Electronic Components and Semiconductors

アイテス

EstablishmentJanuary 1, 1993
capital10000Ten thousand
number of employees92
addressShiga/Otsu-shi/1-60 Kuribayashi Town
phone077-599-5015
last updated：
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アイテス List of Catalogs

1～45 item / All 347 items

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Example of failure analysis of chip resistors

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Evaluation of the rebound and vibration absorption properties of rubber materials.

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Specification verification and failure analysis through reliability testing.

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Dynamic viscoelasticity measurement of CFRP.

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X-ray CT analysis and EDX analysis of capsule powder.

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Effects of heat generated during cross-sectional ion milling (CP) processing.

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Announcement of the introduction of Talos F200E

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Poisson's ratio measurement

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Observation of thermal deformation using a 3D shape measurement machine (VR-6200)

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Cryogenic ion milling cross-section processing example (rubber products)

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Evaluation of tensile properties using a stretch gauge compatible with highly extensible flexible materials.

Product catalog

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About the curing temperature of epoxy resin free of hazardous substances.

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Rubber heat aging test

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Component analysis of organic matter (FT-IR and GC/MS)

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Observation of substrate deformation using a 3D shape measuring machine (VR-6200)

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Observation of tracking camera cross-section by mechanical polishing.

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NMR analysis of liquid crystal compounds

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Appearance observation and measurement services

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Observation of CMOS image sensor cross-section by mechanical polishing.

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Strain measurement of power module package resin.

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Evaluation of various implementation boards

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SiC wafer electrical degradation simulator

Product catalog

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Analysis of organic-inorganic composites using FT-IR and EDX.

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Composition analysis of LIB cathode material active substances by ICP luminescence analysis.

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Power device failure location / Slice & View three-dimensional reconstruction

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Optical film light transmission characteristics

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In-chamber imaging during constant temperature and humidity testing.

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

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Measurement of moisture absorption distortion

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Micro FT-IR imaging measurement

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CP processing device Arblade5000_ Wide Area Cross-section Milling

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IOL testing of discrete semiconductors

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Observation of metallic tissue through chemical treatment.

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Micro FT-IR

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Examples of semiconductor observation through mechanical polishing.

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Strain measurement in thermal shock testing.

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Evaluation of particle size of positive electrode active material

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Cross-sectional observation of substrate-mounted components (1) to (6)

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Cross-sectional observation of substrate-mounted components.

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Chemical Analysis Trust Service

Product catalog

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Observation of conductive particle shapes in COG implementation

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Analysis case of faulty switch contacts

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Raman UV-curable resin

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Evaluation of pore distribution in non-woven fabric sheets

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Dynamic SIMS

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