日精 Product Lineup

This is a device specialized for the production of cross-sectional observation samples that can simultaneously "cut" and "polish" using the cutting surface polishing effect of "ultrasonic cutting technology" (PolishCutTM). It is particularly used in situations where many cross-sectional observation samples are being produced. We also have a demo environment where you can actually cut your samples and evaluate them, so please feel free to contact us. 【Features】 ■ Clean cutting surface ■ Accurate cutting at the targeted position ■ Cutting of invisible objects by overlaying X-ray images with monitor images ■ Skill-free production of cross-sectional observation samples ■ Can be used as a pre-treatment device for ion milling to reduce milling time *For more details, please contact us or download the PDF for more information.

The cross-section sample preparation device "CSX-100Lab" is a specialized device that utilizes the cutting surface polishing effect (PolishCut) of our uniquely developed "ultrasonic cutting technology" to simultaneously perform "cutting" and "polishing." It is ideal for improving the efficiency of cross-sectional observation, failure analysis, defect analysis, structural analysis, and verification of manufacturing conditions. Features include: 1) clean cross-sections, 2) precise cutting at targeted positions, 3) cutting of invisible objects by overlaying drawings or X-ray images with monitor images (skeleton cut option), 4) skill-free cross-section sample preparation, 5) reduction of milling time when used as a pre-treatment device for ion milling during SEM observation, and 6) cross-sectional observation of small chip components like 0402. It is particularly used in situations where many cross-section samples are prepared. We also have a demo environment where you can evaluate the actual cutting of your samples, so please feel free to contact us!

The mass production ultrasonic dicing device "CSX501" is a dicing machine that cuts difficult materials such as SiC, GaN, and fine ceramics with high speed and precision. The ultrasonic-assisted cutting with "CSX501" adds ultrasonic assistance to the "force generated by the rotation of the blade," allowing the blade to "vibrate in the outward direction" while cutting. This technology enables the achievement of improved throughput, reduced running costs, and increased yield while maintaining high-quality cutting. Furthermore, the addition of device monitoring functions allows for remote support, contributing to a reduction in recovery time from unexpected troubles. Additionally, by equipping various optional functions, it also contributes to the control of blade edge shapes and the reduction of cutting burrs. *We also conduct evaluations by cutting sample work upon request, so please feel free to contact us. *For more details, please refer to the PDF materials.

We would like to introduce the "Thin Plate Compatible Clean Roller." The "RY-1106 Series" utilizes a new type of clean roll with a small diameter, making it possible to remove dust from thin plates and films. Additionally, by adopting a magnetic gear in the drive section of the device, we suppress minute dust generation from the gear part. We also offer the "RFC-705A" and "RF-705A." 【Features】 ■ Prevents dropping ■ Clean roll that prevents entanglement ■ Uses magnetic gear in the drive section ■ Capable of cleaning 50μm workpieces ■ Customized products Designed and manufactured to fit the customer's work size * We also accept demo evaluations to determine if removal is possible with samples provided. * For more details, please refer to the PDF document or feel free to contact us.

We propose customized unit rollers tailored to your needs. We accommodate various specifications for roll-to-roll lines and vertical path lines, as well as designs for fixed installation units in line equipment. Our solutions are ideal for dust removal from films, substrates, and glass panels. 【Features】 - Manufactured to order according to customer requirements. - Capable of responding to various requests for installation and mounting in existing lines and equipment. - We can produce unit rollers up to 2,600mm based on our track record. - Suitable for long products in raw material processes and slitting processes. - Enhanced structural strength improves adhesion to products, allowing for high-speed flow rates of up to 250m/min. *We also accept demo evaluations to determine if removal is possible with samples provided. *For more details, please refer to the PDF document or feel free to contact us.

In the semiconductor industry, accurate cross-sectional observation of finely processed components is essential for product quality control and yield improvement. It is particularly important to detect subtle defects and structural issues early in the manufacturing process and take appropriate measures. Traditional cross-section sample preparation requires time and specialized skills, hindering efficient analysis. Our ultrasonic cutting device addresses these challenges and streamlines SEM observation. 【Usage Scenarios】 - Cross-sectional observation of finely processed semiconductor devices - Failure analysis, defect analysis - Verification of manufacturing conditions 【Benefits of Implementation】 - Cross-sections are finished very cleanly, improving observation accuracy - No specialized skills are required, allowing anyone to produce stable cross-sections - Significantly reduces ion milling time before SEM observation