五輪パッキング Product Lineup

With the advancement of robot performance, the heat generation from components such as CPUs and GPUs in the control unit has increased, making thermal management an important design challenge. Thermal interface materials (TIM) fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or housing. At Olympic Packing, we provide a one-stop solution from selecting thermal interface materials based on heat generation, gaps, and usage environments to shape processing tailored to the installation locations, offering solutions to thermal issues in robot control units. 【Application Scenarios】 - Heat-generating areas of robot control boards (CPU, GPU, memory, etc.) - Motor drive units and power supply units - Thermal management for sensors - Suppression of temperature rise inside the housing 【Benefits of Implementation】 - Stable operation of the control unit - Extended lifespan of components - Maintenance and improvement of robot performance - Increased design flexibility

In gaming PCs, as the performance of CPUs and GPUs increases, the amount of heat generated also rises, making thermal management an important design challenge. Thermal interface materials (TIM) fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or chassis. Our Olympic packing service provides a one-stop solution, from selecting the appropriate thermal interface material based on heat generation, gaps, and usage environment, to shaping it to fit the installation locations. 【Usage Scenarios】 - Heat-generating areas of gaming PC CPUs, GPUs, VRAM/HBM, VRM, and MOSFETs - Cooling for SSDs, power units, circuit boards, and chassis - Maintaining performance under high loads 【Benefits of Implementation】 - Suppression of temperature rise in heat-generating components - Improved cooling efficiency for the entire PC - Realization of a stable gaming environment

In the broadcasting and video industry, as devices become more high-performance, the heat generation from components such as CPUs and GPUs has increased, making thermal management an important design challenge. Thermal interface materials (TIM) fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or enclosure. Olin Packing provides one-stop solutions, from selecting thermal interface materials based on heat generation, gaps, and usage environments, to shaping them to fit specific installation locations. We offer solutions for thermal challenges in various heat-generating areas, including CPUs, GPUs, VRAM/HBM, VRM/MOSFETs, SSDs, power supplies, and circuit boards/enclosures. [Usage Scenarios] - Cooling for high-performance video editing equipment - Thermal management for broadcast cameras - Temperature management within server racks [Benefits of Implementation] - Contributes to stable operation of equipment - Maintains performance - Reduces risk of failure

In the inverter of the power and energy industry, the increase in performance has led to a rise in heat generation, making efficient thermal management a crucial design challenge. In cooling inverters, filling the tiny gaps between heat-generating components and heat sinks, as well as selecting and processing thermal interface materials (TIM) that efficiently conduct heat, are essential for maintaining product reliability. Inadequate thermal management can lead to decreased performance or failure of the inverter. At Gorin Packing, we offer a one-stop solution from selecting thermal interface materials based on heat generation, gaps, and usage environments to shape processing tailored to the installation locations, addressing the thermal challenges of inverters. 【Application Scenarios】 - Cooling of heat-generating areas such as CPUs, GPUs, and power supply units in inverters - Ensuring stable heat dissipation performance in high-power environments - Supporting miniaturization and high-density mounting of devices 【Benefits of Implementation】 - Improved cooling efficiency of inverters - Enhanced product reliability and durability - Streamlined design and manufacturing processes

In industrial equipment control panels, the temperature rise due to heat generation from internal electronic components can lead to malfunctions and reduced lifespan. Particularly in environments that require high-density mounting and continuous operation, efficient heat dissipation measures become crucial. Properly expelling heat from within the control panel and maintaining a stable operating environment are essential for improving the overall reliability of the equipment. Our company supports the resolution of thermal issues by selecting and processing optimal heat dissipation sheets tailored to the heat generation points and the structure of the control panel. 【Usage Scenarios】 - Heat generation points such as CPUs, power units, and motor drive sections within control panels - Improving heat dissipation efficiency in limited spaces - Ensuring stable operation and extending the lifespan of equipment 【Benefits of Implementation】 - Suppression of temperature rise within control panels - Enhanced reliability of electronic components - Stable operation of equipment and reduced maintenance costs

In the field of aerospace electronics, the increase in performance has led to a rise in heat generation, making thermal management an important design challenge. Thermal interface materials (TIM) are used to fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or enclosure. At Gorin Packing, we provide a one-stop solution from selecting thermal interface materials based on heat generation, gaps, and usage environments to shaping them according to the installation locations. We offer solutions for thermal challenges in various heat-generating areas such as CPUs, GPUs, VRAM/HBM, VRM/MOSFETs, SSDs, power units, and circuit boards/enclosures. 【Application Scenarios】 - Cooling of high-performance computing devices - Thermal management of space equipment - Temperature control of avionics electronic devices 【Benefits of Implementation】 - Contributes to stable operation of devices - Supports the longevity of components - Enhances reliability

In medical devices, particularly imaging diagnostic equipment, temperature management of heat-generating components due to increased performance is directly linked to the stable operation of the device and diagnostic accuracy. Thermal interface materials (TIM), which effectively fill the fine gaps between heat-generating components such as CPUs and GPUs and cooling mechanisms (like heat sinks), are essential for maintaining the reliability of the equipment. Inadequate thermal management increases the risk of device overheating, performance degradation, and ultimately misdiagnosis. At Gorin Packing, we provide consistent support from selecting the optimal thermal interface material, considering factors such as the heat generation of your device, gaps, and usage environment, to precise shape processing tailored to the installation locations. 【Application Scenarios】 - Cooling of heat-generating areas such as CPUs, GPUs, and power units within imaging diagnostic equipment - Optimization of thermal design due to miniaturization and high-density mounting of devices - Ensuring stable operation and longevity of the equipment 【Benefits of Implementation】 - Stable operation of the device by suppressing temperature rise of heat-generating components - Maintenance and improvement of diagnostic accuracy - Enhanced reliability of the device and reduced maintenance costs

In the automotive industry, the increase in heat generation has become a challenge due to the enhanced performance of in-vehicle ECUs. Since ECUs are essential for vehicle control, thermal management to maintain stable operation is crucial. Thermal interface materials fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to suppress temperature rise in ECUs and contribute to reliability. Our company offers one-stop support from selecting thermal interface materials tailored to customer needs to shape processing according to installation locations, assisting in solving thermal issues for in-vehicle ECUs. 【Usage Scenarios】 - Cooling of heat-generating components inside in-vehicle ECUs (such as CPUs and memory) - Efficient heat conduction in limited spaces - Response to vibrations and temperature changes 【Benefits of Implementation】 - Improved stable operation and reliability of ECUs - Extended product lifespan - Optimization of thermal design

In semiconductor manufacturing equipment, the heat generation from components such as CPUs and GPUs has increased due to higher performance, making thermal management an important design challenge. Thermal interface materials (TIM) fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or housing. At our company, we provide one-stop solutions from selecting thermal interface materials based on heat generation, gaps, and usage environments, to shaping them according to the installation locations. We offer solutions to thermal challenges for various heat-generating areas, including CPUs, GPUs, VRAM/HBM, VRM/MOSFETs, SSDs, power units, and circuit boards/housings. [Application Scenes] - Cooling of heat-generating components (such as CPUs and GPUs) within semiconductor manufacturing equipment - Temperature management of precision devices - Stable operation and longevity of equipment [Benefits of Implementation] - Suppression of temperature rise in heat-generating components - Maintenance and improvement of equipment performance - Reduction of failure risks

In the AI/HPC field, the increase in heat generation due to the enhancement of high-performance components like GPUs has become a significant challenge in data center operations. Efficient thermal management is essential for the stable operation and performance maintenance of these devices. Thermal interface materials fill the tiny gaps between heat-generating components and cooling mechanisms, effectively transferring heat. Our company provides comprehensive support for addressing thermal challenges in GPU cooling, from selecting the optimal thermal interface material to shape processing suitable for implementation, and from prototyping to mass production supply. 【Usage Scenarios】 - GPU cooling for AI servers - High-density implementation in HPC clusters - Heat management for high-performance computing devices 【Benefits of Implementation】 - Stable operation and performance maintenance of GPUs - Improved reliability of equipment - Enhanced operational efficiency of data centers

In the telecommunications industry, particularly in base stations, the increase in heat generation due to enhanced performance has become a significant challenge for the stable operation of equipment. Inadequate thermal management can lead to performance degradation or failure of the equipment. Our thermal dissipation sheet processing addresses these thermal issues with a one-stop solution, from material selection to shape processing and mass production supply, contributing to the improvement of equipment reliability. 【Usage Scenarios】 - Cooling of heat-generating components such as CPUs, GPUs, and power supply units in base station equipment - Stable operation of equipment in harsh outdoor environments - Optimization of thermal design due to miniaturization and high density of equipment 【Benefits of Implementation】 - Achieving stable operation by preventing equipment overheating - Reducing failure risks and maintenance costs - Extending equipment lifespan and improving reliability

In the IT infrastructure industry, particularly in server cooling, addressing the increased heat generation from high-performance components such as CPUs and GPUs has become a crucial design challenge. Thermal interface materials (TIM), which fill the tiny gaps between these heat-generating parts and heat sinks to efficiently transfer heat, are essential for the stable operation of servers. At Olympic Packing, we provide a one-stop solution from selecting the appropriate thermal interface material based on heat generation, gap size, and usage environment, to custom shaping for specific installation locations, helping to solve thermal challenges in data centers. 【Usage Scenarios】 - AI servers, high-performance server CPUs and GPUs - VRAM/HBM, VRM, MOSFETs - SSDs, power units - Circuit boards, enclosures 【Benefits of Implementation】 - Suppression of temperature rise in heat-generating components - Stable operation and performance maintenance of servers - Increased efficiency in thermal design

With the increasing performance of AI servers and high-performance servers, the heat generation from components such as CPUs and GPUs has risen, making thermal management an important design challenge. Thermal interface materials (TIM) fill the tiny gaps between heat-generating components and heat sinks, efficiently transferring heat to the heat sink or enclosure. At our company, we provide one-stop solutions from selecting thermal interface materials based on heat generation, gaps, and usage environments, to shape processing tailored to the installation locations. We offer solutions for thermal challenges in various heat-generating areas, including CPUs, GPUs, VRAM/HBM, VRM/MOSFETs, SSDs, power units, and circuit boards/enclosures.

Plotter processing is one of the machining methods that does not require molds and is controlled by a computer. Shapes can be drawn on a computer, and an appropriate cutter blade (tool) is selected. The selected cutter blade then automatically processes the specified shape. Our company mainly uses this method for creating small lot prototypes and samples. Since it does not require molds, we can also accommodate short delivery times. 【Cutter blades used by our company】 ■ Henshin cutter ■ Tangential cutter ■ Reciprocating cutter *For more details, please download the PDF or feel free to contact us.