Electronic Components and Semiconductors

スパッタコア

addressOsaka/Yodogawa-ku, Osaka-shi/Room 707, 2nd Shin-Osaka Building, 6-3-32 Nishi-Nakajima
phone06-6732-9818
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スパッタコア List of Products and Services

1～32 item / All 32 items

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Iron (Fe) target

99.9% pure iron (Fe) material used for thin film formation, superconducting materials, and heat-resistant and corrosion-resistant applications!

■ Purity: 99.9% ~ 99.999% ■ Density (16.6 g/cm³) ■ Applications 　 Thin film formation; superconducting materials; heat and corrosion resistant applications *For more details, please download the PDF or feel free to contact us.

  • Steel
  • Other metal materials

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Mono (Single) Crystal Silicon (Si) target

Mono-Silicon Target

■Purity>99.99999% ■ Density (2.33/cm ³) *For more details, please download the PDF or feel free to contact us.

  • Other polymer materials

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Polycrystalline silicon (Si) target

Used as components in devices such as CVD equipment, annealing furnaces, and diffusion furnaces! Polycrystalline silicon materials suitable for applications requiring high purity and thermal properties!

■ Purity > 99.9999% ■ Density (2.33/cm³) ■ Manufacturing methods: Melting method and sintering method *For more details, please download the PDF or feel free to contact us.

  • Other polymer materials
  • Composite Materials

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Oxidized nickel (NiO) target

Resistive change memory (RRAM), transparent conductive films (TCO), gas sensors, and nickel oxide materials usable in spintronics!

■ Purity > 99.99% ■ Density (6.67g/cm³) * For more details, please download the PDF or feel free to contact us.

  • stainless
  • Fine Ceramics

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Niobium oxide (Nb2O5) target

Niobium oxide (Nb2O5) target

For more details, please download the PDF or feel free to contact us.

  • Rare metals
  • Other metal materials

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Vanadium oxide (V2O5) target

Vanadium oxide materials available for use in the RF sputtering process essential for the manufacturing of microelectronics components!

■ Purity > 99.9% ■ Density (4.26 g/cm³) ■ Applications Used in the RF sputtering process, which is essential for the manufacturing of microelectronics components. Utilized for thin film deposition in high-definition displays and optical devices, and in fields requiring excellent material quality such as optical coatings and sensor technology. Also used as an oxidation catalyst for sulfur dioxide in the sulfuric acid manufacturing process and as a catalyst for the production of other organic acids. Employed to improve the performance and efficiency of solar cells. *For more details, please download the PDF or feel free to contact us.*

  • Composite Materials
  • Other metal materials

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Titanium dioxide (TiO2) target

Titanium oxide used in semiconductor manufacturing processes, recording media such as HDDs, and thin film formation for flat panel displays!

■ Purity > 99.9% ■ Density (4.49 g/cm³) ■ Manufacturing Method: HIP *For more details, please download the PDF or feel free to contact us.*

  • Other metal materials
  • Composite Materials

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Tin oxide (SnO) target

Used as an electrode, an important material that makes up the screen! As a transparent electrode, it enables touch operation on the screen, as well as for antistatic films and electromagnetic shielding films!

■ Purity > 99.99% ■ Density (7.15/cm³) ■ Manufacturing method: Sintering method, HP method * For more details, please download the PDF or feel free to contact us.

  • Fine Ceramics
  • Composite Materials

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Indium oxide (In2O3) target

Indium oxide materials suitable for use as electrode materials for voltage application in LCDs, organic ELs, plasma displays, and the like.

■Purity > 99.99% ■ Density (7.15/cm³) ■ Manufacturing method: Sintering method, HP method *For more details, please download the PDF or feel free to contact us.*

  • Fine Ceramics
  • Composite Materials

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Aluminum oxide (Al2O3) target

For the manufacturing of insulating films in chip production, as well as the production of other high-performance electronic components, sensors, solar panels, and surface modification of optical devices such as displays!

■ Purity > 99.9% ■ Density (3.95 g/cm³) ■ Manufacturing method: Powder metallurgy *For more details, please download the PDF or feel free to contact us.

  • aluminum
  • Composite Materials

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Nickel-Copper (NiCu) Target

Alloy materials that can be used for semiconductor integrated circuits (VLSI), flat panel displays, optical discs, surface coatings, etc.

■ Purity: 99.9% ■ Density (8.9 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.

  • alloy

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Nickel-chromium (NiCr) target

Nickel-chromium that can be used for thin film formation, microelectronics manufacturing, Low-E films for architectural glass, liquid crystal panels, and recording media!

■ Purity: 99.5% - 99.95% ■ Density (8.4 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.

  • alloy

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Nickel-Vanadium (NiV) Target

Contributing to the manufacturing of integrated circuits (ICs) and the semiconductor and microelectronics industry! Nickel-vanadium materials capable of depositing high-quality thin films.

■ Purity: 99.5% ~ 99.9% ■ Density (8.4 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.

  • alloy

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Tungsten Titanium (W-Ti) Target

Tungsten-titanium materials that can be used as diffusion barriers and adhesives for metal wiring in microchip gate circuits.

■ Purity: 99.95% ■ Density (19.3 g/cm³) ■ Manufacturing Method: Powder metallurgy *For more details, please download the PDF or feel free to contact us.*

  • alloy

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Indium Antimonide (IAO) Target

IAO materials are widely used in anti-static coatings and paints, significantly reducing static electricity accumulation and protecting the safety of equipment and people.

■ Purity > 99.99% ■ Density (7.15/cm³) ■ Manufacturing Method: Sintering method, HP method *For more details, please download the PDF or feel free to contact us.

  • Ceramics
  • Fine Ceramics

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Aluminum Neodymium (Al-Nd) Target

Aluminum neodymium materials suitable for wiring of flat panel displays, magnetic recording media, and magnetic sensors.

■ Purity: 99.95% ■ Density (2.72 g/cm³) ■ Usable AlNd ratios (wt%): 90:10; 94:6; 98:2, etc. ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.*

  • aluminum
  • alloy

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Aluminum Titanium (Al-Ti) Target

Aluminum Titanium (Al-Ti) Target

■Al, Ti ratio tolerance:+/-0.3wt% ■Segment difference possible ■Surface finish<Ra1.6a ■No scars, no broken edges *For more details, please download the PDF or feel free to contact us.

  • aluminum
  • alloy

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Aluminum Silicon (Al-Si) Target [Alloy Target]

In adjustment.

For more details, please download the PDF or feel free to contact us.

  • aluminum
  • Other metal materials

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SiO2 (quartz) ring

SiO2 (quartz) ring

■ Used for etching machine ■ Frosted finish ■ No Black spots on the surface

  • Other metal materials

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C18200(Cu) backing plate

Used as a backing plate, alloy material with hardness ≧ 1/2H!

■ Purity: 99.97% ■ Density (8.9 g/cm³) ■ Manufacturing method: Vacuum melting method *For more details, please download the PDF or feel free to contact us.

  • alloy

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C18150(Cu) backing plate

Used as a backing plate, alloy material with hardness ≧ 1/2H!

■ Purity > 98.0% ■ Density (8.9 g/cm³) ■ Manufacturing method: Vacuum melting method * For more details, please download the PDF or feel free to contact us.

  • alloy

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ITO (90:10; 95:5; 97:3...)Target

Oxides that can be used as transparent electrodes and to control pixels without compromising the visual information of the screen!

■ Each Ratios (90:10; 95:5; 97:3) ■ Manufacturing method: Powder metallurgy *For more details, please download the PDF or feel free to contact us.

  • Ceramics

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Zirconium (Zr) target

Zirconium (Zr) Target Purity>3N5 Hf<0.2wt% In Shipping...

■Export license: Zirconium (Zr) targets are restricted to export from China and are difficult to obtain, but We are always shipping from the application to the permission law. ■Main characteristics: Warp Zirconium (Zr) target is easy to warp and it is hard to fix the sled. ■Guarantee Including warp inspection GDMS 100% inspection of purity *For more details, please download the PDF or feel free to contact us.

  • Other metal materials

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Copper (Cu) target

Copper (Cu) target Purity: 3 N7~6N Crystal 40-80 um C18200 C18150 Handling

■It is often shipped for semiconductor including touch panel ■Planner target Width 2000 mm, length mm Possible ■Rotary target OD176*ID125*3100ｍｍⅬ 　Highest shipment record of 400MT/Y ■We can also produce Backing plate *For more details, please download the PDF or feel free to contact us.

  • Other metal materials

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Titanium Ti Target Purity≧5N5

Titanium Ti Target, Each type purity is possible

■Purity: Each type purity is possible ■Shape: Planner target Rotary target Any abnormal form target ■Titanium alloy target Thin film characteristics such as hardness and conductivity can be adjusted *For more details, please download the PDF or feel free to contact us.

  • Other metal materials

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Nickel (Ni) target Purity>4N5

Nickel (Ni) target Purity2N~4N5

■High Purity 　Using in the semiconductor industry. ■Density 　High density and uniformity ■Nickel alloys are also available 　NiCr, NiTi, NiCu, NiCuTi *For more details, please download the PDF or feel free to contact us.

  • Other metal materials

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Hafnium (Hf) target

Hafnium (Hf) target Purity>4N5

■High-purity Hf target Application in the semiconductor industry GDMS with purity measurement values Under the regulatory environment, strictly follow the laws of each country and apply for a license to export ■ Available for civilian use *For more details, please download the PDF or feel free to contact us.

  • Other metal materials

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Chromium (Cr) target

Chromium (Cr) target Purity>3N8

■Purity: 2N5-3N8 Manufacturing method: HIP ■ High hardness ■ Strong abrasion resistance *For more details, please download the PDF or feel free to contact us.

  • Other metal materials

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Tantalum (Ta) Target

Tantalum (Ta) Target Purity>5N

■Tantalum target materials are often used in PVD and CVD coating processes ■High temperature resistance and strong corrosion resistance ■High density Can be used for high-intensity sputtering, with high film deposition efficiency ■Good conductivity *For more details, please download the PDF or feel free to contact us.

  • Other metal materials

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Tin (Sn) target

Tin (Sn) target　Purity≧4N

■ High purity Purity≧99.99% (4N)　 High purity requirements for materials such as semiconductors and optical films ■ Good conductivity Tin (Sn) has excellent conductivity and is suitable for the production of transparent conductive films such as ITO thin films *For more details, please download the PDF or feel free to contact us.

  • Other metal materials

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Niobium (Nb) target

Niobium (Nb) target　Purity≧3N5

■ Four sides C processing ■ Controllable surface roughness ■ Internal Grain Size can be customized according to customer requirements ■ Configurable Import License ■ Experience in supplying semiconductor companies *For more details, please download the PDF or feel free to contact us.

  • Other metal materials

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Tungsten (W) target

Tungsten (W) target Purity>5N

■High purity semiconductor W Target ■Powder metallurgy method for manufacturing ■Various Tungsten alloy target materials *For more details, please download the PDF or feel free to contact us.

  • Other metal materials

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