ADLINKジャパン Product Lineup

The ADLINK LEC-ASL is a SMARC module compatible with 2/4/8 core Intel Atom x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) processors (formerly Amston Lake), integrating Intel UHD graphics and high-speed interfaces. The LEC-ASL module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), making it ideal for mission-critical fanless edge computing applications that operate 24/7, thanks to its robust operating temperature range and low power envelope.

The OSM-IMX93 is an OSM R1.1 Size L module equipped with the NXP i.MX93 series processor featuring a dual-core Arm Cortex-A55 and M33. This module, which includes the Arm Ethos U-65 microNPU in the SoC, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX93 module supports LVDS and DSI graphics output, GbE x2 (1 TSN compliant), CAN bus x2, I2S audio codec interface, and USB2 interface, and it offers a product supply for 15 years.

The OSM-IMX8MP is an OSM R1.1 size-L module equipped with the NXP i.MX 8M Plus series processor featuring a 4-core Arm Cortex-A53 and M7, up to 8GB of LPDDR4L memory, and up to 128GB of eMMC storage. This module, which includes an InSoC 2.3 TOPS NPU and Vivante GC7000UL graphics, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX8MP module supports HDMI, LVDS, and DSI graphics outputs, 2x GbE (1 TSN compliant), 2x CAN bus, I2S audio codec interface, USB 3.0 and USB 2.0 interfaces, and MIPI-CSI, with a product supply capability of 15 years.

ADLINK's LEC-IMX95 is a state-of-the-art SMARC revision 2.1 compliant module based on the powerful NXP i.MX95 (Arm Cortex-A55 x6 + Arm Cortex-M7 x1 + Arm Cortex-M33 x1) processor, integrating an ISP and an eIQ Neutron Neural Processing Unit (NPU) that operates at up to 2 TOPS. It features high-performance computing with excellent power efficiency, immersive 3D graphics powered by Arm Mali, an innovative NXP NPU accelerator for machine learning, and capabilities for fast data processing along with safety and security functions.

The ADLINK LEC-ALN is a SMARC module compatible with Intel Core i3 processors (i3-N305, i3-N300) with up to 8 cores, Intel Processor N series (N97, N50), and Intel Atom x7000E processors (x7425E, x7213E, x7211E, formerly Alder Lake-N), integrating Intel UHD graphics and high-speed interfaces. The LEC-ALN module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), and it is also available with a robust operating temperature range and low power envelope, making it ideal for mission-critical fanless edge computing applications that require safety and reliability.

The OSM-MTK510 is an OSM R1.1 Size L module equipped with the advanced MediaTek Genio 510 series processor. It features a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, boasting an excellent MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. It excels in providing edge AI processing with ultra-low power consumption. The OSM-MTK510 supports a variety of graphic outputs including HDMI/DP, eDP, and DSI, and comes with comprehensive connectivity options such as GbE x1, I2S audio codec interface, USB 3.0 x1, and USB 2.0 x2 interfaces, making it versatile and robust. It is equipped with 17x GPIO and guarantees long-term availability with a 10-year product lifecycle.

Combining the power-efficient Intel Core Ultra processor with up to 64GB of LPDDR5 memory in a compact 95x70mm size makes it ideal for high-performance edge applications that are battery-powered and space-constrained, such as medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots. The COM-HPC-mMTL streamlines solution designs that previously required the addition of external processing units by leveraging a powerful GPU, hardware-accelerated AV1 encoding/decoding capabilities, and an integrated NPU dedicated to AI acceleration, while enhancing flexibility with support for 16 PCIe lanes and USB4.

The ADLINK OSM-IMX95 is a compact module compliant with the latest OSM revision 1.2, based on the powerful NXP i.MX95 processor (6x Arm Cortex-A55 + 1x Arm Cortex-M7 + 1x Arm Cortex-M33) and integrates an eIQ Neutron neural processing unit (NPU) that operates with an ISP and up to 2 TOPS. Its dimensions are 45mm x 45mm. It offers high-performance computing with excellent power efficiency, immersive 3D graphics powered by Arm Mali, an innovative NXP NPU accelerator for machine learning, and features for fast data processing and security.

GPUs can enhance the performance of a wide range of workloads, including image processing and analysis, computational acceleration, and artificial intelligence (AI). As the requirements for responsiveness and accuracy in edge systems become more stringent, the combination of CPUs and GPUs is becoming mainstream to achieve optimal efficiency in terms of performance per watt and performance per dollar.

GPUs can enhance the performance of a wide range of workloads, including image processing and analysis, computational acceleration, and artificial intelligence (AI). As the requirements for responsiveness and accuracy in edge systems become more stringent, the combination of CPUs and GPUs is becoming mainstream to achieve optimal efficiency in terms of performance per watt and performance per dollar.

GPUs can enhance the performance of a wide range of workloads, including image processing and analysis, computational acceleration, and artificial intelligence (AI). As the requirements for responsiveness and accuracy in edge systems become more stringent, a combination of CPUs and GPUs is becoming mainstream to achieve optimal efficiency in terms of performance per watt and performance per dollar.

Our 3D-TOF (Time of Flight) sensor measures the amount of reflected near-infrared light using a pulse method and outputs the distance. It can capture distance images (3D) and near-infrared images (2D) without parallax or time delay, and in a state free from ambient light, which is expected to improve recognition accuracy and robustness. For more details, please download the flyer.

In the drone industry, flight control systems require real-time capabilities, high processing power, and safety and reliability. In particular, to achieve functions such as stability during flight, accurate positioning, and obstacle avoidance, high-performance processors and robust systems that support them are essential. The LEC-IMX95 SMARC module, equipped with the NXP i.MX95 processor, meets these demands. 【Use Cases】 - Flight control systems for autonomous flying drones - Image processing and control for aerial photography drones - Route optimization and flight control for logistics drones - Real-time data processing for inspection and monitoring drones 【Benefits of Implementation】 - Smoother flight control due to high-performance processors - More advanced autonomous flight through real-time image processing - Extended flight time due to low power consumption - Stable operation due to high reliability and safety

ADLINK's Express-PTL is a next-generation COM Express Type 6 computer-on-module equipped with the Intel Core Ultra Series 3 (Panther Lake-H) processor, achieving a significant leap in performance for edge AI and advanced embedded systems. It features a powerful hybrid CPU architecture with P, E, and low-power LPE cores, supporting up to 128GB of DDR5 memory and IBECC, ensuring high reliability and efficiency. The Express-PTL integrates the next-generation Intel Arc Xe3 GPU, which delivers up to 1.5 times the graphics performance, and an NPU with up to 180 TOPS, enabling fast and efficient AI inference, computer vision, and graphics-intensive workloads within a compact, standard-based COM Express form factor. The Express-PTL supports a rich array of high-speed I/O, including industrial features such as PCIe Gen4, multiple display options, USB4/Thunderbolt capabilities (build options), TSN Ethernet, TPM 2.0, and advanced power management.

The ADLINK SMARC LEC-RB5N module is a Linux microprocessor-based COM. This solution is based on Qualcomm's QRB5165 octa-core CPU, equipped with an integrated NPU that offers up to 15 TOPS of performance, catering to demanding AI tasks. For visual data processing, it features a powerful GPU that supports OpenGL and Vulkan. Additionally, it is equipped with a wide range of video and display interfaces.

ADLINK's LEC-IMX8MM is the first SMARC revision 2.1 compliant module that offers excellent power efficiency, based on the low-power NXP i.MX 8M Mini processor (dual or quad-core Arm Cortex-A53) and integrates Vivante GC NanoUltra graphics to enhance processing capabilities. The LEC-IMX8MM is a cost-effective solution ideal for various general-purpose edge applications and IoT applications.

In the drone industry, flight control systems require real-time performance, high processing power, and safety and reliability. In particular, to achieve functions such as stability during flight, accurate positioning, and obstacle avoidance, high-performance processors and robust supporting systems are essential. By combining the power-efficient Intel Core Ultra processor with up to 64GB of LPDDR5 memory and fitting it into a size of 95x70mm, it is ideal for drone applications. The COM-HPC-mMTL leverages a powerful GPU, hardware-accelerated AV1 encoding/decoding capabilities, and an integrated NPU dedicated to AI acceleration, enhancing flexibility with 16 PCIe lanes and USB4 support, thus streamlining solution designs that previously required the addition of external processing units.

In the drone industry, flight control systems require real-time capabilities, high processing power, and safety and reliability. In particular, to achieve functions such as stability during flight, accurate positioning, and obstacle avoidance, high-performance processors and robust systems that support them are essential. The ADLINK SMARC LEC-RB5N module is a Linux microprocessor-based COM. This solution is based on Qualcomm's QRB5165 octa-core CPU, equipped with an integrated NPU, providing up to 15 TOPS of performance to handle demanding AI tasks. It also features a powerful GPU compatible with OpenGL and Vulkan for processing visual data. Additionally, it comes with a wide range of video and display interfaces.

In the drone industry, flight control systems require real-time performance, high processing capability, as well as safety and reliability. In particular, to achieve functions such as stability during flight, accurate positioning, and obstacle avoidance, high-performance processors and robust systems that support them are essential. The ADLINK LEC-MKT-I1200 is a SMARC module equipped with the MediaTek MT8395 SoC, which features four Arm Cortex-A78 cores, four Cortex-A55 cores, and up to 5 TOPS APU. This module incorporates IoT technologies, including on-device artificial intelligence (AI) capabilities and support for up to three cameras, while achieving a low power consumption envelope.

In the drone industry, flight control systems require real-time performance, high processing power, and safety and reliability. In particular, to achieve functions such as stability during flight, accurate positioning, and obstacle avoidance, high-performance processors and robust systems that support them are essential. The OSM-MTK510 is an OSM R1.1 Size L module equipped with the advanced MediaTek Genio 510 series processor. It features a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, boasting an excellent MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. It excels in providing edge AI processing with ultra-low power consumption. The OSM-MTK510 supports a variety of graphic outputs, including HDMI/DP, eDP, and DSI, and comes with comprehensive connectivity options such as GbE x1, I2S audio codec interface, USB 3.0 x1, and USB 2.0 x2. It is versatile and robust, equipped with 17x GPIO, and guarantees long-term availability with a 10-year supply.

**[Case Study Introduction]** ADLINK's computer-on-module portfolio supports drone startups with a scalable and simple design that accelerates AI performance, reducing time to market for cutting-edge drone platforms. For companies facing challenges in drone design and manufacturing that are not yet prepared to respond, the approach using computer-on-modules can alleviate design complexity while providing the potential for shortened time to market and cost reduction, all while meeting the technical requirements of advanced drones. By downloading this case study, you will gain insights into "Streamlining Drone Design with COM" and "Enhancing AI Workload Performance in Next-Generation Drones with ADLINK's COM," among other topics. We encourage you to download it and read through it.

ADLINK is a global leader in the fields of industrial PCs and edge computing. This guide introduces the latest edge AI platforms, industrial PCs, servers, COM modules, vision systems, and display products that support digital transformation (DX) across a wide range of industries, including manufacturing, transportation, healthcare, and retail. By collaborating with major technology partners such as Intel, NVIDIA, AMD, and NXP, we provide high-performance and highly reliable solutions. Through case studies in AI visual inspection, railway communications, medical devices, and public infrastructure, you can explore our comprehensive product lineup that enables practical applications of edge AI.

The I-Pi SMARC Amston Lake is a SMARC-based edge solution development kit equipped with the power-efficient Intel Atom x7433RE quad-core SoC, integrating 32 EU Intel UHD graphics, deep learning inference capabilities, industrial-grade durability, and comprehensive high-speed interfaces. This kit, specialized for development, simplifies the adoption of AIoT and makes development easier than ever, thanks to support from the latest version of the Intel Distribution of OpenVINO toolkit, which features a dedicated processor, more deep learning models, higher inference performance, and fewer code changes. The I-Pi SMARC Amston Lake, equipped with higher performance, 8GB LPDDR5 memory, and 64GB eMMC storage, becomes an essential key for the development and prototyping of various integrated mission-critical and industrial IoT applications, where safety and reliability are always paramount, by supporting an extended temperature range.

The ADLINK I-Pi OSM IMX95 development kit is an industrial-grade, immediately available platform designed to quickly initiate prototyping and software validation for next-generation edge AI and IoT applications. It is centered around the high-performance NXP i.MX 95 application processor and combines a feature-rich 4-inch reference carrier board with ADLINK's highly efficient 45x45mm OSM-IMX95. This evaluation system, which integrates edge AI and powerful graphics processing capabilities, enables developers to immediately build and benchmark advanced vision analytics, smart automation routines, and deterministic robot control loops after deployment. The standout feature of this development platform is its adoption of the advanced Open Standard Module (OSM) architecture. The OSM module utilizes a soldered Size-L BGA form factor, eliminating mechanical weaknesses, increased weight, and additional costs often associated with traditional board-to-board connectors.

The I-Pi OSM IMX93 is an OSM-based smart solution development kit equipped with the NXP i.MX 93 (dual-core Arm Cortex-A55 & Arm Cortex-M33) processor and the in-SoC Arm Ethos-U65 microNPU (Neural Processing Unit). This is the first OSM R1.1 low-power development kit specifically designed for robust industrial embedded applications that require long life, high MTBF, and strict revision management. With a robust solderable design, compact size, and compatibility with pick-and-place machines, OSM can achieve many of the advantages of custom SBCs without making large engineering investments. This module features the power-efficient NXP i.MX 93 series SoC integrated with the in-SoC Arm Ethos-U65 microNPU, providing unparalleled flexibility, rich connectivity, and high scalability for compact edge applications.

The ADLINK I-Pi OSM-510 development kit is based on the OSM-MTK510 computer-on-module and is designed to accelerate the development and evaluation of next-generation edge AI and embedded applications. Compliant with the compact OSM R1.2 standard, this kit provides a ready-to-use hardware platform that integrates processing power, connectivity, and essential I/O. Developers can quickly set up their systems without the hassle of complex custom board designs. Based on the power-efficient MediaTek Genio 510 AI-enabled SoC, the I-Pi OSM-510 enables efficient on-device inference for vision, multimedia, and intelligent edge workloads. The I-Pi OSM-510 development kit is optimized for rapid prototyping and early proof-of-concept development, helping engineers shorten time to market while maintaining a clear path to production.

This COM Express Type 7 module, equipped with the AMD Embedded Ryzen V3000 (V3C18I) processor, delivers high-performance edge computing with exceptional power efficiency. The 8-core, 16-thread CPU operates at a mere 15W TDP (configurable down to 10W) and supports up to 64GB of 4800 MT/s DDR5 memory (2×32GB), making it ideal for systems with space and power constraints. Designed for network and infrastructure workloads, this module features PCIe Gen4, dual 10GbE Ethernet, and one 2.5GbE Ethernet interface, ensuring low latency and high throughput for edge networking, 5G edge infrastructure, video analytics, intelligent surveillance, and industrial automation applications.