テクノメイト Product Lineup

The "FSBL-50" is a pump incorporated into devices designed to spray fluids such as pure water, IPA, and NMP at high pressure to remove films from cleaning targets like wafers. The material of the wetted parts is SUS316, and the check valve features a newly developed poppet valve that ensures a long lifespan without generating metal powder. Additionally, the sealing material in the pressurization section is standardly made of fluoropolymer polyethylene, and it can also accommodate organic solvent specifications such as NMP. 【Features】 ■ Compact design suitable for integration ■ Operation allows control of discharge pressure by varying the air supply pressure ■ Does not use electricity, making it suitable for fire and explosion hazard areas * For more product details, please refer to the "PDF Download" button below. * Feel free to contact us with any inquiries.

The "SSBL-XX series" is a pump suitable for lift-off devices that remove films by high-pressure injection of pure water, IPA, NMP, etc., onto wafers and other surfaces. It can be used in locations where fire and explosion prevention measures are necessary due to its air-driven design. Fluororesin and ultra-high molecular weight polyethylene are used as sealing materials in the pressurization section. O-rings can be selected from FKM specifications or Kalrez specifications. It has been supplied to the market since 2000 for a period of 25 years. 【Features】 ■ Compact design suitable for embedding ■ Operation allows control of discharge pressure by varying air supply pressure ■ Capable of boosting pressure up to 17.6 MPa at an air pressure of 0.5 MPa (SSBL-37.5A) *For more details, please refer to the PDF materials or feel free to contact us.