アローズエンジニアリング List of Products and Services

We would like to introduce our autonomous transport robot, 'iSONA'. It is equipped with features such as an API interface, real-time monitoring, and expandability for peripheral devices, automating the transport processes in factories and logistics warehouses. Additionally, we offer an industry-leading energy-saving system, "VSP." It is recommended for those facing issues with equipment troubles caused by lightning strikes, natural disasters, or accidents involving power line facilities. 【Key Features (Partial)】 ■ Custom Mapping ■ Custom Modeling ■ Position Module ■ Navigation Module ■ Expandability for Peripheral Devices (Conveyor, Lift, Autonomous Driving) ■ Climbing Ability: Less than 7% (4°) ■ Autonomous Driving Target Accuracy: ±3mm (Note that errors may occur depending on road conditions) *For more details, please download the PDF or feel free to contact us.

• Transport and handling robots
• Other safety equipment

The "MR-200A" is a device that can measure the V-groove shape of the main roller and the wire height. After cleaning the roller set on the wire saw, the inspection device is attached to the core. The inspection device moves across the roller stage to measure all grooves, and the measurement values are saved as Excel and image files. 【Features】 ■ Inspect the groove depth without removing the roller from the machine and ensure it is not deeper than others when there is no wire. ■ Measure the wire height in a wound state to assess sinking. ■ Determine the criteria for roller replacement as a clue for quality improvement based on inspection results. ■ Conduct acceptance inspection after reprocessing the main roller. *For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

"Momentary voltage dip" refers to a power outage that occurs for a very short time, instantaneously. Power companies generally refer to outages lasting less than one minute. When a momentary dip occurs, it can lead to the stopping or malfunctioning of factory equipment each time. Additionally, it can cause defects in the products being produced and take time to restart the equipment, resulting in decreased production efficiency. In the past, a momentary dip of 0.07 seconds caused enormous damages exceeding several billion yen for one company. [Handbook Contents] ■ What is a momentary dip ■ Difference between momentary dip (instantaneous voltage drop) and power outage ■ Effects of momentary dip ■ Countermeasures for momentary dip (instantaneous voltage drop) ■ Features of momentary dip protection device VSP *For more details, please refer to the PDF document or feel free to contact us.

• UPS/Uninterruptible Power Supply

"Momentary voltage dip" is a phenomenon where the voltage drops momentarily for a few cycles. It mainly continues until the fault in the transmission line caused by events such as lightning is removed from the power system, typically occurring within 0.5 seconds. Causes of momentary dips and power outages include "lightning," as well as "typhoons, storms," and "earthquakes," among others. [Causes of Momentary Dips & Power Outages] ■ Lightning ■ Typhoons, storms ■ Earthquakes ■ Heavy snowfall ■ Bird nesting ■ Damage to utility poles due to vehicle collisions *For more details, please refer to the PDF document or feel free to contact us.

• UPS/Uninterruptible Power Supply

"Momentary voltage sag" refers to a brief, instantaneous drop in voltage. The countermeasure device has shifted from UPS (Uninterruptible Power Supply) to VSP (Voltage Sag Protector)! VSP (Voltage Sag Protector) is a device that provides short-term power compensation specifically for SAG (momentary voltage sag). Common incidents and troubles in the data center industry caused by momentary voltage sags due to lightning and other factors: ■ The cooling system's pump has stopped. ■ The backup for the server has failed. ■ Cloud outages have occurred. Success stories from the introduction of momentary voltage sag protection devices: ■ The cooling system's pump has not stopped. ■ The backup for the server has not failed. ■ The frequency of outages has decreased. *For more details, please download the materials or contact us.

• UPS/Uninterruptible Power Supply

"Momentary voltage drop" refers to a brief, instantaneous decrease in voltage. Countermeasure devices have transitioned from UPS (Uninterruptible Power Supply) to VSP (Voltage Sag Protector)! The VSP (Voltage Sag Protector) is a device that provides short-term power compensation specifically for SAG (momentary voltage drops). Accidents and troubles frequently caused by momentary voltage drops due to lightning in the semiconductor, wafer, and FPD industries include: ■ Occurrence of defects in semiconductor manufacturing equipment (decreased yield) ■ Delays in semiconductor production schedules (delivery delays) ■ Increased costs due to product defects and equipment startup time losses ■ Decreased reliability among stakeholders Success stories from the introduction of momentary voltage drop protection devices: ■ Improved stability of semiconductor quality ■ Maintenance-free operation of equipment, with a lifespan of 13 to 15 years ■ Landing costs reduced to as low as one-twelfth, resulting in energy savings ■ Low introduction costs ■ Small footprint allows for effective use in clean rooms ■ No harmful substances used *For more details, please download the materials or contact us.

• UPS/Uninterruptible Power Supply

This is a main roller groove shape inspection machine for wire cutting machines. The inspection device can be placed on the roller at the site to measure the groove shape profile and capture images of the shape. ■ Features 1. Regular maintenance of the main roller allows for checking wear and shape abnormalities. 2. It can estimate the timing for roller replacement and monitor the wire position. 3. It can manage the acceptance inspection of new rollers and optimal processing conditions. ■ Inspection Details 1. Main roller groove shape mode, ear mode, and manual mode. 2. It can perform groove inspections for solar panels and semiconductor grooves.

• Semiconductor inspection/test equipment

The diamond section has a higher bonding strength compared to the core section. When the workpiece is pressed against it, the core section wears out faster. The diamond section, which is approximately 10 microns higher (depending on the diamond grain size), will always be in contact with the workpiece. The size of the core section and the width of the diamond section can be designed arbitrarily to match the material of the workpiece, allowing for a higher load distribution of the diamond against the workpiece, thus maximizing the power of the grinding wheel. <Features> - Ideal cutting performance and grinding wheel lifespan with the size and thickness of the honeycomb! - The abrasive grains in the core section enhance processing efficiency due to the action of free abrasive grains. - Maximizes non-dress and dress intervals. - Load distribution can be controlled through diamond patterning.

• Other abrasives

This device is an image processing system that performs visual inspection of wires and bonding on a substrate at ultra-high speed (1 field per second). It consists of two stations: a three-dimensional image processing unit that measures the height of the wires and a high-resolution two-dimensional image processing unit that measures wire bending and ball placement. The two-dimensional and three-dimensional image processing units operate alternately, and there are two image processing PCs. All cameras are fixed, and the mechanical device moves the substrate. ■ Example of Device Configuration (Two-Dimensional Image Processing Unit) - 5-megapixel CCD camera - Lens with magnification of 1.5x - Blue LED dome coaxial illumination - LED power supply 3HC (Three-Dimensional Processing Unit) - 1.3-megapixel CCD camera - CCTV lens f=50mm - Red LED dome illumination - Image processing PC and camera capture board

• Visual Inspection Equipment

Since the establishment of the company in 1986, we have been developing semiconductor equipment-related businesses that support Japan's cutting-edge technology, and we possess various repair know-how related to semiconductor manufacturing equipment. This time, we would like to introduce laser repairs for stepper devices. We can accommodate ASML, Nikon, and Canon products. (Please download the materials for a detailed list.)

• Semiconductor inspection/test equipment

At Arrows Engineering, we handle MEMS microscopes manufactured by IT Tech. The "TMIR-2000" can monitor MEMS wafers from both sides using microscope cameras, allowing for pattern misalignment and misregistration inspections. With newly developed software, the optical axes of the two cameras are aligned and synthesized in real-time, directly capturing any vertical overlap misalignment. Additionally, automatic line width measurement allows for sub-micron measurement of mark misalignment. 【Basic Configuration (Excerpt)】 ■ MEMS Microscope Main Unit ■ Triple Eyepiece Tube ■ 10x Eyepiece ■ XY Stage ■ Two Color Cameras ■ Inspection PC/19-inch Monitor/MEMS Inspection Software, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

At Arrows Engineering, we handle the "Automatic Infrared Microscope" manufactured by IT Tech. This product performs image measurements of the pattern dimensions inside silicon using an infrared microscope, focusing visibly with AF on the surface of 8” bonded wafers. It is equipped with 2 cassettes, an edge grip chuck, and an edge aligner. 【Features】 ■ Target wafer: 8” ■ 2 cassettes ■ Positioning accuracy: ±1μm ■ Axis offset measurement: ±0.5μm ■ Line width measurement: 0.2μm *For more details, please refer to the PDF document or feel free to contact us.

• Other microscopes

At Arrows Engineering, we handle the AR film defect inspection equipment manufactured by IT Tech. The 'EX2001S' is a defect inspection machine for anti-reflective films on glass substrates. It performs high-speed scan inspections of the surfaces and backs of transparent substrates using an inverted microscope and line camera to detect defects. 【Features and Functions】 - The maximum substrate size is 400mm, with auto-focus inspection for transparent substrates. - Detected defects include white foreign matter (gaps) and black foreign matter on the AR film substrate. - Minimum detection resolution is 2.8μm (1.4μm). - Review inspections can be remotely controlled (camera/lighting/objective magnification/stage and focus). *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

The VSP (Voltage Sag Protector) is a device that provides short-term power compensation specifically for voltage sags (momentary voltage drops). It detects and backs up within just 0.001 seconds from the occurrence of a sag. With a rich lineup of 28 series, all models are equipped with electric double-layer supercapacitors (EDLS). 【Features】 ○ Maintenance-free ○ Ultra-fast switching time ○ Lightweight, compact, silent, and safe ○ Momentary sag history monitor ○ Bypass function For more details, please contact us or download the catalog.

• UPS/Uninterruptible Power Supply

The voltage sag protector can be applied in various industrial fields, including semiconductors, LCDs, automotive, chemicals, and medical sectors. Unlike traditional uninterruptible power supply (UPS) systems that use battery storage for uninterruptible power supply, it can completely resolve various power issues within one second of an instantaneous power outage. It can reduce the electricity consumption of existing devices by 80%. 【Features】 ■ Suitable for countermeasures against instantaneous power outages and voltage drops caused by lightning, ice and snow, and typhoons. ■ Maintenance-free due to the use of long-life electric double-layer capacitors. ■ Normally uses commercial power supply, switching instantly to electric double-layer capacitors for backup during momentary dips. ■ Achieves low power consumption due to high efficiency. *For more details, please request materials or view the PDF data from the download section.

• Circuit breakers and switches

The Line Camera Mini Series is a low-noise, high-sensitivity monochrome line camera that features a sensor with a pixel count of 512 to 2048, a sampling rate of 40 MHz, and a pixel size of 14×14 μm, along with a GRIN lens. It supports Camera Link output and is suitable for various inspection applications. 【Features】 ○ Continuous imaging of flowing workpieces ○ Compact design with integrated lens ○ Capable of close-up shooting at short distances ○ High-speed, high-precision scanning For more details, please contact us or download the catalog.

• Monochrome camera

The "close-up line camera" is a compact line camera for image inspection, designed for easy integration into production lines. It is ideal for detecting scratches, dust, and foreign objects on substrates and thin products flowing on conveyors. A single line camera can scan wide workpieces. It contributes to low-cost, high-speed, and high-precision inspections. 【Features】 - Compact structure for easy close installation and integration - Supports a variety of reading widths - High-speed reading - High-precision reading For more details, please contact us or download the catalog.

• Monochrome camera

The digital microscope "SDM2" is a fully automatic digital microscope system that can observe a wide range from low to high magnification. By using a high-resolution zoom microscope, it is also possible to observe with an optical resolution of less than 1μm. It can quickly move to registered coordinates using an automatic XY stage. Additionally, it is equipped with an autofocus function, achieving high resolution that cannot be realized with conventional zoom microscopes. For more details, please download the catalog.

• Electron microscope

The "PSI-50" is an inspection device capable of measuring the outer shape of small glass substrates and panels with high precision. It can measure outer dimensions (maximum width), detect burrs, detect chips, check for cutting misalignment, and measure the dimensions of the glass pouring area. Additionally, it is equipped with a measurement map display function and image saving capabilities. The automatic angle correction feature means that there is no need to precisely align the workpiece when placing it on the inspection stage. Once installed, it automatically corrects the angle. If the placed angle is too large, it will affect measurement accuracy, so it is designed to display an alarm. [Features] ■ Equipped with measurement map display function ■ Equipped with image saving function ■ Comes with automatic correction function *For more details, please refer to the catalog or feel free to contact us.

• Circuit Board Inspection Equipment

The "ITO Film Appearance Inspection Device" is a device that measures the line width of transparent films on film or glass substrates and conducts appearance inspections. By using a special optical system, it can clearly capture the presence or absence of transparent patterns, such as ITO films on touch panels, and detect splashes for appearance measurement. It is capable of inspecting the entire film at high speed and allows for detailed review observation of defect areas using high-magnification optics. Additionally, as an option, it can quickly measure the size and distribution of foreign substances on the substrate. Customization of inspection range and measurement accuracy is also possible upon request, so please feel free to consult us. 【Features】 ■ High-speed inspection possible ■ Review observation available ■ Customizable *For more details, please refer to the catalog or feel free to contact us.

• Defect Inspection Equipment

The "Seal Gap Measurement Device" is a measuring device that can quickly measure the gap dimensions between the seal area and the BM area of LCD glass panels. Conveyance is done through continuous movement, and a CCD camera is used to capture still images with a strobe light, allowing for high-speed and stable measurements with inexpensive conveyance machinery. The device employs a telecentric lens, ensuring that measurement accuracy is guaranteed even if the distance between the lens and the workpiece varies slightly due to warping or other factors. Additionally, there is almost no precision error based on the location within the image. 【Features】 ■ Capable of high-speed measurement ■ Capable of stable measurement ■ Uses telecentric lens *For more details, please refer to the catalog or feel free to contact us.

• Defect Inspection Equipment

The "Wire Bonding Inspection Device" is an optimal inspection device for specifying inspection positions and conducting test measurements with set parameters. It displays images of ideal samples taken, allowing for easy specification of inspection positions and test measurements through simple mouse operations. Results such as wire trajectories are visually displayed, making verification easy. Additionally, variety information is recorded on the HDD, allowing for the registration of multiple varieties. [Features] - Optimal for test measurements of parameters - Simple mouse operation - Results such as wire trajectories can be visually displayed *For more details, please refer to the catalog or feel free to contact us.

• Bonding Equipment

The "Transparent Film Inspection Certification Device" is a device that allows for high-contrast direct visual or camera observation of patterns such as transparent films formed on transparent glass. It generates a backlight effect that uniformly diffuses light on the surface of the glass substrate beyond the critical angle, causing the edges to not appear white when compared to dark field illumination. Additionally, by incorporating coaxial reflected lighting with adjusted light intensity, it suppresses the scattered surface reflections of the transparent glass part, enhancing the halation effect that increases the reflectivity of areas without the transparent film due to the transmission effect. Furthermore, it is possible to enhance the contrast that darkens the pattern of the transparent electrode with backlighting. 【Features】 ■ Equipped with a lighting device ■ Easy to operate ■ High precision *For more details, please refer to the catalog or feel free to contact us.

• Optical microscope

The high-precision wafer crack inspection device "Super Macro SM75" can inspect 300mm wafers in less than one second with a full-field one-shot, making it suitable for fully automated inspection lines due to its short inspection time. It is available with a lineup of small-field optical systems and can be applied to internal void inspections by using infrared light as an optional light source. In recent years, wafers have been becoming thinner, but this high-precision wafer crack inspection device can quickly inspect the entire wafer for chip cracks caused by the unevenness of BG processing, polishing marks, and stress. For more details, please download the catalog.

• Electron microscope

The atomic force microscope "Handy AFM" can be used as a substitute for high-magnification optical microscopes. It features standard measurement modes, including static force mode, dynamic force mode, phase contrast, phase measurement, force modulation, spreading resistance, and external input capabilities. The scanning head is available in two types: high-resolution and wide-area, and they can be exchanged instantly. Probe replacement takes only a few seconds, and no adjustments are needed after replacement. Additionally, carbon nanotube probes can also be approached automatically. By using an electromagnetic scanner (patented) for scanning, there is no need to move the workpiece during the scan. Generally, it does not exhibit the non-linear creep or aging changes associated with piezo devices commonly used in AFMs. Optionally, it can be combined with a compact automatic stage. For more details, please download the catalog.

• Electron microscope

The atomic force microscope "AFM with stage" is the only microscope capable of non-destructive three-dimensional measurements down to the nanometer scale in the atmosphere. It allows measurements without damaging the sample. By using an electromagnetic scanner, stable long-term measurements can be achieved without worrying about non-linear creep or aging effects. With a large stage, it is possible to perform non-destructive measurements simply by setting the sample without cutting the workpiece. Various measurement modes are available, providing functions equivalent to expensive AFM devices. Regardless of the material of the measurement work, measurements at the nano level can be performed immediately, from conductors to insulators, without any coating. For more details, please download the catalog.

• Electron microscope

The ultra-compact active vibration isolation table "Nano Series" is a cutting-edge, high-performance vibration isolation table that constantly senses vibrations and controls them through electronic means. It offers vibration isolation performance that far exceeds any high-end passive isolation table using air springs, all while saving space. It creates an optimal vibration environment for ultra-precise measurements at "nano size and below." It features ultra-high-performance sensors with six degrees of freedom active control. Additionally, soundproof and shockproof boxes are available as options. For more details, please download the catalog.

• Vibration Monitoring

The "Sheet Resistance Measurement Device" equipped with an optical stopper function can measure the surface resistance distribution at fine intervals (sub-micron to several tens of microns) using a micro four-terminal probe. By narrowing the functionality to applications in next-generation research and development, it achieves a low price while enabling resistance distribution measurement in fine areas of thin film surfaces in electronic devices. The optical stopper function is standardly equipped, stopping any pressing beyond a certain level even when there is no current, thus protecting the probe. For more details, please download the catalog.

• Vibration Monitoring

Easy operation: The "Automatic Winding Displacement Inspection System" automatically inspects the winding condition of the electrodes inside the battery using X-ray image processing. It individually recognizes the electrode numbers of the positive and negative electrodes and automatically measures their quantity and displacement. Two image processing devices work in pairs, inputting X-ray images individually to simultaneously inspect the top and bottom of the battery in-line. For more details, please download the catalog.

• Vibration Monitoring

The high-precision "Camshaft Appearance Inspection Device" measures the height shape of the camshaft using a light sectioning method and detects the height compared to a processed reference camshaft. It compares the height with the reference camshaft of the original material to detect defects, connecting three measurement cameras in a one-to-one configuration to a single central PC for measurement. For more details, please download the catalog.

• Vibration Monitoring

The high-speed inspection "ITO film appearance inspection device" measures the line width and conducts appearance inspections of transparent films on film and glass substrates. By using a special optical system, it clearly captures the presence or absence of transparent patterns such as touch panel ITO films and detects splatter for appearance measurement. For more details, please download the catalog.

• Vibration Monitoring

The high-speed measurement "Seal Displacement Measurement Device" quickly measures the gap dimensions between the seal area and the BM area of the LCD glass panel. The transport is continuous, and by using a CCD camera to capture still images with a strobe light, it enables high-speed and stable measurements with inexpensive transport machinery. For more details, please download the catalog.

• Vibration Monitoring

The "Wire Bonding Inspection Device" for model teaching displays images of ideal samples that have been captured, allowing for the specification of inspection positions and test measurements to be conducted with simple mouse operations using the set parameters. Results such as wire trajectories are visually displayed, making verification easy. For more details, please download the catalog.

• Vibration Monitoring

The inspection device "Wafer Edge Appearance Inspection Machine" simultaneously inspects defects such as scratches, foreign objects, and cracks on the edge and three surfaces (top and bottom) of the wafer through high-speed optical image inspection. (The inspection time for an 8” wafer is 6 seconds, making it very fast.) The wafer is adhered to the back side, and its shape is recognized by the camera to detect outer diameter eccentricity and the position/amount of the orifice, which controls the inspection machine. The newly developed triple optical system and integrated lighting have enabled detailed image inspection of the edge. External PIO control is also possible, allowing it to be integrated into automated systems. It can accommodate wafer sizes from 4 inches to 8 inches. For more details, please download the catalog.

• Visual Inspection Equipment

The inspection device "Pattern Inspection Device" registers a normal surface as a master and detects foreign substances, scratches, dirt, and pattern defects by comparing the registered image during inspection. It also displays the position of the alignment pattern and performs dimensional inspections. The area and size (maximum diameter) of the detected patterns and foreign substances are measured, and the inspection result data is compared with measurement conditions to determine good or defective products. The inspection result data is filed and stored. For more details, please download the catalog.

• Other inspection equipment and devices

The inspection device "cp-30 (microscope-type image measurement system)" is a system that analyzes images captured by a CCD camera attached to a microscope to automatically measure line widths. It precisely measures line widths from the brightness waveform of horizontal or vertical windows set within the screen. It is linked with an XY stage through a dedicated interface, allowing it to automatically move to specified positions for width measurement. The Z-axis autofocus function enables flexible handling of workpieces with varying thicknesses. Additionally, a wafer loader and unloader can also be installed. For more details, please download the catalog.

• Other measurement, recording and measuring instruments

The inspection device "Foreign Object Inspection Device" processes images captured by a camera using inspection software (Ip-20), allowing for various analyses to be conducted at high speed. The high degree of freedom in selecting camera models as input sources is a significant feature of this system. It is compatible with most commercially available NTSC and digital output cameras, enabling flexible inline device configurations ranging from high-end, high-functionality devices to low-cost, widely-used models. For more details, please download the catalog.

• Other inspection equipment and devices

The inspection device "Transparent Film Inspection Certification Device" allows for direct visual observation or camera observation of patterns such as transparent films formed on transparent glass with high contrast. It generates a backlight effect that uniformly diffuses light on the surface of the glass substrate beyond the critical angle, preventing edges from glowing white when compared to dark field illumination. By incorporating coaxial reflective lighting with adjusted light intensity, it suppresses the scattering surface reflection of the transparent glass section and enhances the halation effect, increasing the reflectivity in areas without the transparent film due to the transmission effect. This makes it possible to improve the contrast by darkening the pattern of the transparent electrode under backlight. For more details, please download the catalog.

• Other inspection equipment and devices

The inspection device "Glass Substrate Outline Inspection Device (PSI-50)" is capable of measuring outer dimensions (maximum width), detecting burrs, detecting chips, inspecting cutting misalignment, and measuring the dimensions of the glass pouring section. It also features a measurement MAP display function and image storage, among others. Additionally, with the automatic angle correction function for the panel, there is no need to precisely align the angle when placing the workpiece on the inspection stage. Once installed, it automatically corrects the angle. If the placed angle is too large, it will affect measurement accuracy, and an alarm will be displayed. For more details, please download the catalog.

• Other inspection equipment and devices

The Super Macro SM75 can inspect 300mm wafers in one shot in just one second, making it suitable for fully automated inspection lines due to its short inspection time. It is available with a lineup of optical systems for small fields of view, and by using infrared as an optional light source, it can also be applied to internal void inspections. For more details, please contact us or download the catalog.

• Other inspection equipment and devices

"Aerofix" is a vacuum chuck developed using a unique ceramic sintering technology, which takes a completely different approach from conventional through-hole type vacuum chucks. By controlling the eutectic reaction between the main agent and the auxiliary agent, it manages sinterability, adjusting to the optimal pore diameter and porosity for the workpiece. Additionally, since it is fully sintered during the manufacturing process, there is no dust generation from within, ensuring it does not affect the working environment. Previously, it was necessary to design and manufacture chuck devices tailored to the shape of the workpiece, but the "Aerofix," which allows for partial adsorption, can accommodate various workpiece sizes. There is no need to prepare different types and sizes for each workpiece, leading to cost reduction and improved work efficiency. It generates uniform adsorption force, making it safe to use even for delicate thin workpieces. Moreover, it can also adsorb edge warps seen in films, enhancing work efficiency (touchdown). The adsorption force can be adjusted using a vacuum pressure control valve. We offer demonstration units for "Aerofix." Please experience the exceptional performance of our product firsthand. For more details, please contact us or download the catalog.

• others

Arrows Engineering designs, manufactures, modifies, repairs, and sells peripheral equipment for semiconductor devices, undertakes construction related to semiconductor manufacturing equipment, and manufactures and sells momentary voltage drop protection devices. We introduce repair and improvement services for items such as "high-frequency power supplies," "RF matching boxes," and "transport robots." We also list the models we support for repairs. Our company accurately captures customer needs and provides suitable support, helping to resolve various issues swiftly with reliable technology and advanced knowledge. [Repair and Improvement Details] ■ High-Frequency Power Supply: Improvement of heat dissipation ■ RF Matching Box: Regular replacement of overloaded or aging parts to stabilize RF matching functionality and enhance durability ■ Repair of Transport Robots: Disassembly of robots and controllers, wafer transport testing ■ Repair of PCB Boards: Repair of PCB boards from various equipment manufacturers *For more details, please refer to the PDF document or feel free to contact us.

• Other semiconductor manufacturing equipment

Arrows Engineering Co., Ltd. has been involved in the semiconductor business since its establishment in 1986, and we strive to be an indispensable company in the semiconductor industry by accurately capturing our customers' needs. With the desire to continue being essential, all our employees work daily to provide the highest quality products, technologies, and services. We assist in solving various problems with reliable technology and advanced knowledge, accurately addressing our customers' needs and providing optimal support. For more details, please contact us or refer to our catalog.

• Other semiconductor manufacturing equipment