KNE Product Lineup

★ 12-inch wafer processing with ring attachment is possible! ★ Surface modification, removal of inorganic/organic contamination! ★ Ideal for evaluation and research before mass production! ★ High speed, low cost ★ Various optional features ★ Compatible with 300mm wafers and rectangular substrates [Main Performance] - Achievable pressure: 6.0 Pa or lower (when gas ballast is closed) * Uses a dry pump with a maximum exhaust speed of 500 L/min - Leak rate: 1.07 Pa/min or lower * Build-up standard value: Converted to chamber volume as 0.1 Pa·L/sec - RF power control: 13.56 MHz / 100 to 1,000 W - Process gas flow control: Within ±10% of the set value - Etching performance Inorganic etching rate: Average of 20 nm/min or more ±20% Organic etching rate: Average of 500 nm/min or more ±20% Test chips placed at 5 points on a φ300 electrode * Placed at 4 points on the φ280 circumference and 1 point in the center * When using rectangular electrodes [optional], placed at 4 points on the corners of a 300 mm square and 1 point in the center Wide-range auto-tuning

• Wafer
• Other semiconductors
• Other electronic parts

★ High-speed transfer of up to 25,000 UPH! ★ High precision storage of ±0.02mm! (※ Guaranteed precision is ±0.05mm) ★ Damage-free storage ...Gentle suction and storage for fine parts ★ Various optional features ★ Supports multiple types of appearance inspection (2 sides, 6 sides) 1. High-speed transfer with a 16-nozzle head: Up to 25,000 UPH The transfer head is equipped with 16 nozzles that rotate and orbit at high speed, allowing for the transfer of 16 parts in one X-axis movement. In particular, the BITA-2 transfer machine employs a line camera for part posture recognition, enabling movement from the suction area to the storage area without stopping, achieving a maximum takt of 25,000 UPH. 2. High precision enabling high-density storage of fine parts: ±0.02mm (actual value*) High precision vibration control on the XY axis, high precision part posture recognition, and automatic calibration have achieved high precision storage of ±0.02mm (*). This allows for high-density (narrow pitch) storage. (※ Guaranteed value is ±0.05mm) *Pre-evaluation and customization possible with user work!

• Capacitor
• Other electronic parts
• Wafer

★ Increased curing efficiency with UV irradiation in a vacuum environment! ★ Compatible with wafer sizes up to 8 inches! ★ Reduced running costs without the need for nitrogen purging! ★ Ideal for wafer processing in the manufacturing process! - By setting the oxygen concentration to a vacuum environment and applying UV irradiation, curing defects are reduced. - Voids directly under the device are also removed due to the vacuum environment. Oxygen concentration at atmospheric pressure (100,000 Pa) is approximately 20%. Oxygen concentration in the vacuum chamber of this machine (5 Pa) is 0.001%. ◇ Key Performance - Achievable pressure: Below 6.0 Pa (with gas ballast closed) - Leak rate: Below 10.0 Pa/min - Maximum pumping speed: 500 L/min using a dry pump - Build-up standard value: Converted to chamber volume as 1.0 Pa・L/sec - UV irradiation performance: Achieves short-time high-output UV irradiation by adopting high-pressure mercury lamps. Example: Cumulative light amount: 550 mJ/cm² with 27.5 seconds of irradiation. - Process time: 1 process in 60 seconds or less from the start of pumping to the completion of UV irradiation. * Pre-evaluation possible with user work! * Customizable for each user!

• Wafer

The "BITA-2KWD" is a high-speed handler device that picks up and transfers wafering supply components without causing damage. By reducing the adhesive strength of the sheet through UV curing and heating, the device supports the components with the tips of needle-like projections while expanding the sheet and further vacuuming downward to minimize the adhesive strength of the sheet. It is a system that enables high-speed pickup using KNE's rotary head for components supplied in a dicing sheet attached state, such as silicon chips. *Pre-evaluation with user components is possible! *Customization for each user is available for tray/feeder/bulk/loader supply and unloader, etc.! 【Features】 ■High-speed transfer of up to 25,000 UPH ■High precision storage of ±0.02mm ■Soft handling for damage-free storage ■High-speed transfer of wafer chips using the needle unit ■Damage-free handling of components (Due to simple sheet peeling, it does not damage the components) *For more details, please refer to the PDF document or feel free to contact us.

• Other conveying machines
• Transport and handling robots

The "BITA-3" is a high-speed, high-precision full coating device capable of handling a variety of small lot productions. It easily accommodates processes such as step printing and multi-thickness printing required in the manufacturing of multilayer and flexible substrates, simply by setting the data. Additionally, it can also handle thick film printing (with proven examples up to 35μm) in the same manner. Equipped with various features that support production, it includes intuitive and easy-to-use data creation tools, as well as a multiple data combination function that is convenient for switching between models. *Pre-evaluation with user coating materials is possible! *Customization for each user, such as supply, is available! 【Features】 ■ Achieves maskless surface coating ■ Supports production of various small lots ■ On-demand coating (high precision: fast coating exactly where intended) ■ Uniform coating thickness (high quality: thickness control / coating on uneven surfaces) ■ Independent control of 40 nozzles (dot quality: optimized by combinations of height and speed) *For more details, please refer to the PDF document or feel free to contact us.

• Painting Machine
• Other painting machines