ユーロフィンFQL List of Products and Services

Our company offers "reliability evaluation/environmental testing" services. We own over 100 testing machines and chambers, including thermal shock testers and gas corrosion testers. We can accommodate a wide variety of tests tailored to your needs, from standard-compliant tests to lifespan limit tests, as well as providing rental of testing chambers and conducting customized tests. Please feel free to contact us. 【Available Reliability Tests / Environmental Tests (partial list)】 ■ Thermal Shock Test (Gas Chamber / Liquid Chamber) ■ High Temperature and High Humidity Storage Test ■ Gas Corrosion Test ■ Accelerated Weather Resistance Test ■ Vibration Test ■ Salt Spray Test ■ Safety Tests (Crush Test, Heating Test, Charge/Discharge Test)

We provide one-stop support for long-term reliability evaluation of HDDs/SSDs/removable media, investigation of failure causes that occurred after adoption, and data recovery/deletion. We also accept requests for verification of electrical characteristics for issues with flash memory (e.g., unable to write/read).

Experts in various components such as semiconductors, cables and connectors, printed circuit boards, display devices like LCDs, power units, batteries, AC adapters, and memory will conduct failure analysis. - Perform semiconductor package resin opening, and estimate causes through observations using optical microscopes, emission microscopes, and scanning electron microscopy (SEM) with mechanical polishing. - From the perspective of material analysis, estimate causes through processing and observation using focused ion beam processing observation equipment (FIB-SEM), and observation using transmission electron microscopy (TEM) for material condition, foreign matter identification, surface/break analysis, etc. *For more details, please refer to the PDF document or feel free to contact us.*

In non-destructive analysis, we understand the failure occurrence situation and infer the failure mechanism from visual observation and electrical characteristics. Lock-in infrared thermal analysis When precise location identification is difficult in a non-destructive manner, focusing on heat generation and comparing it with good products is effective. - There are multiple components related to abnormal phenomena, such as mounted circuit boards. - It is unclear whether the short circuit is inside a component or externally at a solder joint. [Examples] - Chip capacitors - Power ICs - Printed circuit boards Ultrasonic flaw detection (SAT) While it is known that delamination inside ICs can be observed, it is also suitable for checking the condition of items composed of multiple materials. [Examples] - Bonding areas of cosmetic panels - Junctions of aluminum heat sinks - Interiors of die-cast products *For more details, please refer to the PDF document or feel free to contact us.