NAS技研 Product Lineup

The SC-9000 is a simple type of trace contaminant recovery device that can recover contamination from hydrophilic wafers. It can also sample wafers made of materials other than silicon or wafers with rough surfaces due to bulk etching. 【Features】 - Restrictions on the state of the wafer and the type of sampling solution have been relaxed, allowing for the recovery of ions other than heavy metals. - Conventional hydrophobic surface sampling is also possible. - The device automatically supplies the sampling solution and moves the holding device, among other functions. *For more details, please download the PDF or contact us.

• Other environmental equipment

The SC-3000 is a simple device for recovering trace contaminants from hydrophobic wafer surfaces. It connects to a computer to create various recovery patterns and collects (samples) trace metal contamination from the surface and sides (bevel area) of silicon wafers. Additionally, it requires minimal external resources and occupies little space, making it easy to introduce the device. Please feel free to contact us if you have any inquiries. 【Features】 ■ Compatible with wafer sizes from 100mm to 300mm ■ Capable of recovering from the bevel area of hydrophobic wafers ■ Recovery possible from the center, donut area, outer perimeter, and entire surface set at radii r1 and r2 ■ Automatic supply of recovery liquid and suction of recovery liquid after sampling ■ Contaminated chips are automatically cleaned after suctioning the recovery liquid, etc. *For more details, please download the PDF or contact us.

• Other environmental equipment

The "BEM-301" is a device that uses ozone and vaporized fluorine for etching. Etching is performed while monitoring the etching amount, allowing for high-precision etching. Additionally, accurate etching can be achieved even from the first piece. 【Specifications】 ■ Etching rate: 2μm/H or more ■ Flatness: within 10% ■ Accuracy of etching amount (depth): within ±5% ■ Utilities: O2, N2, HF, DIW, cooling water, AC-100V, AC-200V, acid exhaust, acid wastewater ■ External dimensions: 1,000W × 1,300D × 2,000H (mm) ■ Weight: approximately 300Kg *For more details, please download the PDF or contact us.

• Etching Equipment

The NAC-304 is an automatic trace metal contamination recovery device with bulk etching capabilities for Si wafers. It automatically recovers 25 wafers set in a cassette. Recovery after bulk etching can also be performed with automatic settings. 【Features】 ■ Bulk etching is possible in two sizes: 200mm and 300mm, with settings of **.*μm. ■ The flatness of bulk etching is within 10%, and the accuracy of etching depth is within ±10% (for depths of 0.3μm or more); for 200mm wafers, it is within ±20%. ■ It is also possible to perform bulk etching on a single wafer divided into multiple layers, among other features. *For more details, please download the PDF or contact us.

• Other environmental equipment

The "NAC-316" is a fully automated trace metal contaminant recovery device with bulk etching capabilities for Si wafers. Even beginners can obtain analytical results with ICP-MS. Additionally, it has two load ports, significantly improving work efficiency, and inline connection (OHT) is also possible. 【Features】 ■ Capable of recovering both hydrophilic wafers and hydrophobic wafers ■ Automatically performs bulk etching, recovery, and analysis on wafers set in the load port ■ Bulk etching is possible in two sizes: 200mm and 300mm ■ Bulk etching can also be performed in multiple layers on a single wafer, etc. *For more details, please download the PDF or contact us.

• Other environmental equipment