日本エンギス Product Lineup

The horizontal grinding machine "EHG-170AV" performs grinding operations while the grinding wheel axis and work axis rotate in opposite directions. The grinding wheel axis also oscillates left and right, enabling high processing efficiency and high precision flatness. By selecting the appropriate grinding wheel, it demonstrates effective power on almost all workpieces, including ceramics, and a wide range of difficult-to-machine materials. 【Specifications】 [EHG-170AV/EHG-250NC] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ180mm / φ250mm ○ Rotational speed: maximum 2,500rpm / maximum 2,000rpm For more details, please contact us or download the catalog.

The compact vertical grinding machine from the "Trinity-Y" series has been born. It is particularly suitable for grinding hard and brittle materials, making it ideal for small lot production and research and development institutions. Furthermore, by combining it with other Trinity-Y models, space-saving can be achieved, allowing for the construction of a highly functional processing system without waste. Additionally, combining it with other Trinity-Y models enables space-saving and the creation of an efficient, high-performance processing system. 【Specifications】 [HVG-200/HVG-250] ○ Maximum workpiece size: equivalent to 6-inch wafer / equivalent to 8-inch wafer ○ Maximum grinding wheel diameter: φ200mm / φ250mm For more details, please contact us or download the catalog.

In power devices such as SiC (silicon carbide) and GaN (gallium nitride), which are expected to see market expansion in the future, cost reduction is an important issue. Among these, we would like to introduce a processing case that achieved cost reduction through a method different from conventional processing processes. [Polishing Results] ■ Surface roughness < 0.5nm (subsequent process CMP) ■ TTV < 2μm / Warp < 10μm ■ Achieved double-sided grinding of SiC by using the high-speed pressure grinding machine 'EJD-6BY' and the fixed grinding stone 'MAD Plate'. *For more details, please refer to the PDF document or feel free to contact us.

The substrates such as SiC (silicon carbide), GaN (gallium nitride), and PCD (sintered diamond), which are expected to expand in the market in the future, are difficult materials to process due to their hard and brittle nature. Among them, we would like to introduce a case study that achieved the polishing of sintered diamond, which is particularly challenging to process. [Polishing Results] ■ Surface roughness < 3nm ■ Processing time 4 hours (processing time with conventional methods 10 hours) ■ By using the high-speed high-pressure polishing machine 'EJW-400HSP' and the fixed grinding stone 'MAD Plate', we achieved a reduction in processing time by 6 hours. *For more details, please refer to the PDF document or feel free to contact us.

The Trinity-Y series "HVG-200-2Axis" is a grinding machine equipped with two processing axes, allowing for both rough and precision finishing on a single work table. Since the workpiece can be mounted in one go, there is no error during attachment and detachment, enabling stable flatness and TTV. It is suitable for grinding hard and brittle materials and is effective for small to medium lot production and research and development. 【Features】 ■ Compact design contributes to space-saving ■ Special specifications can be provided upon request *You can view the product documentation via "PDF Download." Please feel free to contact us with any inquiries.

The EBM-250HC is a device designed and developed for the bonding process of wafers and bonding plates (ceramic plates). It can be used before and after the lapping process to achieve high precision in the thickness, flatness, warpage, and parallelism of the wafers.

The EBM-250HSC is a device designed and developed for the bonding process of wafers and bonding plates (ceramic plates). It can be used before and after the lapping process to achieve high precision in wafer thickness, flatness, warpage, and parallelism.

The Trinity-Y series "HVG-300DSO" is a grinding machine equipped with a two-axis mechanism that allows for both rough and precision grinding on a single work table. Since the workpiece can be mounted in one go, there is no error during attachment and detachment, enabling stable flatness and TTV. With the optional thickness measurement, the actual thickness of the wafer during processing can be measured in real-time, allowing for accurate detection of the endpoint after grinding. [Options] ■ Auto-dress mechanism ■ Thickness measurement system (available in contact and non-contact types) *You can view the product documentation via "PDF Download." Please feel free to contact us for inquiries.