ピーダブルビー List of Products and Services

This is a technology for forming build-up vias used in the production of high-frequency antenna patterns on printed circuit boards. While laser processing is commonly used for build-up vias, high-precision via formation using mechanical drilling and the developed high-aspect-ratio plating layer have enabled the formation of vias with a drill diameter of 0.15 mm and an interlayer distance of 0.6 mm, achieving a high aspect ratio of 4. This has made flexible antenna design for high-frequency antenna patterns possible.

• Circuit board design and manufacturing

- Substrate materials: measures against dielectric loss / measures against resistive loss - Substrate manufacturing: high-precision substrate manufacturing / support for special specifications / pattern finish measurement - Assembly: high-density assembly / special assembly In relation to millimeter-wave high frequency, we can provide consistent support from substrate design to manufacturing and assembly.

• Circuit board design and manufacturing

In terms of heat dissipation measures for the substrate, pre-simulation is crucial. Our company will confirm various heat dissipation conditions of the substrate during the estimation and provide "simple thermal analysis."

• Circuit board design and manufacturing

We are expanding our business areas related to printed circuit boards and have established a consistent production system (ADAMS) that encompasses everything from the design of product software and hardware to manufacturing and assembly, all conducted in-house. By leveraging the new technological capabilities and manufacturing abilities that arise from the communication environment and human resource development cultivated through our integrated "design-manufacturing-implementation" system, we continue to provide enhanced business services and flexibly respond to our customers' increasingly diverse and sophisticated needs.

• Circuit board design and manufacturing

Leveraging the strengths of our integrated production from in-house design, we are able to accommodate the production of narrow-pitch composite substrates for high-layer-count boards, such as semiconductor tester products, through a clever combination of design rules that consider substrate manufacturing at the design stage and the unique substrate processes of our small-batch, diverse product lines.

• Printed Circuit Board
• Prototype Services
• Other semiconductors

We propose the optimal printed circuit board design and manufacturing based on the packages used.

• Printed Circuit Board
• Prototype Services
• 2D CAD Electrical

We will propose work methods tailored to the shape and use of the parts. We can also accommodate work starting from just one piece.

• Printed Circuit Board
• Other semiconductors
• Prototype Services

The adjacent spacing between components has a proven record of up to 0.2mm. Stacking of 0603 chips in two layers is also possible.

• Printed Circuit Board
• Other semiconductors
• Prototype Services

We can accommodate thin substrates, ultra-small substrates, large substrates, irregular substrates, flexible substrates, ceramic substrates, and more. We will consider mounting jigs tailored to the substrates and can create them in a short period using glass epoxy materials at our substrate factory. Regarding substrate size, we can perform reflow mounting for sizes up to 500mm x 600mm with a thickness of 7mm.

• Printed Circuit Board
• Other semiconductors
• Prototype Services

BGA rework refers to the process of partially heating BGA on completed circuit boards to remove and install them. Our company has newly introduced a BGA rework device that can handle large circuit boards (Max 500×600) and thick boards (Max 7mm) due to its high thermal capacity, in addition to being lead-free. For reballing work when "wanting to reuse components," we have solder balls available in both eutectic and lead-free options, compatible with pitches ranging from 1.27mm to 0.4mm. We can also accommodate BGA jumper work.

• Other semiconductors
• Printed Circuit Board
• Prototype Services

POP implementation (Package on Package) is a technology used in mobile phones and other devices that require high-density packaging, allowing components to be stacked in a three-dimensional manner in two or three layers. While the typical POP implementation involves a CPU on the bottom layer and memory on the top layer, we also propose conversion boards for purposes such as extracting signal patterns from BGA for evaluation or modifying circuits due to pattern errors. We can also accommodate pre-stacking, where components are layered before assembly.

• Printed Circuit Board
• Other semiconductors
• Prototype Services

By combining a manual press system with a pin board for printed circuit board circuit testing (functional testing), it allows for multiple measurements to be conducted at once, eliminating the need to conduct tests in multiple stages and thereby reducing testing time (efficiently).

• Control Panel
• Prototype Services
• Circuit board design and manufacturing

High-quality image data transmission is achieved through circuit design and pattern design compliant with various interfaces/protocols.

• Image Processing Board
• Image Transmission Equipment
• Surveillance Camera System

With the 'ADAMS = Advanced Design and Manufacturing Solutions' system, we achieve short TAT and turn our customers' ideas into 'forms' through a one-stop service. We promise a smooth transition from prototyping to mass production with our comprehensive capabilities. Thanks to our integrated system at PWB, we can assist you from any stage of the process!

• Printed Circuit Board
• Other machine tools
• Prototype Services

We can provide a comprehensive service from specification examination, circuit design, pattern design, board manufacturing, to assembly for boards equipped with various companies' FPGAs. We also offer functional testing of the finished products upon request.

• Printed Circuit Board
• Other semiconductors
• Prototype Services

Flip chip mounting is one method of mounting bare chips. Compared to wire bonding, it allows for a smaller mounting area and has better electrical characteristics due to shorter wiring. Even though it is called flip chip mounting, there are multiple mounting methods available, and we can propose a method based on your requirements. - It can accommodate a minimum pitch of 80 microns. - It is also possible to mix mount with SMT components.

• Printed Circuit Board
• Prototype Services
• Other semiconductors

Printed circuit board design technology utilizing transmission line simulation and EMI suppression support tools.

• Printed Circuit Board
• Other semiconductors
• Prototype Services

Printed circuit board design technology utilizing transmission line simulation and EMI suppression support tools.

• Printed Circuit Board
• EMC countermeasure products
• Prototype Services

If it is not possible to increase the wiring width due to reasons such as wanting to carry a large current, not being able to change the substrate size, or not being able to secure component space, we propose a design that uses thick copper to ensure the current capacity.

• power supply
• Printed Circuit Board
• Prototype Services

◆High-Speed Digital Signal Design - Calculation of optimal L/S values for impedance matching based on design specifications and scale. - Implementation of various proposals based on the know-how of experienced staff. - HDMI 2.0 has a proven track record of high-speed signal design at up to 6GHz.

• Printed Circuit Board
• Other semiconductors
• Prototype Services

In semiconductor test boards, we accommodate the design of high-speed signals of various standards. Based on our past experience, we provide appropriate PCB design.

• Printed Circuit Board

Our company has built the ADAMS system, which internalizes all aspects of software, hardware, enclosure design, circuit board design, manufacturing, and assembly. This allows us to provide faster and more appropriate services in response to the various demands of our customers' product development through close collaboration in each area.

• Other CAD

Our company has established the ADAMS system, which internalizes all aspects of software, hardware, enclosure design, circuit board design, manufacturing, and assembly. This allows us to provide comprehensive services, from individual support for product development to total support, including OEM/EMS.

• Embedded system design service

We are capable of manufacturing everything from thin multi-layer substrates to thick high multi-layer substrates, and we also accommodate rapid prototyping from a single piece as well as production from small to large lots. Among these, the semiconductor tester boards represent the culmination of our long-standing expertise in substrate manufacturing, with technology applied to fine patterns, high multi-layer, high aspect ratio plating, impedance control, and the production of low dielectric constant materials.

• Contract manufacturing

We respond to customer needs, including the procurement of small quantities of prototype parts, implementation assembly, manufacturing and implementation support for flip chip mounting boards, lead-free implementation support, and rework support for BGA/CSP devices. We provide quality assurance through X-ray inspection equipment and image inspection equipment.

• Contract manufacturing