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  3. 東芝情報システム
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東芝情報システム

EstablishmentAugust 21, 1962
capital123887Ten thousand
number of employees1631
addressKanagawa/Kawasaki-shi, Kawasaki-ku/1-53 Nisshin-cho (Kowa Kawasaki East Exit Building)
phone044-246-8320
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last updated:Apr 07, 2026
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東芝情報システム List of News Articles

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  • Publication year : 2026

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Invitation to Exhibit at 'Sewer Exhibition 2026 Tokyo'

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We are pleased to announce that we will be exhibiting at the "Sewage Exhibition '26 Tokyo," which will be held at Tokyo Big Sight from August 4 (Tuesday) to August 7 (Friday), 2026. We sincerely invite you to visit us during this opportunity. <Exhibition Overview> Name: Sewage Exhibition '26 Tokyo Dates: August 4 (Tuesday) to August 7 (Friday), 2026, 10:00 AM - 5:00 PM (Opening day from 10:30 AM, last day until 4:00 PM) Venue: Tokyo Big Sight, West Hall, Booth Number AT-210 <Exhibited Products> ■ Non-contact Detection System for Heat, Leakage, and Dryness: VisilantEye A monitoring sensor for facilities and equipment. It detects abnormal temperatures in factories and manufacturing sites, as well as liquid leakage from devices and pipes to the floor without contact. Additionally, it contributes to improved production efficiency, quality enhancement, and energy savings through dryness detection. ■ Liquid Detection Algorithm: Liquidseeker An algorithm (software IP) that utilizes short-wavelength infrared to achieve non-contact liquid detection. By incorporating this IP into a ToF camera that meets the application conditions, it can detect liquid leakage. ■ Water Meter Leakage Detection A system that detects leakage by being installed on water meters set up in households and other locations.

Aug 03, 2026

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Notice of Participation in "EdgeTech+ West 2026"

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We are pleased to announce that we will be exhibiting at "EdgeTech+ West 2026," which will be held at Grand Front Osaka from July 23 (Thursday) to July 24 (Friday), 2026. We sincerely invite you to visit us during this opportunity. <Exhibition Overview> Name: EdgeTech+ West 2026 Dates: July 23 (Thursday) to July 24 (Friday), 2026, 10:00 AM - 5:00 PM Venue: Grand Front Osaka, North Building, B2F, Congre Convention Center, Booth No. A-S24 <Exhibited Products> ■ Energy-efficient Mesh Network We will introduce a facility monitoring solution that easily enables equipment monitoring through battery-powered wireless mesh technology. ■ Embedded Security We will present an integrated security solution for embedded systems, looking ahead to the era of quantum computing. ■ Bluetooth Auracast We will introduce Auracast, the latest technology in Bluetooth, and provide support for the development of Bluetooth products. ■ <Reference Exhibit> AI Utilization and Image Recognition Technology and Applications We will showcase automatic annotation and AI application demos as part of AI utilization and image recognition technology.

Jul 22, 2026

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Notice of Participation in the 'Hokuyou Bank Manufacturing Sustainability Fair'

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We are pleased to announce that we will be exhibiting at the "Hokuyo Bank Manufacturing Sustainability Fair" to be held on July 22, 2026 (Wednesday) at Access Sapporo. We would like to invite you to visit us at this opportunity. <Exhibition Overview> Name: Hokuyo Bank Manufacturing Sustainability Fair Date: July 22, 2026 (Wednesday) Venue: Access Sapporo, Booth Number 86 <Exhibited Products> ■ Energy-saving Wireless Mesh Network NetNucleus LPWA We will introduce a solution that easily realizes the collection and visualization of monitoring data from manufacturing equipment using wireless devices powered by AA batteries. ■ Wind Direction and Speed IoT Sensor anemolink-2D We will showcase a wind direction and speed meter that allows for easy visualization and data collection of wind direction and speed in environments such as semiconductor clean rooms. ■ Liquid Leak Detection Algorithm Liquidseeker We will present a technology that detects liquid leaks non-contact, contributing to reduced maintenance costs by eliminating issues such as disconnection and peeling compared to traditional leak detection tape.

Jul 21, 2026

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東芝情報システム

Invitation to Exhibit at the Monozukuri World Tokyo "Measurement, Inspection, and Sensor Exhibition"

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We are pleased to announce that we will be exhibiting at the "8th Measurement, Inspection, and Sensor Exhibition" to be held at Tokyo Big Sight from July 1 (Wednesday) to July 3 (Friday), 2026. We sincerely invite you to visit us during this opportunity. <Exhibition Overview> Name: 8th Measurement, Inspection, and Sensor Exhibition Dates: July 1 (Wednesday) to July 3 (Friday), 2026, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, South Hall, Booth Number S1-40 <Exhibited Products> ■ Low-power wireless mesh network NetNucleus LPWA ■ Wind direction and speed IoT sensor anemolink-2D ■ Non-contact detection system for heat, water leakage, and dryness VisilantEye ■ Optical inspection technology OneShotBRDF ■ Waveform characteristic evaluation assist tool Waveform insight

Jun 30, 2026

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Invitation to Exhibit at the '2026 YOKOHAMA Automotive Technology Exhibition'

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We are pleased to announce that we will be exhibiting at the "Automotive Technology Exhibition 2026 YOKOHAMA," which will be held at Pacifico Yokohama from May 27 (Wednesday) to May 29 (Friday), 2026. We invite you to visit us during this opportunity. < Exhibition Overview > Name: Automotive Technology Exhibition 2026 YOKOHAMA Dates: May 27 (Wednesday) to May 29 (Friday), 2026, 10:00 AM - 5:00 PM Venue: Pacifico Yokohama Exhibition Hall, Booth Number 193 Registration: [Free] Pre-registration required (you can register from the related link) < Exhibited Products > ■ Self-Localization / SLAM Solutions This technology allows mobile entities such as AGVs to map their surrounding environment while moving and estimate their own position. It observes surrounding features, estimates its own position based on that information, and simultaneously generates an environmental map. ■ Integrated Security for Automobiles Protecting from Finished Vehicles to Manufacturing Processes An integrated security solution that covers everything from finished vehicles to the automotive manufacturing process. It protects both in-vehicle and manufacturing environments with whitelist-based defense, quantum-resistant encryption, and licensing.

Apr 09, 2026

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