Machine elements and parts

日精 本社

EstablishmentDecember 16, 1953
capital45000Ten thousand
number of employees300
addressTokyo/Minato-ku/1-18-17 Nishi-Shinbashi (Meisan Nishi-Shinbashi Building)
phone0335029579
last updated：
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日精 Product Lineup

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Universal Bond Tester Universal Bond Tester
Various semiconductor/substrate-related equipment Various semiconductor/substrate-related equipment
Various appearance inspection devices Various appearance inspection devices
Various cleaning devices/units Various cleaning devices/units
Dicing device Dicing device
Small-sized substrate antenna Small-sized substrate antenna
Various semiconductor-related cleaning equipment Various semiconductor-related cleaning equipment
Ultrafine bubbles (nanobubbles) Ultrafine bubbles (nanobubbles)
Biometric authentication Biometric authentication
Freeze dryer Freeze dryer
Switch Switch
UHF band tag inlet UHF band tag inlet
HF band tag and inlet HF band tag and inlet
NFC tag inlet NFC tag inlet
HF band products HF band products
UHF band products UHF band products
Other products Other products
NFC

NFC tag inlet

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