santec Holdings Product Lineup

The Swept Test System, which combines a wavelength-tunable light source (TSL series), a multi-port power meter (MPM series), a polarization control unit (PCU-110), and dedicated software, serves as an optimal evaluation tool for both research and development of optical devices and production environments. By referencing the output power from the wavelength-tunable light source in real-time and simultaneously acquiring the optical power transmitted through the DUT, high-precision measurements of IL/WDL/PDL can be achieved. This system calculates PDL using the Mueller matrix method. ■ Features - Rescaling algorithm (high resolution 0.1 pm) - Real-time power reference (reproducibility 0.02 dB) - High-precision wavelength monitor built into the light source (absolute wavelength accuracy 3 pm)

The "IVS-2000-HS" is an SS-OCT system capable of high-speed measurements in the center wavelength range of 1310nm. With high-speed (100kHz) measurements, it can reduce measurement time in inline inspections and other applications. It achieves a high axial resolution of less than 18um (in air), allowing for highly accurate tomographic measurements. 【Features】 ■ Center wavelength: 1310nm ■ A-line rate: 100kHz ■ High axial resolution: less than 18um (in air) *For more details, please download the PDF or feel free to contact us.

The "IVS-2000-LC" is an SS-OCT system with a deep imaging range centered at a wavelength of 1310nm. This wavelength range allows light to penetrate easily even in scattering materials, making it suitable for measuring highly scattering objects. With a deep imaging range (over 18mm in air), it is possible to perform three-dimensional measurements of objects with varying heights all at once. 【Features】 ■ Center wavelength: 1310nm ■ A-line rate: 50kHz ■ High axial resolution: less than 18um (in air) *For more details, please download the PDF or feel free to contact us.

The "IVS-2000-HR" is an SS-OCT system with a high resolution centered at a wavelength of 1310nm. It has the highest resolution in the IVS series (less than 5um in vivo), enabling measurements with even higher resolution and clarity. The high axial resolution is less than 9um (in air), and the A-line rate is 20kHz. 【Features】 ■ Center wavelength: 1310nm ■ A-line rate: 20kHz ■ High axial resolution: less than 9um (in air) *For more details, please download the PDF or feel free to contact us.

The TMS-2000 is a super high-precision wafer thickness distribution measurement device with innovative hardware design and high resistance to environmental changes. It enables inline inspection of various wafer materials such as silicon (up to P+++), SiC, sapphire, glass, LiNb3, and SOI, allowing for a wide range of applications that take advantage of high throughput and compact size. It adopts a spiral scan method that balances high speed and high-density measurement. The compact design allows for space-saving placement. 【Features】 - Stable thickness measurement based on high resistance to environmental temperature changes and vibrations - Sub-nanometer repeat measurement accuracy - High flexibility in scanning methods to measure thickness distribution on the wafer surface - Measurement possible even when attached to jigs with light irradiation from one side - Differential analysis possible with multiple different wafers - Measurement of evaluation parameters compliant with SEMI standards *For more details, please download the PDF or feel free to contact us.

The "OPS-1000" is an optical three-dimensional measuring device that applies the technology of high-speed wavelength-variable lasers to interferometric measurement. With high-speed measurement of up to 100,000 points per second, it enables complete automated inspection in the manufacturing process. Coaxial measurement allows for easy measurement of complex shapes. It achieves a minimum light reception sensitivity of 100 dB and a dynamic range of 70 dB. It offers world-class performance among three-dimensional measuring devices. 【Features】 ■ Ultra-high sensitivity - Minimum light reception sensitivity of 100 dB and a dynamic range of 70 dB ■ High-speed measurement - Enables complete automated inspection in the manufacturing process with high-speed measurement of up to 100,000 points per second ■ Coaxial measurement - Allows for easy measurement of complex shapes through coaxial measurement *For more details, please download the PDF or feel free to contact us.

This product line is a measurement solution that enables high-speed and high-precision characterization and defect analysis in the development of silicon photonics (SiPh) and photonic integrated circuits (PIC). In the development of optoelectronic fusion devices, it is crucial to determine "how quickly measurement results can be fed back into development." By accurately evaluating various optical characteristics and quickly identifying issues, it contributes to improving development efficiency. In addition to WDL and PDL characteristics, it is also possible to measure the reflection positions inside the device using OFDR technology, allowing for the identification of loss occurrence points.