五輪パッキング Product Lineup

In semiconductor manufacturing equipment, the heat generation from components such as CPUs and GPUs has increased due to higher performance, making thermal management an important design challenge. Thermal interface materials (TIM) fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or housing. At our company, we provide one-stop solutions from selecting thermal interface materials based on heat generation, gaps, and usage environments, to shaping them according to the installation locations. We offer solutions to thermal challenges for various heat-generating areas, including CPUs, GPUs, VRAM/HBM, VRM/MOSFETs, SSDs, power units, and circuit boards/housings. [Application Scenes] - Cooling of heat-generating components (such as CPUs and GPUs) within semiconductor manufacturing equipment - Temperature management of precision devices - Stable operation and longevity of equipment [Benefits of Implementation] - Suppression of temperature rise in heat-generating components - Maintenance and improvement of equipment performance - Reduction of failure risks

In the electronics industry, flexible responses are required for circuit design and manufacturing, especially in prototyping and small-scale production. Particularly when there is a high frequency of design changes or a need for diverse small-lot production, processing methods that do not require molds are essential. Cutting plotters, controlled by computers, enable the processing of various shapes without molds and support the rapid creation of prototypes and samples. This contributes to shortening development periods and reducing costs. 【Usage Scenarios】 - Prototyping of circuit boards - Creation of protective sheets for electronic components - Circuit components for small-scale production 【Benefits of Implementation】 - Rapid prototyping and sample creation - Reduction of mold costs - Flexible response to design changes