Shinwa Co., Ltd. List of Products and Services

There are many inspection needs for the interior of metals, such as wire bonding and interposers, but visual inspection and destructive testing are still mainstream. IL Technology's inspection equipment detects cracks and voids inside metals with high precision by briefly irradiating with a laser and measuring the temperature response. This is a new solution that can also identify joint strength and hidden defects. Of course, there is no damage to the inspection target! ■ Main inspection targets include: - Through holes of interposers - Joint strength of wire bonding - Solder bumps The materials and sizes we can handle, as well as comparisons with other inspection methods, are introduced in the materials. If you would like more detailed information, please feel free to contact us.

• Other measurement, recording and measuring instruments

We introduce a photonic debonding device that accelerates the peeling process from temporary bonding, starting with semiconductor manufacturing processes. This device converts light into heat and achieves fast and clean debonding through unique technology. Since it does not apply stress to the device, it meets various debonding needs, including delicate devices like thin wafers. 【Main Benefits】 ▶ Capable of irradiating and debonding a wide area at once, suitable for large substrates ▶ No ash generation, simplifying the cleaning process ▶ Limited heat transfer to the device, almost no stress ▶ Reusable carrier ▶ Easy maintenance If you are interested in usage images or actual application examples, please take a look at the materials.

• Other semiconductor manufacturing equipment

A new model of our ultra-precision dispenser device, the 'Quspa' series, widely adopted in various manufacturing processes in semiconductors, has been launched. In addition to improvements in speed, precision, and miniaturization, our proprietary features and basic specifications can be customized as needed, providing overwhelming flexibility. 【Features】 ■ Custom-Made We propose specifications and functions tailored to your needs, such as Clean 100 and wafer transport compatibility. Dedicated designs are also available. ■ Achieving Incredible Miniaturization Maximizing the performance of the jet dispenser to achieve cream solder at 110μm, epoxy thermosetting resin at 80μm, UV adhesive at 100μm, and more. ■ Leave Complex Teaching to Us Smartly creating teaching for random application positions. Furthermore, the accuracy of non-stop application has dramatically improved. ■ Open Network Affordable and capable of connecting to various industrial networks. Enables integration of a wide range of products.

• Other semiconductor manufacturing equipment

A new model of our ultra-precision dispenser device series 'Quspa', widely adopted in substrate mounting and underfill processes in semiconductors, has been released. It demonstrates excellent positional accuracy even during high-speed continuous dispensing, reducing the tact time by up to approximately 50% compared to conventional stop-and-go application (theoretical value). This contributes to improved productivity. *Compared to our conventional models. It also achieves high-precision solder jet application within a diameter of ±20μm. It is compatible with various dispensing materials, including epoxy thermosetting resins, cream solder, and silicone-based thermosetting resins. [Features] ■ Achieves astonishing miniaturization: Cream solder at 110μm, epoxy thermosetting resin at 80μm, UV adhesive at 100μm, etc. ■ Improved dynamic positional accuracy: Application position accuracy within 3σ10μm (during non-stop jet application). ■ High-speed network: Network processing speed improved by 16 times (theoretical value). ■ Tact time reduction: Significant reduction in tact time due to improved processing speed. ■ GUI iconization: Intuitive screen operation possible. ■ Supports more workpieces: Standard equipped with coaxial displacement sensors. *For more details, please download the materials or contact us.

• Other semiconductor manufacturing equipment

☆☆☆ Shinwa Ultra-Precision Dispenser MsB ☆☆☆ - LED Post-Processing / Semiconductor Post-Processing → Achieves high precision and high-speed processing! (X-Y Repetition Accuracy: ±10μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ Flip-chip Underfill / BGA Underfill ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: φ150μm) ◆ Ag Paste (MIN: φ120μm) ◆ UV Curing Resin, etc.

• Assembly Machine

Sinwa Ultra-Precision Dispenser 【MsL】 - Semiconductor back-end processes (mainly Flip-chip Underfill) → Achieves high precision/high-speed processing! (X-Y repeat accuracy: ±5μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss, greatly improved production efficiency 【Applications】 ◆ Flip-chip Underfill ◆ MEMS & HDD ◆ General LED phosphors (SMD/side view/Dam & Fill, etc.) ◆ Cream solder (MIN: φ150μm) ◆ Ag paste ◆ UV curing resin, among others

• Circuit board processing machine

The JET Dispenser 'SPJ-22A' from Shinwa boasts top-class performance in the dispensing industry. Even with continuous operation, the application shape remains stable, enabling production that maintains high quality and high precision. It achieves industry-leading micro-dispensing with dot sizes of φ150μm and φ110μm. It is adaptable to various materials, but particularly excels with cream solder, having a wealth of proven results. Being non-contact, it is suitable for a wide range of applications. We also conduct free sample tests regularly, so please feel free to contact us. 【Application Products】 ■ Flexible substrates (difficult-to-print bases such as warping and expansion) ■ Component mounting inside connectors (three-dimensional structures) ■ 0402/0201 chip component mounting ■ Various modules / LED modules, etc. 【Main Contents of Free Sample Tests】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF materials or contact us directly.

• Circuit board processing machine

Introducing the jet dispenser (QJC3300A) capable of handling a wide range of applications across various industries (semiconductors/LED post-processing/smartphone component assembly). It precisely applies high-viscosity materials that tend to become unstable. Additionally, it is equipped with micro-dispensing and speed capabilities, enhancing productivity. 【Features】 ◆ Dispensing capability of less than 0.001mg ◆ Achieves room temperature dispensing of high-viscosity materials using piezo technology 　→ Reduces liquid splatter onto flip chips and substrates ◆ Realizes high-speed dispensing ◆ Achieves low running costs ◆ Simple software programming 【Applications】 ◆ Flip chip underfill / BGA underfill ◆ LED phosphors in general (SMD/side view/flip chip LEDs, etc.) ◆ Cream solder ◆ Ag paste ◆ Moisture-proof materials (conformal dispensing) ◆ UV-curable resins, etc. We offer free sample testing for those considering a purchase. For more details, please request documentation or refer to the catalog.

• Special Pump

This document provides detailed foundational knowledge and mechanisms for solving dispensing position issues, accommodating uneven substrates, and improving yield by switching from the "screen printing method" to the "solder jet dispense method." It serves as a textbook-like resource that can address various problems faced by production sites. 【Target Audience】 Printed circuit board manufacturers, various module manufacturers, implementation in three-dimensional structures, FPC manufacturers, etc. 【Contents】 ■ Advantages / Disadvantages of the screen printing method ■ List of technologies made possible by jet dispensers ■ List of applied products (target applications) *For more details, please refer to the PDF document or contact us directly.

• Circuit board processing machine

Dot dispensing, free line dispensing, and circular dispensing compatible 【Features】 ■ Achieves dispensing of φ0.20 mm or less ■ Realizes high-speed dispensing with piezoelectric drive system ■ Achieves low running costs 【Introduction of some contents of free sample test】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF document or contact us directly.

• Circuit board processing machine

☆☆☆Shinwa Precision Dispenser GP2☆☆☆ - Circuit Board Assembly Process & Post-LED Process → Achieves high precision and high-speed processing! (X-Y repeat accuracy: ±30μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ General LED phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream solder ◆ Ag paste ◆ UV curing resin　　　　　　　　　　　　　　Others

• Bonding Equipment

【Dispensing Industry Achieves Capability No.1】 Shinwa Screw Dispenser - LED Post-Processing / PCB Assembly Process ▶ Adjustment of dispensing amount based on screw rotation (Compatible with high-viscosity materials) ▶ Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 2 to 5 times processing capacity) ▶ Increased stability of dispensing amount through room temperature discharge ▶ Significant reduction in yield loss, increased production efficiency! 【Applications】 ■ Secondary Underfill ■ LED Phosphors (General) (SMD/Side View/Dam & Fill, etc.) ■ Cream Solder (φ250~φ300μm) * The dispensing diameter may vary depending on the solder particles used. ■ Ag Paste ■ UV Curing Resin, among others.

• Bonding Equipment

- LED post-process / substrate mounting process → Adjustment of application amount based on screw rotation (Compatible with high-viscosity materials) → Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 3 to 8 times processing capacity) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss, increased production efficiency!

• Assembly Machine

The screw dispenser precisely manages the amount of material applied by the rotation of the screw, allowing for stable application even with materials that are prone to changes over time, such as high-viscosity materials. (Example) Heat dissipation materials / Substrate mounting process ■ Air Dispenser ■ × Slow cycle time for discharging high-viscosity materials ■ Shinwa Screw Dispenser ■ ◎ Reduction in the number of equipment investments due to high-speed dispensing (Compared to air dispensers: 3 to 8 times processing capacity) ◎ Increased stability of application amount due to room temperature discharge ◎ Significant reduction in yield loss and increased production efficiency

• Assembly Machine

【Top-Class Capability in the Dispensing Industry】 - Semiconductor back-end process / LED back-end process → Supports high-density mounting. Achieves micro-dispensing in extremely small spaces. → Reduces the number of equipment investments through high-speed dispensing. → Increases stability of dispensing amount with room temperature discharge! → Significantly reduces yield loss and improves production efficiency! 【Applications】 ◆ Flip-chip Underfill ◆ General LED Phosphors (SMD/Side View/Flip-chip LED, etc.) ◆ Cream Solder ◆ Ag Paste ◆ Moisture-proof materials (Conformal Coating) ◆ UV Curing Resin　　　　　　　　　　　　　　 Others

• Special Pump