ADLINKジャパン Product Lineup

The ADLINK Express-BD7 computer-on-module, equipped with SEMA Cloud functionality, is a product specialized for Internet of Things (IoT) applications. The Express-BD7 connects traditional industrial devices and other IoT systems to the cloud, allowing it to extract raw data from these devices, determine which data to store locally, and decide which data to send to the cloud for further analysis. These analytical results can provide valuable information for policy-making and create innovative business opportunities.

ADLINK, a manufacturer of embedded computing technology, leads the industry in computational performance, robust design, high availability, and the integration of industrial I/O. In conjunction with the release of our new product, "COM Express Type 7," we are offering our comprehensive catalog for free! We also introduce case studies, so please download it from the link below. 【Catalog Contents】 ● Comprehensive Catalog of COM Modules This comprehensive catalog spans 57 pages and includes company information, IoT solutions, SEMA, SEMA Cloud, high robustness design, and medical-related content, as well as case studies and product introductions. 　＜Case Studies＞ Medical, industrial automation, transportation, infotainment, defense ● COM Express Type 7 Introducing the COM Express Type 7, which supports up to four 10GbE-KR interfaces, ideal for cutting-edge "node servers" required for IoT and Industry 4.0 applications. * For more details, please download from the link below or contact us.

The latest COM Express specification developed by the PICMG COM Express subcommittee, led by ADLINK CTO Jeff Munch, will be released soon! The pinout for COM Express Type 7, which supports up to four 10GbE-KR interfaces, represents one of the significant advancements for the future and is ideal for cutting-edge node servers required for IoT and Industry 4.0 applications. It is also optimal for medical and security applications that demand local virtual systems with numerous cores and large cache capacities. In conjunction with the release of the new product "COM Express Type 7," we are offering ADLINK Japan's comprehensive catalog for free! We are also showcasing case studies, so please download from the link below. *For more details, please download from the link below or contact us.

ADLINK's new COM Express products feature the 6th generation Intel Core i7/i5/i3 processors (codenamed Skylake), the latest Xeon, and Celeron processors. These products equipped with the latest Intel processors adopt cutting-edge 14nm microarchitecture and support ultra HD 4K resolution displays. ADLINK's Express-SL/SLE, which supports SEMA Cloud functionality, is designed specifically for IoT (Internet of Things) applications. The Express-SL/SLE connects existing industrial devices and other IoT systems to the cloud, allowing for the extraction of raw data from these devices and determining which data to store locally and which to send to the cloud for detailed analysis. The results of data analysis can be utilized as valuable information for policy decision-making and the creation of innovative business opportunities.

ADLINK's new Mini-ITX embedded boards and COM Express products feature the 6th generation Intel Core i7/i5/i3 processors (code name Skylake), the latest Xeon, and Celeron processors. These latest Intel processor-equipped products utilize cutting-edge 14nm microarchitecture and support ultra HD 4K resolution displays. ADLINK's cExpress-SL, which supports SEMA Cloud functionality, is a product specialized for IoT (Internet of Things) applications. The cExpress-SL connects existing industrial devices and other IoT systems to the cloud, allowing it to extract raw data from those devices and determine which data to store locally and which data to send to the cloud for detailed analysis. The results of data analysis can be utilized as valuable information for policy decision-making and the creation of innovative business opportunities.

ADLINK's cExpress-BW, a computer-on-module, is equipped with SEMA Cloud functionality and supports IoT applications. The cExpress-BW can connect legacy industrial equipment and other IoT systems to the cloud, allowing it to locally store extracted raw data from these devices and determine which data to send to the cloud for further analysis. These analytical results can provide valuable information for policy decision-making and generate innovative business opportunities.

ADLINK's COM Express modules, the cExpress-BT2, cExpress-BT, and nanoX-BT, comply with the PICMG COM.0 Rev.2.1 Type 2, Type 6, and Type 10 form factors, respectively. They feature typical x86 architecture characteristics, equipped with I/O, up to 3 lanes of PCIe, 2 SATA, and 8 USB ports, offering excellent scalability beneficial for application system design. Furthermore, to ensure reliability and stability, all modules have been verified through international standards for shock and vibration testing, achieving a robust design guaranteed to operate within an extended temperature range of -40°C to +85°C.

The cExpress-R8 is a COM Express COM.0 R3.1 Type 6 Compact module equipped with AMD Ryzen Embedded 8000 series processors (8845HS, 8840U, 8645HS, 8640U), achieving industrial performance across different dimensions. This module, featuring up to 8 "Zen 4" cores (16 threads), integrated AMD RDNA 3 graphics, and an XDNA NPU, delivers up to 39 TOPS of performance, enabling power-efficient AI inference and rapid decision-making in industrial edge environments. The cExpress-R8 supports dual-channel DDR5 memory (non-ECC/ECC options available) of up to 96GB with a speed of 5600 MT/s, providing exceptional responsiveness and performance. It can also drive up to 4 independent displays (DP, eDP, HDMI, LVDS, or VGA), making it ideal for advanced visual applications.

The starter kit consists of a COM Express Type 2 core module with an ATX-sized reference carrier board that provides one PCI Express graphics slot x16, four PCI Express x1 slots, two PCI slots, Serial ATA, SDVO, VGA, LVDS, TV-out, and more. It supports USB 2.0, Gigabit LAN, and Super I/O. All necessary cables are included.

The SMARC is a versatile small form factor computer module targeting applications that require low power, cost-effectiveness, and high performance. It caters to systems that require a more compact solution than PC-oriented form factors. ARM SoCs eliminate the need for chips designed for PC platforms, significantly reducing power consumption and the amount of board space required for power conversion devices and power lines. This enables the use of smaller form factors and promotes the adoption of SMARC-compatible modules in low-power mobile devices. Using this standard, up to 9W of continuous power can be utilized for more demanding applications. 【Features】 ■ Power consumption ranges from 2W to 6W, allowing for passive cooling ■ Reduced wiring requirements 【Usage Scenarios】 Applications in mobile devices, industrial automation, medical technology, inspection and measurement, digital signage, transportation, and more. *For more details, please contact us or download from the link below.

The SMARC ("Smart Mobility ARChitecture") is a definition for a versatile small form factor computer-on-module targeting applications that require low power, cost-effectiveness, and high performance. It also caters to systems that need more compact solutions than PC-oriented form factors. ARM SoCs eliminate the need for chips designed for PC platforms and consume less power, significantly reducing the amount of board space required for power conversion devices and power lines. This enables the use of smaller form factors and promotes the adoption of SMARC-compliant modules in low-power mobile devices. The actual power consumption of SMARC CPU modules typically ranges from 2W to 6W, allowing for passive cooling and reducing the effort and overall costs for subsequent development. By using this standard, up to 9W of continuous power can be utilized for more demanding applications.

ADLINK, a manufacturer of embedded computing technology, leads the industry in computational performance, robust design, high availability, and the integration of industrial I/O. In conjunction with ESEC 2017 (Embedded Systems Development Technology Exhibition), we are offering a comprehensive catalog from ADLINK Japan for free! It also includes an introduction to our new product, COM Express Type 7. Please download it from the link below. 【Catalog Contents】 ● Comprehensive COM Module Catalog This comprehensive catalog spans 68 pages, featuring company information, IoT solutions, SEMA, SEMA Cloud, high robustness design, medical applications, case studies, product introductions, and more. <Case Studies> Medical, industrial automation, transportation, infotainment, defense ● COM Express Type 7 We introduce the COM Express Type 7, which supports up to four 10GbE-KR interfaces, making it ideal for cutting-edge "node-server" applications required in IoT and Industry 4.0. * For more details, please download from the link below or contact us.

The Type 6 Starter Kit Plus consists of a COM Express Type 6 module equipped with an ATX-sized Type 6 reference carrier board. It features a dedicated PCI Express x16 slot for a DDI adapter card that converts DDI signals to DP or HDMI signals, one PCI Express x4 slot for graphics, three PCI Express x1 slots, Serial ATA, VGA, LVDS, USB 3.0/2.0, Gigabit LAN, and Super I/O. All necessary cables are included.

The ADLINK Express-CF / CFE computer-on-module, equipped with SEMA functionality, is designed for Internet of Things (IoT) applications. The Express-CF / CFE connects legacy industrial devices and other IoT systems to the cloud, allowing for the extraction of raw data from these devices and determining which data to store locally and which data to send to the cloud for future analysis. These analytical results can provide valuable information for policy-making and create innovative business opportunities.

In embedded devices, there is a growing demand for GPU acceleration across various applications such as industrial image processing, high-resolution multi-display, and AI. This white paper explains the optimal solutions for these needs. 【Catalog Contents】 ● Systems and boards compatible with MXM ● Systems and boards compatible with PEG ● Q&A ● Product specifications 　＜Case Studies＞ In various fields such as clinical diagnostic imaging devices, image processing radars for aerospace and defense, rugged military laptops, and gaming slot machines, industries require high resolution, multi-display capabilities, parallel computing, and AI. *For more details, please download from the link below or contact us.

Edge Computing Platform for Realizing Decision-Making from Data 【Catalog Contents】 ● Realizing the Factory of the Future ● From Data to Decision-Making ● Edge IoT Smart Manufacturing Solutions ● Controlling Data Flow with Edge IoT ● Real-Time Collection and Management of Legacy Equipment Data ● Equipment Condition Monitoring and Predictive Maintenance ● AI-Compatible Machine Vision ● Selection Guide *For more details, please download from below or contact us.*

Edge Computing Platform for Realizing Decision-Making from Data 【Catalog Contents】 ● Realizing the Factory of the Future ● From Data to Decision-Making ● Edge IoT Smart Manufacturing Solutions ● Manipulating Data Flow with Edge IoT ● Real-Time Collection and Management of Legacy Equipment Data ● Equipment Condition Monitoring and Predictive Maintenance ● AI-Enabled Machine Vision ● Selection Guide *For more details, please download from below or contact us.*

The cExpress-AR, equipped with the new AMD Ryzen V2000 APU and high-performance integrated Radeon graphics, is the first Type 6 module in the market to support up to 16 threads of octa-core (8 cores) embedded SoC, achieving significant turbo boost up to 4.2 GHz. Compared to the previous embedded quad-core V1000 processor, the combination of additional cores and AMD's Zen 2 architecture has more than doubled performance and improved efficiency per watt by twofold. ADLINK's cExpress-AR standardly supports up to 64GB of DDR4 with two SO-DIMM slots. It offers ECC error correction and configurable TDP (up to 10W) based on the selected SKU, while providing 6 to 8 cores and passive cooling, making it suitable for mission-critical applications in harsh environments.

The ADLINK cExpress-EL supports the next-generation Intel Atom x6000 processor (Elkhart Lake) combined with Intel UHD graphics in a low-power envelope and high-speed interfaces. The cExpress-EL module supports up to 32GB of in-band ECC dual-channel DDR4 memory and is available in a robust operating temperature range and low-power envelope, making it ideal for mission-critical fanless edge computing applications that always require safety and reliability.

ADLINK's cExpress-TL is based on the 11th generation Intel Core i7/i5/i3 and Celeron processors, and is the first COMExpress module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of the previous generation. Notably, it supports 2.5GbE Ethernet and, when leveraging the existing Cat5e cable infrastructure used for 1GbE Ethernet, can support four USB 3.2 ports with transfer speeds of up to 10Gb/s. The module's power range can be configured from 15 to 28 watts, making it suitable for embedded applications with space constraints that require fanless operation. Typical industries that require such high-performance/low-power characteristics include transportation, healthcare, industrial automation and control, edge controllers, robotics, and multi-camera-based AI.

The nanoX-AL is a COM Express COM.0 R2.1 Type 10 module compatible with the Intel Atom Processor E3900 series SoC. The nanoX-AL is designed for customers seeking a low-power, long-life solution that emphasizes optimized processing capabilities and graphic performance. The nanoX-AL features a dual/quad-core Intel Atom Processor E3900 series and supports non-ECC type DDR3L single-channel or dual-channel memory at 1600/1867 MHz, offering exceptionally excellent overall performance. The integrated Intel 9th generation LP graphics include support for OpenGL 4.3, DirectX 12, OpenCL 2.0, and hardware decoding for H.265/HEVC, H.264, MPEG2, VC1, VP9, MVC, and JPEG/MJPEG.

The ADLINK LEC-IMX8MP is the first module compliant with SMARC revision 2.1, based on the powerful NXP i.MX8M Plus (quad-core Arm Cortex-A53) processor equipped with an optional neural processing unit (NPU) that operates at up to 2.3 TOPS, focusing on industrial IoT with machine learning and vision, advanced multimedia, and high reliability. Additionally, it supports dual image signal processors and two camera inputs, enabling an effective vision system. The LEC-IMX8MP is suitable for applications such as smart homes, buildings, cities, and Industry 4.0.

The Express-CFR is a COMExpress COM.0R3.0 basic size Type 6 module that supports hexacore (6-core) 64-bit 9th generation Intel Core and Xeon processors (codename "Coffeelake Refresh-H"). It is equipped with Mobile Intel QM370, HM370, and CM246 chipsets. The Express-CFR features up to three SODIMM sockets that support a maximum of 96GB of DDR4 memory (with two on the top by default and one on the bottom as a build option). It fully complies with the mechanical specifications of PICMG COM.0. Modules with Xeon processors and the CM246 chipset support both ECC SODIMM and non-ECC SODIMM.

The CM5-P1000 PCIe104 module is a compact and slim graphics module solution compliant with the PCI/104-Express & PCIe/104 version 3.0 specifications, providing the benefits of the latest and most advanced GPUs for embedded systems. Its excellent graphics performance, GPU computing, and video capabilities make it an ideal solution for systems that require performance, such as digital signage, medical imaging, defense, and aerospace applications.

The ADLINK Express-TL COM Express Type 6 Basic size module is based on the 11th generation Intel Core, Xeon W, and Celeron 6000 processors, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With 8 cores, 16 threads, and up to 128GB of memory, the Express-TL delivers uncompromising system performance and responsiveness for your solutions. The Express-TL features 12th generation Intel Iris Xe graphics and Intel AVX-512 Vector Neural Network Instructions (VNNI), achieving three times the AI inference performance compared to previous generation platforms without VNNI.

ADLINK's "COM-HPC-ALT" is the world's first 80-core COM-HPC server-type module. Based on the Ampere Altra SoC, which utilizes the Arm Neoverse N1 architecture, it features up to 80 Arm v8.2 64-bit cores running at 2.8GHz, with a TDP of just 175 watts. The COM-HPC Ampere Altra, which adopts an architecture with excellent performance per watt, is suitable for massive data processing at the edge without requiring significant initial investment or ongoing maintenance costs. The COM-HPC-ALT has been certified as compliant with the Arm SystemReady program, supporting common operating systems and subsequent software layers, ensuring a seamless user experience. When combined with the open-source EDKII project, this module supports operating systems such as CentOS, Ubuntu, and Yocto Linux.

The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom x6000 series processors (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE), Intel Pentium, and Celeron N/J series processors (formerly codenamed Elkhart Lake), and features a high-speed interface with integrated Intel UHD graphics. The nanoX-EL module supports up to 16GB of in-band ECC LPDDR4 memory and is designed for robust operating temperature ranges and low power consumption, making it ideal for mission-critical fanless edge computing applications where safety and reliability are always required.

The ADLINK LEC-EL is a SMARC module that supports the Intel Atom x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processor (formerly Elkhart Lake) with integrated Intel UHD graphics and high-speed interfaces. The LEC-EL module supports up to 8GB of LPDDR4 memory and is designed to meet strict operating temperature ranges and low power consumption envelopes, making it an ideal product for mission-critical fanless edge computing applications where safety and reliability are always required.

GPUs can enhance the performance of various workloads such as image processing and analysis, compute acceleration, and artificial intelligence (AI). As the demands for responsiveness and accuracy in edge systems increase, the combination of CPUs and GPUs is becoming mainstream to optimally streamline performance per watt and per dollar.

GPUs can enhance the performance of various workloads such as image processing and analysis, compute acceleration, and artificial intelligence (AI). As the demands for responsiveness and accuracy in edge systems increase, the combination of CPUs and GPUs is becoming mainstream to optimally optimize performance per watt and per dollar.

GPUs can enhance the performance of various workloads such as image processing and analysis, compute acceleration, and artificial intelligence (AI). As the demands for responsiveness and accuracy in edge systems increase, the combination of CPUs and GPUs is becoming mainstream to optimally streamline performance per watt or per dollar.

The ADLINK LEC-RB5 is a SMARC module that features the Qualcomm QRB5165 SoC, equipped with eight Arm Cortex-A77 cores and a Qualcomm Hexagon Tensor Accelerator with up to 15 TOPS. This module is designed for applications in robotics and drones, integrating multiple IoT technologies into a single solution. The LEC-RB5 SMARC module provides artificial intelligence (AI) capabilities on-device, supports up to six cameras, and offers low power consumption. It can power robots and drones in consumer, enterprise, defense, industrial, and logistics sectors.

The ADLINK Express-ADP COM Express Type 6 basic size module is the first COM Express module to support an advanced hybrid architecture based on the 12th generation Intel Core processors, featuring up to 6 performance cores (P-core) for IoT workloads and up to 8 efficient cores (E-core) for background task management, promoting productivity and IoT innovation across a wide range of deployments. This module provides support that combines PCIe 4.0 with increased DDR5 memory and cache of up to 4800MT/s, as well as security and manageability features, AI capabilities for intelligent workload optimization, and enhancements in graphics, AI, computer vision, peripheral connectivity, and high-speed memory access.

GPUs can enhance the performance of various workloads such as image processing and analysis, compute acceleration, and artificial intelligence (AI). As the demands for responsiveness and accuracy in edge systems increase, the combination of CPUs and GPUs is becoming mainstream to optimally optimize performance per watt or dollar.

The ADLINK COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel Xeon D-2700 processor, combining up to 8 x 10G or 4 x 25G integrated high-speed Ethernet and 32 PCIe Gen4 lanes, equipped with the capability to respond instantly and deliver performance. It features Intel TCC for optimal AI performance acceleration, Deep Learning Boost (VNNI), AVX-512 technology, and supports Time Sensitive Networking (TSN), enabling precise control of hard real-time workloads across all network devices.

The ADLINK Express-ID7 COM Express Type 7 Basic Size module is characterized by its integration of the Intel Xeon D-1700 processor, combining up to 4x 10G integrated high-speed Ethernet and 16 PCIe Gen4 lanes, enabling instant responsiveness and performance. It features Intel TCC, Deep Learning Boost (VNNI), and AVX-512 technology to optimize and accelerate AI performance, supports Time Sensitive Networking (TSN), and allows for precise control of hard real-time workloads across all network devices.

The ADLINK LEC-MKT-I1200 is a SMARC module equipped with the MediaTek MT8395 SoC, which features four Arm Cortex-A78 cores, four Cortex-A55 cores, and up to 5 TOPS APU. This module incorporates a series of IoT technologies, including on-device artificial intelligence (AI) capabilities and support for up to three cameras, while achieving a low power envelope, making it an ideal solution for robotic and drone applications across various fields such as consumer, enterprise, defense, industrial, and logistics.

The ADLINK Express-RLP COM Express Type 6 basic size module is the first COM Express based on the 13th generation Intel Core mobile processor, utilizing Intel's advanced hybrid architecture (with up to 6 performance cores and 8 efficient cores) offered with industrial options, providing excellent performance for edge IoT innovation across a variety of power ranges (TDP 15W/28W/45W). This module supports PCIe 4.0 and DDR5 memory with speeds of up to 4800 MT/s, as well as 4 displays via DDI/LVDS or USB4/TBT4, and features integrated Intel Iris Xe graphics with up to 96 execution units, enabling on-device AI performance instantly.

ADLINK's COM-HPC-cRLS COM-HPC client type size C module is based on the 13th generation Intel Core desktop processor. It features Intel's advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) and 16 PCIe Gen5 lanes, delivering superior performance with fewer lanes than before, thereby simplifying design and reducing time to market, making it possible to promote various AIoT deployments. This module supports up to 128GB of DDR5 memory at a maximum speed of 3200MT/s, and combines increased cache, 2.5GbE LAN, and AI inference capabilities, making it an ideal product for cutting-edge AI use cases.

The I-Pi SMARC IMX8M Plus is a SMARC-based smart solution development kit equipped with the NXP i.MX8M Plus (Quad-core Arm Cortex-A53) processor and an NPU (Neural Processing Unit) capable of up to 2.3 TOPS. This product is the first in a series of highly reliable SMARC R2.1 development kits focused on machine learning, vision, advanced multimedia, and industrial IoT. Therefore, it supports dual image processors and two camera inputs, enabling an effective Vision System, while also accommodating future applications such as smart homes, building cities, and Industry 4.0.

The I-Pi SMARC RB5 is a SMARC-based AIoT and robotics development kit that leverages the ADLINK LEC-RB5, powered by the Qualcomm QRB5165 SoC featuring a Qualcomm Kyro 585 octa-core CPU (8x Arm Cortex-A77) and Qualcomm AI Engine. Supporting up to six MIPI-CSI cameras and achieving 15 TOPS, the I-Pi SMARC RB5 is an ideal DevKit for implementing AI-centric robotics and drone applications in various fields such as consumer, enterprise, defense, industrial, and logistics.

The I-Pi SMARC 1200 is a SMARC-based AI and graphics-centric solution development kit equipped with the MediaTek Genio 1200 (octa-core Arm Cortex-A78 x4 + A55 x4) processor, an advanced 5-core Arm Mali-G57 GPU for high-quality 3D graphics, and an integrated APU (AI Processor Unit) system with up to 5 TOPS. This development kit features AI processing capabilities on the device (acceleration for deep learning neural networking, computer vision, etc.), support for multiple 4K displays, and up to three MIPI camera inputs, making it an optimal solution for enabling various next-generation innovations focused on AI, such as advanced smart homes, human-machine interfaces, 4K multimedia applications, and industrial IoT.

The I-Pi SMARC Elkhart Lake is a SMARC-based edge solution development kit equipped with the Intel Atom x6425E quad-core SoC, integrating Intel UHD graphics and comprehensive high-speed interfaces. Additionally, this kit, specialized for development, supports the latest version of the Intel Distribution of OpenVINO toolkit, which features more deep learning models, higher inference performance, and fewer code changes, enabling simpler development than ever before. The I-Pi SMARC Elkhart Lake comes with 4GB LPDDR4 + 64GB eMMC memory and is essential for the development and prototyping of mission-critical, fanless industrial IoT applications, where safety and reliability are always paramount, while supporting low power consumption and a wide temperature range.

The COM Express Type 10 Elkhart Lake is a COM Express Type 10-based edge solution development kit equipped with the Intel Atom x6211E dual-core SoC, which integrates Intel UHD graphics and comprehensive high-speed interfaces. Additionally, this kit, specialized for development, supports the latest version of the Intel Distribution of OpenVINO toolkit, featuring more deep learning models, higher inference performance, and fewer code changes, enabling simpler development than ever before. With 4GB LPDDR4 and 64GB eMMC memory, the COM Express Type 10 Elkhart Lake supports an extended temperature range within a low power envelope, making it a key component essential for the development and prototyping of mission-critical fanless industrial IoT applications where safety and reliability are always paramount.

The COM Express Type 6 Alder Lake-P is a powerful IoT solution development kit based on COM Express Type 6, featuring the Intel 12th generation i5-12600HE 12-core (4 P-cores + 8 E-cores) SoC, integrated with Intel Iris Xe GPU graphics (80 execution units) and comprehensive high-speed interfaces. This kit, focused on performance and power efficiency, incorporates a COM Express module that utilizes Intel's advanced hybrid architecture, leveraging four performance cores for IoT workloads and eight efficient cores for background task management. It provides excellent performance and power per watt, offering high flexibility to enable a wide range of smart edge innovations with a TDP of 35/45W. This module and development kit, equipped with 64GB of memory and integrated Intel Iris Xe graphics with 80 execution units, will be key for the development and prototyping of various industrial IoT applications specialized in graphics and AI.