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  4. Semiconductor Manufacturing Equipment
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  6. Package Burn-In Test "DM1400"

Package Burn-In Test "DM1400"

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last updated:Sep 03, 2021

ディ・アイジャパン
ディ・アイジャパン
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High-performance package burn-in test with enhanced flash memory test functionality.

The DM1400 is a high-performance package burn-in test system that offers enhanced flash test functions, high-speed operation, and a wide range of test conditions. Please feel free to contact us if you have any inquiries. 【DM1400C Overview】 ■ Target Products: Flash (NAND, Toggle NAND, etc.), eMCP, DDR, LPDDR, etc. ■ Features: 100MHz (200Mbps), 144 I/O, 48 Slots, Dual Date Generator, Flexible Zone function (optional) ■ Operating Temperature: RT to 150℃ *For more details, please download the PDF (English version) or feel free to contact us.

    Semiconductor inspection/test equipment
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Package Burn-In Test "DM1400"

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Package Burn-In Test "DM1400" [English Version]

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ディ・アイジャパン

ディ・アイジャパン

Electronic Components and Semiconductors

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At the research institute of our parent company, DI Corporation, we have successfully developed next-generation semiconductor inspection equipment based on specialized research projects related to semiconductor equipment. We maintain and manage a development and manufacturing environment for products that have obtained international certifications for quality (ISO 9001), environment (ISO 14001), information security (ISO 27001), and occupational health and safety (OHSAS 18001). Additionally, to ensure that our customers can use our products with peace of mind, we provide sales and maintenance services utilizing our global network.

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