ADLINKジャパン List of Products and Services

The ADLINK Express-ID7 COM Express Type 7 Basic Size module is characterized by its integration of the Intel Xeon D-1700 processor, combining up to 4x 10G integrated high-speed Ethernet and 16 PCIe Gen4 lanes, enabling instant responsiveness and performance. It features Intel TCC, Deep Learning Boost (VNNI), and AVX-512 technology to optimize and accelerate AI performance, supports Time Sensitive Networking (TSN), and allows for precise control of hard real-time workloads across all network devices.

The ADLINK LEC-MKT-I1200 is a SMARC module equipped with the MediaTek MT8395 SoC, which features four Arm Cortex-A78 cores, four Cortex-A55 cores, and up to 5 TOPS APU. This module incorporates a series of IoT technologies, including on-device artificial intelligence (AI) capabilities and support for up to three cameras, while achieving a low power envelope, making it an ideal solution for robotic and drone applications across various fields such as consumer, enterprise, defense, industrial, and logistics.

The ADLINK Express-RLP COM Express Type 6 basic size module is the first COM Express based on the 13th generation Intel Core mobile processor, utilizing Intel's advanced hybrid architecture (with up to 6 performance cores and 8 efficient cores) offered with industrial options, providing excellent performance for edge IoT innovation across a variety of power ranges (TDP 15W/28W/45W). This module supports PCIe 4.0 and DDR5 memory with speeds of up to 4800 MT/s, as well as 4 displays via DDI/LVDS or USB4/TBT4, and features integrated Intel Iris Xe graphics with up to 96 execution units, enabling on-device AI performance instantly.

ADLINK's COM-HPC-cRLS COM-HPC client type size C module is based on the 13th generation Intel Core desktop processor. It features Intel's advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) and 16 PCIe Gen5 lanes, delivering superior performance with fewer lanes than before, thereby simplifying design and reducing time to market, making it possible to promote various AIoT deployments. This module supports up to 128GB of DDR5 memory at a maximum speed of 3200MT/s, and combines increased cache, 2.5GbE LAN, and AI inference capabilities, making it an ideal product for cutting-edge AI use cases.

The I-Pi SMARC IMX8M Plus is a SMARC-based smart solution development kit equipped with the NXP i.MX8M Plus (Quad-core Arm Cortex-A53) processor and an NPU (Neural Processing Unit) capable of up to 2.3 TOPS. This product is the first in a series of highly reliable SMARC R2.1 development kits focused on machine learning, vision, advanced multimedia, and industrial IoT. Therefore, it supports dual image processors and two camera inputs, enabling an effective Vision System, while also accommodating future applications such as smart homes, building cities, and Industry 4.0.

The I-Pi SMARC RB5 is a SMARC-based AIoT and robotics development kit that leverages the ADLINK LEC-RB5, powered by the Qualcomm QRB5165 SoC featuring a Qualcomm Kyro 585 octa-core CPU (8x Arm Cortex-A77) and Qualcomm AI Engine. Supporting up to six MIPI-CSI cameras and achieving 15 TOPS, the I-Pi SMARC RB5 is an ideal DevKit for implementing AI-centric robotics and drone applications in various fields such as consumer, enterprise, defense, industrial, and logistics.

The I-Pi SMARC 1200 is a SMARC-based AI and graphics-centric solution development kit equipped with the MediaTek Genio 1200 (octa-core Arm Cortex-A78 x4 + A55 x4) processor, an advanced 5-core Arm Mali-G57 GPU for high-quality 3D graphics, and an integrated APU (AI Processor Unit) system with up to 5 TOPS. This development kit features AI processing capabilities on the device (acceleration for deep learning neural networking, computer vision, etc.), support for multiple 4K displays, and up to three MIPI camera inputs, making it an optimal solution for enabling various next-generation innovations focused on AI, such as advanced smart homes, human-machine interfaces, 4K multimedia applications, and industrial IoT.

The I-Pi SMARC Elkhart Lake is a SMARC-based edge solution development kit equipped with the Intel Atom x6425E quad-core SoC, integrating Intel UHD graphics and comprehensive high-speed interfaces. Additionally, this kit, specialized for development, supports the latest version of the Intel Distribution of OpenVINO toolkit, which features more deep learning models, higher inference performance, and fewer code changes, enabling simpler development than ever before. The I-Pi SMARC Elkhart Lake comes with 4GB LPDDR4 + 64GB eMMC memory and is essential for the development and prototyping of mission-critical, fanless industrial IoT applications, where safety and reliability are always paramount, while supporting low power consumption and a wide temperature range.

The COM Express Type 10 Elkhart Lake is a COM Express Type 10-based edge solution development kit equipped with the Intel Atom x6211E dual-core SoC, which integrates Intel UHD graphics and comprehensive high-speed interfaces. Additionally, this kit, specialized for development, supports the latest version of the Intel Distribution of OpenVINO toolkit, featuring more deep learning models, higher inference performance, and fewer code changes, enabling simpler development than ever before. With 4GB LPDDR4 and 64GB eMMC memory, the COM Express Type 10 Elkhart Lake supports an extended temperature range within a low power envelope, making it a key component essential for the development and prototyping of mission-critical fanless industrial IoT applications where safety and reliability are always paramount.

The COM Express Type 6 Alder Lake-P is a powerful IoT solution development kit based on COM Express Type 6, featuring the Intel 12th generation i5-12600HE 12-core (4 P-cores + 8 E-cores) SoC, integrated with Intel Iris Xe GPU graphics (80 execution units) and comprehensive high-speed interfaces. This kit, focused on performance and power efficiency, incorporates a COM Express module that utilizes Intel's advanced hybrid architecture, leveraging four performance cores for IoT workloads and eight efficient cores for background task management. It provides excellent performance and power per watt, offering high flexibility to enable a wide range of smart edge innovations with a TDP of 35/45W. This module and development kit, equipped with 64GB of memory and integrated Intel Iris Xe graphics with 80 execution units, will be key for the development and prototyping of various industrial IoT applications specialized in graphics and AI.

The ADLINK COM Express Type 7 Basic size module "Express-VR7" is based on the AMD Embedded Ryzen V3000 series processor. With up to 8 cores and 16 threads, and a TDP of 15W/45W, it delivers the best performance per watt in its class, featuring 14 PCIe Gen4 lanes, enterprise-level reliability, and extremely robust temperature options (-40℃ to 85℃). This module offers dual-channel DDR5 memory with ECC at 4800MT/s, equipped with 2x 10G Ethernet and 1x 2.5GB Ethernet, making it ideal for various next-generation network applications at the edge.

The cExpress-MTL, equipped with Intel's latest Intel Core Ultra processor (formerly Meteor Lake-U/H), is a COM Express COM.0 R3.1 Type 6 Compact-sized module that offers Intel's modular architecture integrating CPU, GPU, and NPU to the embedded market. It provides up to 8 GPU Xe cores (128 EU), an NPU with 11pTOPS/8.2eTOPS, and 14 CPU cores with a TDP of 28W. By leveraging skilled GPUs, hardware acceleration for AV1 encoding/decoding, and a dedicated NPU for AI acceleration, as well as upgrading all PCIe signals to Gen4 and supporting USB4 for increased flexibility, the cExpress-MTL effectively simplifies solution designs that would otherwise require additional external processing units.

The cExpress-ASL is a COM Express COM.0 R3.1 Type 6 Compact-sized module that features Intel Atom x7000RE processors (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C processors (x7203C, x7405C, x7809C) with up to 8 cores and 64-bit real-time support (compatible with Intel TCC and TSN). The cExpress-ASL combines soldered memory and extreme temperature options, specifically designed for customers requiring entry-level computing with real-time performance, a balanced cost structure, and extended product lifecycle support for robust edge solutions that operate 24/7.

The ADLINK LEC-ASL is a SMARC module compatible with 2/4/8 core Intel Atom x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) processors (formerly Amston Lake), integrating Intel UHD graphics and high-speed interfaces. The LEC-ASL module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), making it ideal for mission-critical fanless edge computing applications that operate 24/7, thanks to its robust operating temperature range and low power envelope.

The OSM-IMX93 is an OSM R1.1 Size L module equipped with the NXP i.MX93 series processor featuring a dual-core Arm Cortex-A55 and M33. This module, which includes the Arm Ethos U-65 microNPU in the SoC, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX93 module supports LVDS and DSI graphics output, GbE x2 (1 TSN compliant), CAN bus x2, I2S audio codec interface, and USB2 interface, and it offers a product supply for 15 years.

The OSM-IMX8MP is an OSM R1.1 size-L module equipped with the NXP i.MX 8M Plus series processor featuring a 4-core Arm Cortex-A53 and M7, up to 8GB of LPDDR4L memory, and up to 128GB of eMMC storage. This module, which includes an InSoC 2.3 TOPS NPU and Vivante GC7000UL graphics, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX8MP module supports HDMI, LVDS, and DSI graphics outputs, 2x GbE (1 TSN compliant), 2x CAN bus, I2S audio codec interface, USB 3.0 and USB 2.0 interfaces, and MIPI-CSI, with a product supply capability of 15 years.

ADLINK's LEC-IMX95 is a state-of-the-art SMARC revision 2.1 compliant module based on the powerful NXP i.MX95 (Arm Cortex-A55 x6 + Arm Cortex-M7 x1 + Arm Cortex-M33 x1) processor, integrating an ISP and an eIQ Neutron Neural Processing Unit (NPU) that operates at up to 2 TOPS. It features high-performance computing with excellent power efficiency, immersive 3D graphics powered by Arm Mali, an innovative NXP NPU accelerator for machine learning, and capabilities for fast data processing along with safety and security functions.

The ADLINK LEC-ALN is a SMARC module compatible with Intel Core i3 processors (i3-N305, i3-N300) with up to 8 cores, Intel Processor N series (N97, N50), and Intel Atom x7000E processors (x7425E, x7213E, x7211E, formerly Alder Lake-N), integrating Intel UHD graphics and high-speed interfaces. The LEC-ALN module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), and it is also available with a robust operating temperature range and low power envelope, making it ideal for mission-critical fanless edge computing applications that require safety and reliability.

The OSM-MTK510 is an OSM R1.1 Size L module equipped with the advanced MediaTek Genio 510 series processor. It features a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, boasting an excellent MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. It excels in providing edge AI processing with ultra-low power consumption. The OSM-MTK510 supports a variety of graphic outputs including HDMI/DP, eDP, and DSI, and comes with comprehensive connectivity options such as GbE x1, I2S audio codec interface, USB 3.0 x1, and USB 2.0 x2 interfaces, making it versatile and robust. It is equipped with 17x GPIO and guarantees long-term availability with a 10-year product lifecycle.

Combining the power-efficient Intel Core Ultra processor with up to 64GB of LPDDR5 memory in a compact 95x70mm size makes it ideal for high-performance edge applications that are battery-powered and space-constrained, such as medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots. The COM-HPC-mMTL streamlines solution designs that previously required the addition of external processing units by leveraging a powerful GPU, hardware-accelerated AV1 encoding/decoding capabilities, and an integrated NPU dedicated to AI acceleration, while enhancing flexibility with support for 16 PCIe lanes and USB4.

The ADLINK OSM-IMX95 is a compact module compliant with the latest OSM revision 1.2, based on the powerful NXP i.MX95 processor (6x Arm Cortex-A55 + 1x Arm Cortex-M7 + 1x Arm Cortex-M33) and integrates an eIQ Neutron neural processing unit (NPU) that operates with an ISP and up to 2 TOPS. Its dimensions are 45mm x 45mm. It offers high-performance computing with excellent power efficiency, immersive 3D graphics powered by Arm Mali, an innovative NXP NPU accelerator for machine learning, and features for fast data processing and security.

GPUs can enhance the performance of a wide range of workloads, including image processing and analysis, computational acceleration, and artificial intelligence (AI). As the requirements for responsiveness and accuracy in edge systems become more stringent, the combination of CPUs and GPUs is becoming mainstream to achieve optimal efficiency in terms of performance per watt and performance per dollar.

GPUs can enhance the performance of a wide range of workloads, including image processing and analysis, computational acceleration, and artificial intelligence (AI). As the requirements for responsiveness and accuracy in edge systems become more stringent, the combination of CPUs and GPUs is becoming mainstream to achieve optimal efficiency in terms of performance per watt and performance per dollar.

GPUs can enhance the performance of a wide range of workloads, including image processing and analysis, computational acceleration, and artificial intelligence (AI). As the requirements for responsiveness and accuracy in edge systems become more stringent, a combination of CPUs and GPUs is becoming mainstream to achieve optimal efficiency in terms of performance per watt and performance per dollar.

Our 3D-TOF (Time of Flight) sensor measures the amount of reflected near-infrared light using a pulse method and outputs the distance. It can capture distance images (3D) and near-infrared images (2D) without parallax or time delay, and in a state free from ambient light, which is expected to improve recognition accuracy and robustness. For more details, please download the flyer.