ユーロフィンFQL List of Products and Services

In non-destructive analysis, we understand the failure occurrence situation and infer the failure mechanism from visual observation and electrical characteristics. Lock-in infrared thermal analysis When precise location identification is difficult in a non-destructive manner, focusing on heat generation and comparing it with good products is effective. - There are multiple components related to abnormal phenomena, such as mounted circuit boards. - It is unclear whether the short circuit is inside a component or externally at a solder joint. [Examples] - Chip capacitors - Power ICs - Printed circuit boards Ultrasonic flaw detection (SAT) While it is known that delamination inside ICs can be observed, it is also suitable for checking the condition of items composed of multiple materials. [Examples] - Bonding areas of cosmetic panels - Junctions of aluminum heat sinks - Interiors of die-cast products *For more details, please refer to the PDF document or feel free to contact us.

Eurofins FQL provides failure analysis for a variety of products, from circuit components such as semiconductors, printed circuit boards, and connectors to OEM and ODM products. If you have concerns such as "I want to conduct failure analysis but do not have sufficient equipment" or "I have doubts about the manufacturer's failure analysis report," please feel free to contact us. 【Leave it to us】 ■ Investigation Plan: Understanding failure phenomena and planning analysis methods to confirm usage conditions ■ Non-destructive Analysis: Narrowing down abnormal areas non-destructively ■ Destructive Analysis: Estimating causes through observation and analysis of the occurrence of abnormalities ■ Summary of Results: Summarizing analysis results and proposing improvements *For more details, please refer to the PDF materials or feel free to contact us.

We offer package opening for ICs using copper (Cu) wires, silver (Ag) wires, and more, utilizing our uniquely developed method to minimize wire dissolution and damage. We also accept package opening for resin-sealed power modules, such as high-voltage and high-current components like IGBTs, which are difficult to open due to the high content of fillers.

Experts in various components such as semiconductors, cables and connectors, printed circuit boards, display devices like LCDs, power units, batteries, AC adapters, and memory will conduct failure analysis. - Perform semiconductor package resin opening, and estimate causes through observations using optical microscopes, emission microscopes, and scanning electron microscopy (SEM) with mechanical polishing. - From the perspective of material analysis, estimate causes through processing and observation using focused ion beam processing observation equipment (FIB-SEM), and observation using transmission electron microscopy (TEM) for material condition, foreign matter identification, surface/break analysis, etc. *For more details, please refer to the PDF document or feel free to contact us.*

We provide high-quality circuit processing and wiring processing services using FIB, including cutting and changing connection points of fine wiring in the lower layers, processing fine wiring located beneath wide power wiring, and the urgent delivery of functioning LSI. - Both AL wiring and Cu wiring can be processed. - We accept orders starting from just one piece. - We will propose the optimal processing points during consultations. - We can accommodate special sample shapes. Please consult with us.

Our company offers "reliability evaluation/environmental testing" services. We own over 100 testing machines and chambers, including thermal shock testers and gas corrosion testers. We can accommodate a wide variety of tests tailored to your needs, from standard-compliant tests to lifespan limit tests, as well as providing rental of testing chambers and conducting customized tests. Please feel free to contact us. 【Available Reliability Tests / Environmental Tests (partial list)】 ■ Thermal Shock Test (Gas Chamber / Liquid Chamber) ■ High Temperature and High Humidity Storage Test ■ Gas Corrosion Test ■ Accelerated Weather Resistance Test ■ Vibration Test ■ Salt Spray Test ■ Safety Tests (Crush Test, Heating Test, Charge/Discharge Test)

We conduct accelerated degradation tests tailored to your needs, based on our extensive testing expertise and know-how cultivated over many years in quality assurance for various electronic devices, in addition to tests compliant with various public specifications. From the information gathered regarding how the product is used and any issues faced, we will "materialize" and propose accelerated degradation tests suitable for your product. Please feel free to consult us from the component selection and evaluation stage. 【Features】 - In addition to general temperature, humidity, and voltage application, we dynamically and automatically control the applied voltage to be optimal even during insulation degradation, allowing for confirmation of worst-case scenarios after insulation degradation. - In addition to planning and conducting accelerated degradation tests, we can provide one-stop support for everything from identifying insulation degradation points after the test to requests for microscopic imaging of degradation and disconnection points, as well as component analysis. - We possess a wide variety of environmental test chambers and evaluation equipment.

We accept contracts for reliability evaluations, environmental testing, and safety assessments in accordance with various standards. If any issues arise after implementation, we also conduct cause investigations. Furthermore, based on a standard test, we propose the realization of difficult tests through coordinated control of multiple devices (developing software and test fixtures as needed). ■ Overview Are you giving up on achieving the desired reliability evaluations, environmental tests, and reproducibility tests because conventional testing machines cannot set the desired test conditions or multiple test conditions for reproducing issues? By coordinating control of power supplies, electronic loads, constant temperature chambers, multimeters, bidirectional power supplies, and more, we conduct reliability evaluations, environmental tests, and reproducibility tests tailored to your needs! - We select the necessary equipment for coordinated control based on your requirements and develop a testing plan. - You only need to prepare the test samples. We will prepare other equipment and coordinated control. - We flexibly respond to various sensor integrations and fixture manufacturing as needed. ■ Key Points Even if the evaluation tests you want to conduct cannot be performed with existing testing equipment, it may be possible to realize them by coordinating control with physical wiring switching circuits and various sensors. Please feel free to consult with us.

There are many standard tests that are recommended to verify products for sale. For example: - JIS standards (JIS C 60335-1 Safety of household electrical appliances, etc.) - IEC standards (IEC 61960 Batteries for portable devices, etc.) - UL standards (UL 1642 Lithium batteries, etc.) and so on. We undertake public standards applicable to household and commercial electrical products. ■ Do you have any of these concerns? ■ - I want to conduct standard tests on developed or purchased products, but I do not own testing equipment. - A business partner has requested the implementation of standard tests, but I have no experience. - I cannot determine whether the test results from the supplier are appropriate.

When power semiconductors and power modules are repeatedly turned ON and OFF, the self-heating and cooling of the components and modules cause distortion due to the differences in expansion of the bonding materials, leading to a deterioration in bonding reliability. We offer power cycle testing that takes into account the heating operation due to repeated self-heating and cooling cycles. ■ Components, units, and devices where the adoption of power semiconductors and power modules is progressing: - Traction inverters for electric vehicles (EVs) and hybrid electric vehicles (HEVs) - On-board chargers and DC-DC converters - Motor control, robots, machine tools, elevators - Industrial inverters and uninterruptible power supplies (UPS) - Solar power generation systems and wind power generation systems

Power modules such as IGBTs (Insulated Gate Bipolar Transistors) for high voltage and large current components often contain a significant amount of fillers in the package sealing resin, making it difficult to open the resin. We can remove the package resin using chemical agents for internal observation and, depending on your requirements, conduct evaluations, analyses, and assessments of the internal components after opening. *Please provide a trial sample for opening in advance so we can confirm whether it can be opened (free of charge). *IGBT (Insulated Gate Bipolar Transistor) is a type of power semiconductor capable of high-speed switching for large power.