1~7 item / All 7 items
Displayed results
Filter by category

Printed circuit board, FPC
We will extract and propose appropriate reliability evaluation and testing based on the anticipated failure modes. We also accept failure analysis. - Insulation testing - Insulation withstand voltage testing - Thermal shock testing - Solder wettability testing - Bending test (FPC) - X-ray observation, cross-sectional observation - Grain boundary investigation using FIB