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Our company is engaged in the development of wireless communication modules. We have a wealth of experience in developing various types of wireless communication and can propose wireless media tailored to your applications and requirements. We provide gadgets equipped with wireless communication functions through integration with various sensors. Additionally, we support the essential construction design required for the market launch of wireless communication devices. 【Features】 ■ Extensive experience in developing various types of wireless communication ■ Proposals for wireless media based on applications and requirements ■ Provision of gadgets with wireless communication functions through integration with various sensors ■ Suggestions for energy harvesting technologies such as microcurrent charging and solar panels ■ Support for the essential construction design required for the market launch of wireless communication devices *For more details, please download the PDF or feel free to contact us.
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Free membership registrationWe create "heat dissipation substrates" that allow for the selection of substrate materials and configurations tailored to specific applications and heat dissipation challenges. Thick copper plated substrates form circuits for heat dissipation from heat-generating components directly to conductors and the back surface of the substrate through copper plating. In metal base substrates, a dielectric (insulation layer) and copper foil are laminated on copper or aluminum, and by connecting to copper or aluminum plates through filled vias, high heat dissipation is achieved. Additionally, we have extensive experience in the mechanical design and manufacturing of various heat dissipation carriers and enclosures, as well as the selection and assembly of heat sinks and TIM materials, allowing us to provide consistent support. 【Application Fields】 ■ High Frequency ■ Automotive ■ Power Modules ■ High Power LEDs ■ Inverters *For more details, please download the PDF or feel free to contact us.
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Free membership registrationWe provide transparent FPC with excellent transparency in a short delivery time. We can use low-cost PET material "Polyethylene Terephthalate," and we also adopt PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting. Additionally, we support the transparency of the resist. 【Features】 ■ Achieving short delivery times from order to delivery, possible only with our company ■ Use of low-cost PET material "Polyethylene Terephthalate" ■ Adoption of PEN material "Polyethylene Naphthalate" for the insulation layer, enabling low-temperature reflow mounting ■ Support for the transparency of the resist *For more details, please download the PDF or feel free to contact us.
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Free membership registrationIn our company's efforts in "Power Supply Unit Design and Development," we propose solutions for noise reduction, heat dissipation measures, optimal component selection, and layout design. We share advanced technologies and product trends in collaboration with semiconductor manufacturers. We also accept prototypes of passive components such as power transformers. Additionally, we have numerous achievements in energy harvesting power supplies, battery-free DC-DC converters, chargers for mobile batteries, and low-current power supplies for lighting. 【Features】 ■ Sharing advanced technologies and product trends in collaboration with semiconductor manufacturers ■ Proposing high-efficiency power units through the application of heat dissipation technologies such as copper inlay substrates ■ Designing with a long product lifecycle in mind and updating to advanced technologies ■ Accepting prototypes of passive components such as power transformers *For more details, please download the PDF or feel free to contact us.
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Free membership registrationOur company specializes in "circuit board design and pattern design." Our circuit designers create boards that reliably function in a single prototype for high-speed circuit boards and analog circuit boards. We have strengths in hardware development and circuit design, honed over many years in the set manufacturing industry. 【Strengths in Circuit Board Design】 ■ Extensive experience in developing analog circuits such as amplifiers and power supplies ■ Expertise in hardware development and circuit design cultivated over many years in the set manufacturing industry ■ Knowledge of pattern design that delivers performance and is resistant to noise ■ Knowledge of measures for signal standards and safety standards ■ Proven track record from product planning to design and mass production launch *For more details, please download the PDF or feel free to contact us.
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Free membership registrationWe would like to introduce our "Rigid Flexible Circuit Boards." Traditionally, connections were made using B to B connectors, but with the rigid-flex design, both the area and height have been reduced to less than half. These can be applied in fields such as automotive, tablet devices, smartphones, and medical equipment. 【Board Specifications】 ■ 8-layer through-hole board (Rigid Flexible Circuit Board) ■ Board thickness t = 0.7mm ■ Flexible part thickness t = 0.28mm ■ Minimum L/S: 0.1/0.1mm ■ Minimum Via: hole diameter 0.25mm ■ Land diameter surface layer 0.45mm, inner layer 0.5mm *For more details, please download the PDF or feel free to contact us.
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Free membership registrationWe handle suitable "build-up substrates" for interposers. The minimum line and space are L/S = 20/20μm. It supports LVH diameter/land diameter = 60/90μm with an LVH pitch of 150μm. Using a core of 25μm and prepreg of 20μm allows for thin board construction. 【Application Areas】 ■ Wireless modules ■ Interposers ■ Smartphones ■ Tablet devices ■ Digital cameras ■ Communication base stations *For more details, please download the PDF or feel free to contact us.
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Free membership registrationOur company has a track record in artwork design and circuit board design for OPV-driven sensor node terminals. We have developed COB evaluation boards for bare ICs, prototypes for QFN packages, and evaluation boards for packages, as well as a 28.5GHz DC characteristics and S-parameter automatic measurement system for shipping inspection. Additionally, we handle everything from structural considerations to circuit design, SIM, circuit board design, and manufacturing. 【Overview of Achievements in OPV-Driven Sensor Node Terminals】 ■ Development of OPV-driven sensor nodes equipped with temperature, humidity, and illuminance sensors ■ We have also created an iPhone app that allows users to check the numerical values organic photovoltaic *For more details, please download the PDF or feel free to contact us.
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Free membership registrationOur company has a track record in artwork design and PCB design work for robot motor drivers and sensing boards. We can accommodate requests such as transitioning from an old PCB (QFP) to a new PCB (BGA) while keeping the number of layers and dimensions the same as the current design, and we can also handle the implementation of paired chips and the mounting of optical lenses within budget. Please feel free to contact us when you need our services. 【Overview of Achievements in Robot Motor Drivers and Sensing Boards】 ■ Gate driver chip compatible with 3-phase brushless motors ■ High-voltage MOSFET driving at 48V, with current sensing and overcurrent monitoring using a 16-bit ADC ■ PWM frequency of 100 kHz, with a measured driving current of 2A ■ Microcontroller, serial bus, GPIO, level shifter ■ Designed to be more compact than previous PCBs, with heat dissipation measures and improved stability of the serial bus operation *For more details, please download the PDF or feel free to contact us.
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Free membership registrationWe provided one-stop support for the development of the important "28.5GHz band IC" in the next-generation communication field, including 5G and satellite communication, from the conceptual stage to mass production launch. The development consists of four phases. First, we created a test board for bare IC evaluation, followed by the prototyping of a QFN package. We then developed a high-precision performance evaluation fixture, including noise countermeasures, and ultimately supported the automatic sorting and shipping of good products using a sorting test device. All circuit design, measurement programs (C#), FPGA design (Verilog HDL), and enclosure design were completed in-house. The drive unit was miniaturized using an electric cylinder, and the current and voltage measurement circuits were integrated onto a single board, achieving multifunctionality and low cost. We support our customers' product development with a development system that responds to all requests, including advanced RF design, short delivery times, and flexible customization. *For more details, please download the PDF or contact us.
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Free membership registrationOur company provides FPGA design and development services that cater to various industries, based on our extensive embedded development experience in diverse fields such as communications, video, robotics, edge AI, healthcare, automotive, and astronomy. We can handle not only the overall logic design of the FPGA but also the design and verification of individual IPs to be mounted on the FPGA. By combining this with our strength in custom board design, we can easily provide customers with their unique FPGA systems, even with limited knowledge in logic design, circuit design, and software development. 【Service Offerings】 ■ FPGA design, SoC design ■ FPGA-EOL replacement ■ Embedded system development ■ SoC logic verification, PoC verification *For more details, please refer to the related links or feel free to contact us.
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Free membership registrationA major feature of our artwork design is that it is created by experienced hardware developers from major set manufacturers who are well-versed in both circuits and artwork, resulting in high-level artwork design. We handle a wide variety of circuit boards, allowing for extensive support in board development and design. In addition to beautiful layouts, we prioritize understanding the actual logic and aim to create artwork designs that reflect the developer's intentions and desired characteristics. 【Design Technology】 ■ Noise countermeasures in DC/DC converter boards ■ Thermal countermeasures (motor driver) pattern design ■ Board design that brings analog concepts into the digital realm ■ Achieving the desired functions and performance at a high level with extensive circuit knowledge and layout know-how *For more details, please refer to the related links or feel free to contact us.
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Free membership registrationWith the energy-saving of devices and the low voltage of ICs, the use of DC/DC converters with excellent conversion efficiency is increasing. In recent years, DC/DC converters have become very frequently used due to improvements in several drawbacks, including high performance, high functionality, miniaturization, and reduction of external components. However, to effectively utilize them, it is important to minimize noise generation and reduce the impact of generated noise on other circuits. Therefore, assuming that the selection of peripheral components considering noise has been adequately done, we will verify "how much noise countermeasures can be achieved through substrate patterning" with practical examples. *For detailed content of the article, please refer to the related links. For more information, feel free to contact us.
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Free membership registrationAn important factor in machine design, circuit design, and substrate design is "controlling heat." The heat dissipation path, from the perspective of thermal resistance, is significantly large, as heat conducted from components to the substrate wiring is transmitted into the air. With the recent trend of high-density integration of components and miniaturization of devices, the importance of measures through substrate patterning has been increasing. Here, we will introduce specific thermal countermeasures based on verification experiments regarding "how much difference substrate patterning can make in thermally demanding circuits." *For detailed content of the article, please refer to the related links. For more information, feel free to contact us.*
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Free membership registrationOur company designs boards that bring the concept of analog into the digital realm to achieve high system speeds. We avoid issues such as the discontinuity of inductance in the SMA section, the discontinuity of capacitance mainly in the connector section, and the discontinuity of transmission lines caused by vias and right-angle bends, thereby preventing signal degradation. Additionally, we can propose effective reflection prevention measures while appropriately selecting termination locations and methods to avoid increasing the number of components. [Key Points] - Avoid discontinuities on the board to prevent "signal degradation" - Propose optimal placement and methods for termination to prevent "reflection" - Avoid "crosstalk" - Implement board layouts that do not cause "ground bounce" *For more details, please refer to the related links or feel free to contact us.
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Free membership registrationWith the acceleration of signals such as DDR3, PCI Express 3.0, USB 3.0, and SATA 6Gbps, the difficulty of pattern layout has been increasing. To achieve the desired functions and performance, higher knowledge and expertise in pattern layout are required. Our company has experienced engineers who are well-versed in circuit design, allowing us to utilize our unique know-how to maximize the desired characteristics, even for high-density large-scale circuit boards. Here, we will introduce the types of signals, general patterning, and points to consider during layout using the motherboard (GIGABYTE model GA-B75M-D3H, released in April 2012) as an example. *For detailed content of the article, please refer to the related links. For more information, feel free to contact us.
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Free membership registrationOur company provides support for circuit design in addition to artwork design. We can assist with designing various power circuits, as well as interpreting the intentions of the development personnel from simple documents to create circuit diagrams. We can also help verify whether multiple boards connected via cables are correctly connected as intended. Additionally, we thoroughly examine the circuit materials and parts lists we receive. We have established a system to prevent errors by checking for inconsistencies in the circuit diagrams and ensuring there are no mistakes in the usage of device pins. 【Features】 ■ Support for various power circuits ■ Creation of circuit diagrams from simple documents ■ Connection checks for multiple boards via cables *For more details, please refer to the related links or feel free to contact us.
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Free membership registrationWe will carefully examine various conditions such as load current, noise, and heat to design an optimal power supply system. In addition to power circuit design, we can take on the entire power supply system, including component selection, peripheral circuit design, and review of existing circuits. Experienced hardware developers who are well-versed in circuits will be in charge of the design, significantly improving development efficiency. 【For concerns like these】 ■ I want to entrust the entire power circuit design. ■ Since there are many systems, I would like the design to consider the overall configuration. ■ I want to entrust component selection and peripheral circuit design. ■ I need to review the power block, but I would like to entrust the judgment of whether changes are necessary and the design if changes are made. *For more details, please refer to the related links or feel free to contact us.
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Free membership registrationIf you provide us with simple materials, we can interpret the intentions of your development personnel and create circuit diagrams from them. This service is recommended for customers who do not have a circuit diagram editor or want to save the effort of creating circuit diagrams with only the minimum necessary information provided. No complicated work instructions are required at all. Please feel free to contact us when you need our services. 【Examples】 ■ It’s a simple circuit that repeats, but creating the overall circuit diagram is cumbersome. I would like the entire circuit to be created with just simple information for one block. ■ It’s a simple interface board, but it has many pins. I will show the connection relationships in Excel, so I would like a circuit diagram to be created. ■ I want to create a jig board to extract signals from each terminal for evaluating a new device. I will simply indicate the necessary information for each terminal, so I would like to leave the circuit diagram creation to you. *For more details, please refer to the related links or feel free to contact us.
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Free membership registrationWe will assist you in confirming whether your circuit diagram is correctly connected as intended. When connecting between circuit boards using BtoB or FPC, it is essential that the placement instructions, circuit diagrams, bill of materials, pin order in the CAD component library, and layout are all correct. Taking into account the actual pattern layout, we will help you verify whether the connections between the circuit boards can be made correctly as intended. 【Verification Items (Example)】 ■ Circuit Diagram ■ Placement Instructions ■ Orientation of Connector Pin 1 ■ Component Part Numbers ■ Artwork *For more details, please refer to the related links or feel free to contact us.
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Free membership registrationOur company is capable of producing various specifications of circuit boards, primarily focusing on small quantities, with a short lead time. We accommodate not only rigid-flex boards, build-up boards, flexible boards, and through-hole boards (standard boards), but also special materials such as high-frequency boards and glass boards. As a fabless company, we have established a production system that balances quality and delivery times by collaborating with domestic manufacturers that possess high technical capabilities through our unique network. 【Examples of Circuit Boards We Handle】 ■ Multilayer boards (FR-4) ■ Flexible boards (FPC) ■ Rigid-flex boards ■ Build-up boards ■ High-frequency boards ■ Ceramic boards *For more details, please refer to the related links or feel free to contact us.
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Free membership registration"High-frequency substrates" are one of the areas in which our company excels, and we have a wealth of production experience. We offer a wide range of low dielectric constant and low loss materials that are essential for substrates transmitting GHz band and Gbps high-speed signals. We can accommodate small production quantities and respond with short lead times, so please feel free to consult with us. 【Materials we handle (example)】 ■R-5775 (MEGTRON6) ■CCL-HL950SK TypeSK ■MCL-LX-67Y ■NPC-F220 ■CGP-500 ■CS-3376B *For more details, please refer to the related links or feel free to contact us.
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Free membership registrationWe provide consistent support from circuit board design to ensure the characteristics of the entire module, rather than just partial implementation work, through wire bonding and flip chip mounting. We possess extensive know-how in the fields of wire bonding and flip chip using bare chips, and we may be able to resolve cases that other companies have declined. We are always mindful of cost and delivery time, and we can assist from the planning stage, so if you are a development manager facing challenges with bare chip mounting, please feel free to consult with us. 【Features】 ■ Support for small lots (from 1 piece) ■ Quick turnaround ■ Capable of mixed mounting with SMT components and leaded components *For more details, please refer to the related links or feel free to contact us.
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Free membership registrationOur company is capable of providing careful BGA rework and jumper modifications with a short turnaround time. We have a team of experienced and skilled technicians, allowing us to perform reworking safely and swiftly based on their expertise and advanced equipment. Moreover, it is not an exaggeration to say that the quality and delivery time of jumper modifications can vary significantly depending on the skill level of the technician in charge. Just like with BGA rework, our skilled craftsmen will handle each wiring with care and speed. 【BGA Rework Points】 ■ Thorough pre-verification through temperature profiling ■ Use of area heaters/spot heaters to avoid damage with minimal heating ■ Complete prevention of pad delamination *For more details, please refer to the related links or feel free to contact us.
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Free membership registrationWe would like to introduce a case where we received a request for high-speed transmission artwork (10Gbps × 8 lanes) to lens assembly. Considering the performance (characteristics of each signal), the capabilities of the wire bonder, and the shape of the lens, we determined the die pad shape, the position of the second bonding, and the pattern layout. We accurately aligned the center of the lens above the center of the two optoelectronic device emission areas that were precisely die-mounted, using image recognition to position the center of the microlens array one point at a time. [Case Overview] ■ Challenge - The center of the emission point of the bare chip must be aligned with the center of the lens with an accuracy of a few micrometers, but there is no budget for the production of special alignment jigs. ■ Result - The center of the emission area of the optoelectronic device directly below was aligned with the center of the lens directly above, achieving implementation without creating special jigs. *For more details, please refer to the related links or feel free to contact us.
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Free membership registrationWe would like to introduce a case where we conducted the artwork and manufacturing of a high-voltage circuit board. We received an inquiry from a customer developing a high-voltage circuit board for the first time, and we proposed the circuit board design values primarily from our side. In this case, there were no clearly defined standards to comply with, so we made proposals to satisfy functionality, performance, and safety, and after adjustments with the customer, we finalized the specifications. 【Outline Specifications】 ■ Output: Maximum AC/DC 5kV ■ Insulation Design: Between other blocks = AC2kV Between Low Voltage block and High Voltage block = AC4kV (to the extent possible) *For more details, please refer to the related links or feel free to contact us.
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