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ユーロフィンFQL

EstablishmentApril 1, 1994
capital10000Ten thousand
number of employees56
addressKanagawa/Kawasaki-shi, Saiwai-ku/Shin-Kokura 1-1
phone044-330-3445
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last updated:May 30, 2025
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ユーロフィンFQL List of Products and Services

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Process Improvement Support | CMMI Process Improvement Support | CMMI
Support for the establishment of a quality assurance system Support for the establishment of a quality assurance system
Contract services for the automotive and in-vehicle sectors. Contract services for the automotive and in-vehicle sectors.
Process Building Support | Automotive SPICE Process Building Support | Automotive SPICE
Quality education and human resource development Quality education and human resource development
Environmental survey and corrosion environment diagnosis Environmental survey and corrosion environment diagnosis
Reliability evaluation tests and environmental tests for electronic components and electronic devices. Reliability evaluation tests and environmental tests for electronic components and electronic devices.
Safety evaluation, circuit verification, failure analysis Safety evaluation, circuit verification, failure analysis
Failure analysis and good product analysis Failure analysis and good product analysis
Technical data Technical data
AC adapter AC adapter
Circuit components (resistors, capacitors, transistors, diodes, etc.) Circuit components (resistors, capacitors, transistors, diodes, etc.)
Semiconductors (LSI, IC), power modules Semiconductors (LSI, IC), power modules
Connector and cable Connector and cable
Printed circuit board, FPC Printed circuit board, FPC
Battery (lithium-ion battery and others) Battery (lithium-ion battery and others)
LCD and touch panel LCD and touch panel
HDD, SSD, flash memory HDD, SSD, flash memory
Failure

Failure analysis and good product analysis

We offer contract services for failure analysis of electronic components and devices, verification of material-related properties, and detailed analysis of defects. - Experts in various components such as semiconductors, cables and connectors, printed circuit boards, LCDs and other display devices, power supplies, batteries, AC adapters, and memory will assist you. - Product investigations to aid in good product analysis as a quality check, and authenticity determination of market-distributed and stock items. - Product quality evaluation and failure analysis using methods such as circuit analysis, waveform analysis, good product capability analysis, forced reproduction investigations through various limit tests, and circuit simulator investigations. - Observation of nano-level structures, foreign substance analysis, and surface analysis.

Failure analysis of electronic devices and components

From investigating the mechanisms of failures and malfunctions to proposing improvement measures and verifying their effectiveness, our expert engineers provide total support!

Eurofins FQL provides failure analysis for a variety of products, from circuit components such as semiconductors, printed circuit boards, and connectors to OEM and ODM products. If you have concerns such as "I want to conduct failure analysis but do not have sufficient equipment" or "I have doubts about the manufacturer's failure analysis report," please feel free to contact us. 【Leave it to us】 ■ Investigation Plan: Understanding failure phenomena and planning analysis methods to confirm usage conditions ■ Non-destructive Analysis: Narrowing down abnormal areas non-destructively ■ Destructive Analysis: Estimating causes through observation and analysis of the occurrence of abnormalities ■ Summary of Results: Summarizing analysis results and proposing improvements *For more details, please refer to the PDF materials or feel free to contact us.

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Non-destructive analysis and non-destructive testing (lock-in thermography, ultrasonic testing)

We select the optimal non-destructive analysis from lock-in infrared thermal analysis, 3D X-ray tomography, ultrasonic testing (SAT), etc., and narrow down the abnormal areas.

In non-destructive analysis, we understand the failure occurrence situation and infer the failure mechanism from visual observation and electrical characteristics. Lock-in infrared thermal analysis When precise location identification is difficult in a non-destructive manner, focusing on heat generation and comparing it with good products is effective. - There are multiple components related to abnormal phenomena, such as mounted circuit boards. - It is unclear whether the short circuit is inside a component or externally at a solder joint. [Examples] - Chip capacitors - Power ICs - Printed circuit boards Ultrasonic flaw detection (SAT) While it is known that delamination inside ICs can be observed, it is also suitable for checking the condition of items composed of multiple materials. [Examples] - Bonding areas of cosmetic panels - Junctions of aluminum heat sinks - Interiors of die-cast products *For more details, please refer to the PDF document or feel free to contact us.

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Destructive analysis (material analysis, fracture surface analysis, FIB, TEM, etc.)

We will conduct failure analysis of electronic components and observe and analyze the failure locations through material analysis.

Experts in various components such as semiconductors, cables and connectors, printed circuit boards, display devices like LCDs, power units, batteries, AC adapters, and memory will conduct failure analysis. - Perform semiconductor package resin opening, and estimate causes through observations using optical microscopes, emission microscopes, and scanning electron microscopy (SEM) with mechanical polishing. - From the perspective of material analysis, estimate causes through processing and observation using focused ion beam processing observation equipment (FIB-SEM), and observation using transmission electron microscopy (TEM) for material condition, foreign matter identification, surface/break analysis, etc. *For more details, please refer to the PDF document or feel free to contact us.*

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Destructive analysis | Package opening (decapping)

Are you having trouble with decapping (resin opening, package opening), which is essential for failure analysis of ICs and semiconductors?

We offer package opening for ICs using copper (Cu) wires, silver (Ag) wires, and more, utilizing our uniquely developed method to minimize wire dissolution and damage. We also accept package opening for resin-sealed power modules, such as high-voltage and high-current components like IGBTs, which are difficult to open due to the high content of fillers.

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Material analysis

Analysis of the causes of defects originating from materials and material development. We support this through nano-level structural/surface analysis.

Even if the cause of a failure or manufacturing defect is on the scale of just a few atoms, Eurofins FQL will pursue it. Based on insights from analytical instruments that examine sizes on the scale of a few atoms, including transmission electron microscopes, we support the improvement of product quality. If you have concerns such as wanting to identify the nature of foreign substances attached to products or parts but don't know how to proceed, please feel free to contact us. 【Features】 ■ Pursuing the cause of failures or manufacturing defects even if it is on the scale of just a few atoms ■ Supporting product quality improvement based on insights from analytical instruments that examine sizes on the scale of a few atoms, including transmission electron microscopes, and knowledge of the materials themselves.

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Quality verification of OEM products, supplier management, market research.

We undertake part of the supplier quality management tasks, such as quality verification of OEM products from supplier factory audits and market research to assist in determining the authenticity of market products!

Do you have any concerns about your purchases? - You want to conduct a supplier process audit but lack the resources. - You are using OEM products, but you are worried that 4M changes have been made without your knowledge, resulting in differences from the original specifications. - You are concerned that the products in the market may be counterfeit. - You want to verify the contents of purchased units or parts, but you lack the know-how and equipment, making it difficult to determine if they are genuine. *For more details, please refer to the PDF document or feel free to contact us.*

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Storage product evaluation analysis (HDD, SSD, flash memory, etc.)

We accept evaluations of HDDs, SSDs, flash memory, data recovery, and characteristic assessments.

We provide one-stop support for long-term reliability evaluation of HDDs/SSDs/removable media, investigation of failure causes that occurred after adoption, and data recovery/deletion. We also accept requests for verification of electrical characteristics for issues with flash memory (e.g., unable to write/read).

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Corrosion environment diagnosis/countermeasures

Support for improving equipment management and quality issues related to corrosion from the perspectives of corrosive environments and corrosion resistance!

We provide support for improving equipment management and quality issues related to corrosion from two perspectives: corrosive environments and corrosion resistance. - Diagnosis of corrosive environments in equipment and workplaces through the use and analysis of corrosion environment diagnostic kits (Eco Checker II, Eco Checker SUN) - Enhancing maintenance efficiency of equipment by visualizing the deterioration status of products in operation - Evaluation of product corrosion resistance - Salt damage investigation - Salt spray testing (composite cycle) - Gas corrosion testing - Temperature and humidity testing

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Contracted services related to regulatory compliance of chemical substances in products.

Wide-ranging support related to legal regulations on chemical substances in products, including product evaluation/analysis, education, information provision, and CMS development!

■ Analysis of Regulated Chemical Substances in Products - Comprehensive analysis of products and modules, fluorescent X-ray screening, chemical analysis - Analysis of substances contained in RoHS regulations (6 prohibited substances, 4 phthalate esters) ■ Basic Education on Chemical Substance Management in Products - Explanation of the legal regulations regarding chemical substances contained in products, what actions to take to respond to changing regulations, and key points for managing and operating chemical substances in products. ■ Training for Auditors of Chemical Substance Management Systems - Education aimed at improving the diagnostic skills of auditors in CMS - On-the-job training support when diagnosing CMS at customer sites ■ Information Provision Service on Legal Regulations for Chemical Substances in Products - Providing the latest trends in legal regulations for managing chemical substances in products and specific examples of Fujitsu's responses.

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Free Seminar | Reliability Evaluation, Analysis, Quality Technology, Quality Assurance

We are holding a "free seminar" on reliability evaluation, analysis, and quality technology.

Although it is irregular, we hold "free seminars" on quality technology, including reliability evaluation, analysis, and other topics, several times a year. ■Examples of themes■ We send out announcements of the seminars to customers who have subscribed to our company’s email newsletter. In addition to free seminars, we also provide information about special campaigns and offers. We encourage you to consider registering.

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Au plating terminal corrosion investigation

If the surface of the gold-plated terminals of connectors, etc., has discolored or has foreign substances attached, there is a possibility that the gold plating is corroded.

Are there any green or white foreign substances attached to the surface of the gold-plated terminals? This may be a sign of corrosion occurring on the gold-plated terminals. Gold does not corrode, but the underlying metal beneath the gold plating can corrode. Corrosion issues with gold-plated terminals occur when the underlying metal corrodes and deposits on the gold plating. If corrosion products get caught in the connector's mating area, it can lead to poor contact. - There are visible defects on the surface of the gold-plated terminals with green, white, or black foreign substances. - I want to improve corrosion with the supplier, but I cannot obtain evidence of corrosion.

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Fracture Analysis / Cause Analysis of Fracture

The reason why it broke, such as plastic or metal, is left on the fracture surface.

Cracks and fractures can occur in products due to various reasons: - Fracture caused by excessive external stress - Fracture due to repeated external stress applied in a specific direction - Fracture caused by the degradation of resin, making it brittle By observing the fracture surfaces of metal and resin materials that have been broken due to external forces, we can estimate the causes that led to the failure.

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LSI circuit correction

We provide high-quality circuit processing and wiring processing services using FIB. We achieve a high processing yield!

We provide high-quality circuit processing and wiring processing services using FIB, including cutting and changing connection points of fine wiring in the lower layers, processing fine wiring located beneath wide power wiring, and the urgent delivery of functioning LSI. - Both AL wiring and Cu wiring can be processed. - We accept orders starting from just one piece. - We will propose the optimal processing points during consultations. - We can accommodate special sample shapes. Please consult with us.

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Commissioned Testing | Standard Testing for Household and Commercial Electrical Products - JIS, UL, IEC, etc.

Are you having trouble conducting the necessary standard tests for the sale of new products? We offer testing services for public standards applicable to household and commercial electrical products!

There are many standard tests that are recommended to verify products for sale. For example: - JIS standards (JIS C 60335-1 Safety of household electrical appliances, etc.) - IEC standards (IEC 61960 Batteries for portable devices, etc.) - UL standards (UL 1642 Lithium batteries, etc.) and so on. We undertake public standards applicable to household and commercial electrical products. ■ Do you have any of these concerns? ■ - I want to conduct standard tests on developed or purchased products, but I do not own testing equipment. - A business partner has requested the implementation of standard tests, but I have no experience. - I cannot determine whether the test results from the supplier are appropriate.

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Evaluation of the lifespan and deterioration diagnosis of market operating devices and equipment.

Operating equipment and machinery. Understanding remaining lifespan and how many more years they can be used. Lifespan predictions in environments different from product usage conditions. Visualizing the degradation of operating devices!

In response to your company's request for "visualization and quantification" of equipment degradation and product lifespan, we will alleviate the invisible concerns. By visualizing and quantifying the degree of degradation and remaining lifespan of equipment currently in operation and use in the field, you can grasp the timing for maintenance and replacement. This is especially important when using products in special environments that differ from the original installation conditions, as more careful analysis is required. Eurofins FQL, with its extensive experience in the fields of electronic device and component reliability evaluation, failure analysis, and analysis, will assist you in solving challenges by combining various measurement and analysis methods.

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Power Cycle Test | Reliability Evaluation of Power Modules and Power Devices

Reliability evaluation of power modules and power devices. We offer proposals from the construction of test environments tailored to your power cycle specifications to investigation and analysis!

When power semiconductors and power modules are repeatedly turned ON and OFF, the self-heating and cooling of the components and modules cause distortion due to the differences in expansion of the bonding materials, leading to a deterioration in bonding reliability. We offer power cycle testing that takes into account the heating operation due to repeated self-heating and cooling cycles. ■ Components, units, and devices where the adoption of power semiconductors and power modules is progressing: - Traction inverters for electric vehicles (EVs) and hybrid electric vehicles (HEVs) - On-board chargers and DC-DC converters - Motor control, robots, machine tools, elevators - Industrial inverters and uninterruptible power supplies (UPS) - Solar power generation systems and wind power generation systems

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Equipment Specifications | Main Environmental Testing Equipment

Introducing our facilities used for reliability evaluation and environmental testing of materials for industrial products and consumer goods, not limited to electronic components and devices!

We would like to introduce environmental testing equipment used for reliability evaluation and environmental testing of not only electronic components and devices but also industrial products and consumer goods materials. Upon consultation, we can place your samples into the testing equipment under specified conditions and provide you with the data and samples after the tests are completed. If you wish to entrust testing to an evaluation organization, do not own testing tanks, or are temporarily unable to use them, please check the equipment specifications when considering outsourcing reliability evaluation tests. *The catalog of equipment specifications listed is only a portion of what we own. For further details, please check our company website.

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Destructive analysis | Power module package opening (decap)

Are you having trouble with the resin opening of power modules such as IGBTs, which contain a high amount of filler in the package sealing resin for high voltage and large current components?

Power modules such as IGBTs (Insulated Gate Bipolar Transistors) for high voltage and large current components often contain a significant amount of fillers in the package sealing resin, making it difficult to open the resin. We can remove the package resin using chemical agents for internal observation and, depending on your requirements, conduct evaluations, analyses, and assessments of the internal components after opening. *Please provide a trial sample for opening in advance so we can confirm whether it can be opened (free of charge). *IGBT (Insulated Gate Bipolar Transistor) is a type of power semiconductor capable of high-speed switching for large power.

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