東京電子 Company Profile

Have you ever faced the issue of outgassing preventing you from creating a good vacuum environment, making it difficult to carry out your desired manufacturing and experiments? Outgassing is a major enemy when it comes to creating good vacuum, ultra-high vacuum, and extremely high vacuum. The 0.2% BeCu (beryllium copper alloy) has excellent thermal properties and can suppress outgassing to less than 1/10 compared to conventional SUS, making it an outstanding material that can achieve E-8 Pa in just 6 hours when used in vacuum structural materials like chambers. What exactly is this 0.2% BeCu? What applications does it have? We will introduce all of this. Let’s achieve amazing manufacturing using 0.2% BeCu!

On May 20, 2022, the 2022 Award Ceremony of the Japan Society of Vacuum and Surface Science was held at the University of Tokyo's Koshiba Hall, where our mass gas analysis device received the 2022 Industrial Award for its contribution to quality assurance of automotive devices through the commercialization of the "Fully Sealed Mass Analysis Method." As the automation of vehicles progresses, the role of onboard electronic devices that govern this process has become extremely important. This content pertains to the technology for leak testing and gas analysis to ensure the reliability of sealed devices such as onboard electronic devices or semiconductors, as well as semiconductor wafers.

The Tokyo Electron Online Expo hosted by Tokyo Electron is now open! We are showcasing gas analyzers and new vacuum structural materials. Please feel free to stop by.