs. We offer a lineup that includes the "AF8652D6," which provides high power with added Mask-ROM testing capabilities, as well as the "AF8862C7" with a 10MHz, 60-slot specification, and the "DM8827," which allows for individual control operation in 4 zones. 【Lineup】 ■AF8652D6 ■AF8862C7 ■DM8827/DM8857 ■AF8651A5/AF8651A7/AF8655C7 ■AF8610E6 *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

  • Semiconductor inspection/test equipment

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Package Burn-In Test "DM1400"

High-performance package burn-in test with enhanced flash memory test functionality.

The DM1400 is a high-performance package burn-in test system that offers enhanced flash test functions, high-speed operation, and a wide range of test conditions. Please feel free to contact us if you have any inquiries. 【DM1400C Overview】 ■ Target Products: Flash (NAND, Toggle NAND, etc.), eMCP, DDR, LPDDR, etc. ■ Features: 100MHz (200Mbps), 144 I/O, 48 Slots, Dual Date Generator, Flexible Zone function (optional) ■ Operating Temperature: RT to 150℃ *For more details, please download the PDF (English version) or feel free to contact us.

  • Semiconductor inspection/test equipment

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