ブリマテック List of Products and Services

I would like to introduce the process of "scoring." After forming the scribe line that triggers the scoring, cracks are propagated along the scribe line to create pieces, and tape is expanded to prevent contact between adjacent pieces. Please feel free to contact us when you need assistance. 【Process】 1. Scribing process 2. Breaking process 3. Expanding *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract

Let me introduce the features of "cutting." In terms of productivity, it has the potential to increase the number of products handled and shorten the takt time and delivery deadlines. Additionally, regarding product quality, it has the potential to improve product defects and eliminates defects caused by thermal history. 【Features】 ■ Completely dry processing ■ No car flows ■ High-speed processing ■ Reduced chipping ■ Reduced burrs on metal films ■ No thermal effects *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

"Splitting" refers to one of the cutting processes. After scoring the glass with a glass cutter, it is separated by hand with a snap. This is "splitting." Our company performs this "splitting" with high precision using machinery. Please feel free to contact us when you need our services. 【Features】 ■ Completely dry processing ■ No car-frost ■ High-speed processing ■ Reduced chipping ■ Reduced burrs on metal films ■ No thermal effects *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

This document explains "splitting," which is one of the cutting processes. It introduces features, differences from conventional methods, our main equipment, and the materials that can be processed. Additionally, we have included photos as examples of processing for each material, so please take a moment to read through it. 【Contents (partial)】 ■ Company Introduction ■ What is "Splitting"? ■ Features of "Splitting" ■ Process of "Splitting" *For more details, please refer to the PDF document or feel free to contact us.

• Other services

"Scribe & Break" is a method for efficiently cutting materials such as glass, ceramics, and semiconductors. By utilizing the characteristics of materials that are hard and brittle, and taking advantage of crack propagation, it achieves a quality that differs from conventional processing techniques. If you have challenges with your current processing or want to change the quality, please feel free to contact us. 【Features】 ■ Completely dry processing ■ No kerf loss ■ High-speed processing ■ Reduced chipping ■ Reduced burrs on metal films ■ No thermal effects *For more details, please download the PDF or feel free to contact us.

• Processing Contract