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  3. M.WATANABE & CO.,LTD.
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Electronic Components and Semiconductors
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M.WATANABE & CO.,LTD.

EstablishmentJuly 1952
capital8000Ten thousand
number of employees66
addressTokyo/Chuo-ku/2-16, 4-chome, Nihonbashi-Muromachi,
phone03-3241-5231
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last updated:Aug 08, 2025
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M.WATANABE & CO.,LTD. List of Products and Services

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Semiconductor-related products Semiconductor-related products
Solar cell-related products Solar cell-related products
Pure water system and wastewater treatment system Pure water system and wastewater treatment system
Disaster response-related equipment Disaster response-related equipment
Silicone rubber products Silicone rubber products
Ceramic-related Ceramic-related
Electrical and electronic materials Electrical and electronic materials
General industry General industry
Semiconductor-related

Semiconductor-related products

This is an introduction to semiconductor-related products.

Quartz Glass Products and Processed Quartz Glass Products 'Active in semiconductor manufacturing processes'

Our group companies manufacture quartz glass products. We have many delivery records to domestic and overseas semiconductor device manufacturers and silicon manufacturers.

Quartz glass products are made of quartz glass which are widely used in semiconductor manufacturing processes. 【Features】 ■We meet customer's needs. ・We can provide services that meet customer's needs by manufacturing at our group companies. ■High-precision products ・We manufacture high-precision products using jigs and tools designed in-house based on our know-how. ■Precision Guarantee ・High-precision products are measured by three-dimensional measuring machines to guarantee accuracy. ■Quartz glass products with excellent characteristics ・Quartz glass products have excellent chemical stability, heat resistance, light transmittance, and electrical insulation properties, not to mention high purity. *Quartz glass products are used in various industries including the semiconductor industry, LED and LCD panel manufacturing, and so on. *For more details, please contact us.

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Heat-resistant Glass Fiber (Siliglas) “High-temperature heat resistance”

Capable of handling long hours of continuous use even at temperatures as high as 1000 degrees C. Heat-resistant glass fiber "Siliglas"

Siliglas is a heat-resistant and heat-insulating material woven with high-purity, high-silicate glass fiber with a silica (SiO2) content of 96% or higher. 【Features】 ・No asbestos or refractory ceramic fiber (RCF) ・Heat resistance to continuous operation at 1000 degrees C for a long period of time. ・The flexibility of thermal shock resistance is kept against rapid cooling and heating. ・Excellent abrasion resistance and electrical insulation properties ・Excellent workability (small heating shrinkage) *We handle materials as an agent of Nippon Muki Co., Ltd. We also offer processing and sewing services according to the application. *For more details, please contact us or download the catalog to view.

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Surface Modification Treatment Processing and Jig Cleaning (TOMCO)

Maintenance of jigs and parts is from quality maintenance and improvement. Our thermal spraying and cleaning technology reproduces high quality without damaging the base material.

In addition to the cleaning and reconditioning technologies, that Tomco boasts a long track record of, we have achieved complete in-house production of thermal spraying, a surface modification technology in which powder is melted and coated on the surface of materials. 【Features】 ■ Achieving high densification, high insulation properties, wear resistance, and corrosion resistance ・We provide coating technologies that achieve high densification, high insulation properties, wear resistance, and corrosion resistance under thermal spraying conditions optimized for the materials and shapes of jigs and parts. ■High-quality reproduction of parts and jigs ・We provide high-quality reproduction of parts and jigs incorporated in vacuum chambers through our integrated production and management systems, from ultrasonic ultrapure water cleaning in our clean room to decompression drying and vacuum packing. ■We also support ultrapure water cleaning and vacuum packing. ・We support customers in the precision machinery field and other fields to improve their productivity through precision cleaning that removes invisible dirt and residual materials. ■Supporting productivity improvement ・We provide highly reproducible technical capabilities to always deliver products that are equivalent to evaluated products. *For more details, please contact us or download and view our catalog.

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Atmospheric Pressure CVD (APCVD) System for Small-scale Production and Development (D501)

For prototyping, development, and small lot production For deposition of NSG(SiO2)/BSG/PSG/BPSG Batch processing (simultaneous processing of multiple substrates) APCVD system

The D501 is a batch processing (multiple-unit simultaneous processing) atmospheric pressure CVD system (APCVD system) for small-volume production/testing and silicon oxide deposition (SiO2 deposition) on irregularly shaped substrates. 【Features】  ・Simultaneous processing of substrates of different shapes and sizes  ・High deposition speed  ・Simple maintenance  ・Small footprint  ・Low CoO (low running cost) 【Applications】  ・Interlayer insulating (NSG/PSG/BPSG)  ・Hard mask for diffusion/ion implantation, Sacrificial deposition (NSG)  ・Passivation deposition (protective deposition, insulating deposition) (NSG)  ・Source films for solid phase diffusion for solar cells (BSG, PSG)/Cap deposition (NSG) *For more details, please contact us or download the catalog for further information.

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High-performance Single-wafer Processing Atmospheric Pressure CVD (APCVD) System (A200V)

Small quantities and wide varieties. NSG(SiO2)/PSG/BPSG deposition. Single-wafer processing atmospheric pressure CVD (APCVD) system (Compatible with 8-inch SiC wafers)

A200V is a single-wafer processing atmospheric pressure CVD system (APCVD system) for silicon oxide (SiO2) deposition, such as interlayer insulating deposition, passivation deposition (protective deposition), and sacrificial deposition. 【Features】  ・Ideal for insulating depositions and diffusion/plasma mask depositions.  ・Low particle film deposition by single-wafer face-down deposition.  ・High safety and deposition stability by using a sealed chamber.  ・Wafer warp correction function (patented) for SiC wafers.  ・Low-load, long-cycle maintenance.  ・Compact cabinet and adjacent installation to the mirror type for space saving.  ・Low CoO (low running cost) 【Applications】  ・Interlayer dielectric deposition for power semiconductors (NSG/PSG/BPSG)  ・Hard mask for diffusion/ion implantation, Sacrificial depositions (NSG)  ・Passivation depositions (protective depositions, insulating depositions) (NSG)  ・Optical Waveguide (NSG/BPSG) *For more details, please contact us or download the catalog for further information.

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Continuous Atmospheric Pressure CVD System for solar cell mass production (AMAX1000S)

For mass production of crystalline Si solar cells/For NSG(SiO2)/PSG/BSG deposition High productivity/Continuous atmospheric pressure CVD (APCVD) system

AMAX1000S is a continuous atmospheric pressure CVD system (APCVD system) developed for solar cell products based on the achievements of the "AMAX" series. 【Features】  ・Compatible with 156 mm square/125 mm square wafers  ・High productivity of 1500 wafers per hour  ・Compatible with thin wafers for solar cells 【Applications】  ・Hard mask for diffusion/ion implantation, Sacrificial deposition (NSG)  ・Passivation deposition (protective deposition, insulating deposition) (NSG)  ・Source deposition for solid phase diffusion (BSG, PSG)/Cap deposition (NSG) *For more details, please contact us or download the catalog to view.

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High-productivity Continuous Atmospheric Pressure CVD (APCVD) System (AMAX800V)

Mass Production / NSG(SiO2)/PSG/BPSG deposition  High-productivity/Continuous atmospheric pressure CVD (APCVD) system (for up to 8-inch wafers)

The AMAX series is a continuous atmospheric pressure CVD system (APCVD system) for silicon oxide (SiO2) deposition, such as interlayer insulator deposition, passivation deposition (protective deposition), and back seal (for epitaxial wafers). 【Features】  ・High productivity of up to 100 wafers/hr. (wafer size: up to 8 inches)  ・No vacuum or plasma is required (thermal CVD)  ・SiC trays are used to prevent heavy metal contamination.  ・Simple maintenance.  ・Low CoO (low running cost) 【Applications】  ・Back seal for epitaxial wafers (NSG)  ・Interlayer insulator deposition for power semiconductors (NSG/PSG/BPSG)  ・Hard mask for diffusion/Ion implantation, Sacrificial deposition (NSG)  ・Passivation deposition (protective deposition, insulating deposition) (NSG) *For more details, please contact us or download the catalog for further information.

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High-productivity Continuous Atmospheric Pressure CVD (APCVD) System (AMAX1200)

Mass production / NSG(SiO2)/PSG/BPSG deposition High-productivity / Continuous atmospheric pressure CVD (APCVD) system (for 12-inch wafers)

The AMAX series is a continuous atmospheric pressure CVD system (APCVD system) for silicon oxide (SiO2) deposition, such as an interlayer insulator deposition, passivation deposition (protective deposition), and back seal (for epitaxial wafers). 【Features】  ・High productivity of up to 56 wafers/h (wafer size: up to 12 inches)  ・No vacuum or plasma is required (thermal CVD)  ・SiC trays are used to prevent heavy metal contamination.  ・Simple maintenance.  ・Low CoO (low running cost) 【Applications】  ・Back seal for epitaxial wafers (NSG)  ・Passivation deposition (protective deposition, insulating deposition) (NSG) *For more details, please contact us or download the catalog to view.

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Glass Substrate Deposition System “Low Temperature Deposition” “Flexible Substrate Support”

4.5 generation glass substrate deposition system for rigid/flexible devices such as FPD.

4.5 generation glass substrate deposition system for rigid/flexible devices such as FPD. 【Features】  ・Low temperature (150-300 degrees C) deposition  ・Deposition of 100 nm SiO2 film on 4.5 generation glass substrates at 250 degrees C with a throughput of 25 wafers/hour or more  ・Simple maintenance  ・Low CoO (low running cost)  ・High-quality SiO2 deposition formation: low stress, no plasma damage, small particles  ・Low installation and maintenance cost: small footprint, no need for vacuum or plasma     treatment 【Applications】  ・Insulating deposition for FPD (NSG)  ・Oxide semiconductor TFT passivation deposition (NSG) *For more details, please contact us or download the catalog to view.

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Spin Type Cleaning System WULF series for high definition photomasks

Equipped with a spin cleaning unit that uses tap water. This method utilizes a cleaning solution that replaces the RCA cleaning solution.

Our group company's cleaning system contributes to high purity and yields improvement in photomask/reticle products. We will cooperate with manufacturers to improve their production capability. 【Features】  ・Contributes to high purity and yields process improvement  ・Removes organic matter, metal ions, and foreign matter, which may no longer be detectable  ・Environmentally friendly tool removes impure deposits on work surface quickly and is environmentally safe for liquid waste management  ・Utilizes a cleaning solution and cleaning method that replaces the RCA cleaning solution.  ・Equipped with a spin cleaning unit that uses regular water.  ・High-speed diffusion of washing liquid to the cleaning surface  ・Dries without watermark deposits 【Applications】  ・Product cleaning for photomask/reticle/mask blank manufacturers  ・Reticle cleaning before exposure to semiconductor device manufacturers  ・Product cleaning in a semiconductor device manufacturer's in-house mask line (mask shop) 【Delivery record】  ・Domestic and overseas mask blanks, photomasks, and reticle manufacturers  ・Domestic and overseas device manufacturers *For more details, please contact us or download and view the catalog.

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IPA Vapor Drying System

IPA vapor displaces moisture and dries the object. For 4 to 8-inch wafers. Can be installed into and docked to various cleaning tools.

Wafer drying system using IPA vapor. Stand-alone type and built-in type are available. 【Features】  ・IPA vapor drying system for 4-inch to 8-inch wafers  ・Watermark free  ・Can be installed into and docked to various cleaning tools  ・Compatible with fine patterns  ・High throughput *For more details, please contact us or download the catalog to view.

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Wafer Transport and Transfer System “Pitch Conversion” and “Face to Face Transfer”

Automatic transfer of wafers in a cassette to another cassette/Possible to add functions such as simultaneous transfer of 2 cassettes, pitch conversion, and face-to-face (back-to-back) transfer.

Wafer transport and transfer system is the system that automatically transfers wafers from one open cassette to another open cassette, quartz (SiC) boat, and so on. 【Features】  ・Transfer system for 4-inch to 8-inch wafers  ・Automatic transfer of wafers in CR is possible.  ・Possible to add functions such as simultaneous transfer of 2 cassettes, pitch conversion, and face-to-face (back-to-back) transfer. *For more details, please contact us or download the catalog to view.

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Quartz Tube Cleaning System (HTC/VTC series) “Contributing to the reduction of chemical solution and pure water”

Vertical cleaning system (VTC series) saves space and contributes to the "reduction of chemical solution and pure water". World's top-class delivery record (over 400 units)

The "HTC/VTC" series is a quartz tube cleaning system for cleaning quartz tubes used in the diffusion, CVD, and annealing processes. 【Features】 ■The lineup of systems to match the shape of quartz tubes and cleaning applications ・Compatible with quartz tubes for 6-inch, 8-inch, and 12-inch processes. ・Horizontal type (HTC) and vertical type (VTC) can be selected according to the shape of the quartz tubes and cleaning applications. ■Saves space and contributes to the "reduction of chemical solution and pure water" ・Vertical type (VTC series) saves space and contributes to the "reduction of chemical solution and pure water" ■Customizable ■World top-class delivery record (over 400 units) ・World top-class delivery record (over 400 units) to domestic and overseas semiconductor device manufacturers and silicon wafer manufacturers. ■Extensive experience in handling related systems ・We are handling related systems such as quartz boat cleaning systems, quartz parts cleaning systems, quartz tube storage units, quartz transfer carts, and so on. *For more details, please contact us or download the catalog for viewing.

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Glass-like Carbon “Carbon material with excellent chemical and corrosion resistance”

Glass-like Carbon is a type of carbon material with a proven track record for use in semiconductor manufacturing system components. High purity is also possible.

In addition to the general properties of carbon materials such as chemical resistance, corrosion resistance, heat resistance, and electrical conductivity, glass-like carbon has the characteristics of gas and liquid impermeability, isotropy, acid resistance, and no dust generation. Because of these excellent characteristics, glass-like carbon is mainly used as a component in a semiconductor manufacturing system. 【Common Characteristics of Glass-like Carbon】 ・Chemical resistance, corrosion resistance, heat resistance, electrical conductivity, and dust-free ・Impermeability to gases and liquids ・High purity (high purity is possible by a special treatment in the manufacturing process) ・High heat resistance, high X-ray permeability 【Characteristics of Glass-like Carbon Beads】 ・Spherical carbon material with a smooth surface, which can be used as filler or porous material for ceramics, etc. ・Low thermal expansion and high thermal shock resistance. ・Dense isotropic structure without pores ・Central grain size 100μm, 200μm 【Characteristics of Porous Glass-like Carbon】 ・Porous glass-like carbon has the characteristics of glass-like carbon and also has air permeability and liquid permeability. ・A proven track record in vacuum chuck applications, etc. *For more details, please contact us or download the catalog.

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Carbon Adhesive “high-strength, heat-resistant adhesive for carbon materials”

High-strength, heat-resistant adhesive for carbon materials. Adhesion is possible without impairing the excellent properties of carbon materials.

Carbon adhesives are high-strength, heat-resistant adhesives developed for carbon materials (graphite materials, C/C composites, etc.). By carbonizing the adhesive itself, it is possible to bond carbon materials without impairing their excellent properties. 【Main Applications】 ・Adhesion of graphite jigs ・Adhesion of seed crystals for SiC wafer growth ・Bonding graphite and C/C composites in a high-temperature vacuum and inert gas atmosphere. *For more details, please contact us or download the catalog.

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Molybdenum Disilicide (MoSi2) Heaters “Up to 1800 degrees C usable!”

Molybdenum Disilicide Heaters: Repeatable, and long-life, customized design is possible

【Features】 ・Can be used up to a maximum operating temperature of 1800 degrees. *approximately. 500-1800 degrees C. ・Long-life and repeatable use. ・Easy to install and remove. ・Easy to control temperature and quick response, so that a specific part of the furnace can be heated evenly. ・Can be designed to meet the specifications of the customer's furnace. *We have a proven track record with semiconductor and optical manufacturers. * For more details, please contact us.

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Thermocouple for High-temperature Furnace (for semiconductor manufacturing system)

Highly accurate temperature measurement function is ideal for temperature control of heat treatment process!

This product is used as a sensor for temperature control and temperature measurement in heat treatment processes of high-temperature furnaces. 【Features】 ・We can manufacture new thermocouples as well as recast thermocouples as needed. ・We manufacture in a dedicated clean room. ・We achieve high precision.  We use wires (high-purity materials) carefully selected, conducting all temperature tests, and ship them in special packing boxes. ・We accurately measure the temperature inside the high-temperature furnace. ・Our products are installed in a state-of-the-art system. ・Calibration and traceability certificates can be issued.  We also perform temperature calibration to confirm accuracy based on ISO control standards and issue traceability and calibration certificates. *For more details, please contact us.

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Silicon Wafer Polishing Carrier “quick delivery and small lot production is available”

We manufacture carriers according to customer needs for use as wafer holders in the lapping and polishing process of silicon wafer manufacturing.

Carriers used as wafer holders in the lapping and polishing process of silicon wafer manufacturing can be produced using various metals (SUS, SK) and resins.. 【Features】 ■Can be produced using various metals (SUS, SK) and resins. ■Scratch prevention on the interior of the work holder ・Resin injection molding is utilized to prevent scratches on the interior of the work holder. ■Providing higher quality products ・We offer higher quality products by proposing specifications based on our many years of experience and by proposing products that meet customers' needs. ■High quality and stable cost ・We can provide high quality, stable cost, quick delivery, and small lot quantity (trial production) due to domestic manufacturing *For more details, please contact us.

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Virtualization of the Control System for semiconductor manufacturing equipment.

Prolonging use, maintenance improvement, and system maintenance of semiconductor manufacturing equipment that are no longer supported. Control device life-prolonging treatment of aging, and expensive semiconductor manufacturing equipment.

Virtualizes the operation of the semiconductor manufacturing system equipped with legacy devices and minicomputers/workstations of former DEC PDP, VAX, Alpha, and DMCC. It is possible to replace its OS with modern and inexpensive, high-performance standard PCs, to perform existing applications, and to stabilize operation over a long period of time. 【Features】 ・Continuous use of existing software in stable operation ・No need to develop new applications ・Utilizes inexpensive, high-performance x86 systems ・Freeing from dependence on specific hardware vendors ・Low-cost and quick system migration *For more details, please contact us.

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Glass-like Carbon Coat “Technology to form a coating layer”

Glass-like carbon coating is a technology that forms a coating layer of glass-like carbon by heating up graphite material coated with a proprietary resin.

Glass-like carbon coating is a technology that forms a coating layer of glass-like carbon by heating up graphite material coated with a proprietary resin. This technology can be used to coat parts for semiconductor manufacturing systems to reduce particle generation from the parts. 【Features】 ・Reduces dust generation of graphite materials. ・Permeating not only the surface of the graphite material but also the inside. ・Reduces the generation of gas from graphite materials. ・Reduces gas permeation of graphite materials. ・Capable of handling various shapes of graphite materials. ・Reduces reaction with metal and glass. *For more details, please contact us.*

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Repair of Electronic and Industrial Devices for semiconductor manufacturing system

Significant cost advantages over purchasing products by identifying the repair parts and replacing them. Repair of discontinued parts is also available.

Electronic and industrial devices used in old facilities as well as systems are currently difficult to obtain, and even if they are available, the price is very high!. We can provide a stable supply at low cost by taking care of the device in use, identifying faulty parts, replacing the parts in question, and repairing the device. 【Features】 ■Identification of the faulty parts and replacement of the parts enables us to achieve low cost. Before repairing, we diagnose the failure of the device in advance, identify the faulty parts and the parts to be replaced, then inform you of the repair cost. ■Stable supply For parts that are difficult to obtain, we select equivalent or substitute parts to ensure a stable supply. ■The flow of repair completion Receive the failed device (Please inform us of the symptom of the problem) ↓ Acceptance, inspection, and submission of quotation (Please allow 1 week to 10 days after receiving the device) ↓ The repair will start as soon as we receive your order(Please allow 2 weeks to 2 months for repair completion) Repair time varies depending on the product, so we will inform you of the official delivery date after the failure diagnosis is completed. ↓ After completion of repair and operation check, delivery. * We also provide after-sales support, so please contact us if you experience any issues after delivery. * For more details, please inquire.

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Precision Machined Parts (TOMCO) “reliable machining technology and quick delivery”

We support our customer's development of superior products with our proven processing technology and quick delivery.

We provide one-stop service from the machining of precision jigs and parts, to surface machining and cleaning to improve quality, reduce cost, and shorten the delivery time of parts for our customer's facilities. 【Features】 ・We have introduced state-of-the-art equipment from design to machining and inspection. ・We can deal with special needs by installing an angle head on a 5-axis multitasking machine. ・High-precision automation from design to machining is achieved with programming to ensure high quality. 【Applications and Examples of Achievements】 ・Metal materials: Stainless steel, Titanium, Molybdenum, Invar, Aluminum, Brass, Ccpper ・Resin materials: Teflon, PVC, Acrylic, PP, PRS, PEEK ・Surface processing: Various surface treatments such as plating, anodizing, painting, coating, electropolishing, and ultrasonic cleaning *For more details, please contact us or download our catalog to view.

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PVA sponge roll - Excellent water absorption, chemical resistance, and filtration properties.

Glass and printed circuit board semiconductor manufacturing process field: PVA sponge roll boasting excellent water absorption, chemical resistance, and filtration properties.

Utilizing its water-absorption properties, it is used as a water drainage solution for printed circuit boards and display glass. It has various other features as well. 【Features】 ■ Strong hydrophilicity and excellent water absorption capacity ■ High abrasion resistance, excellent chemical resistance, and durability ■ Continuous pores result in low resistance and excellent filtration performance ■ Capable of changes in pore size and shape, as well as dyeing compatibility *For more details, please contact us or download the catalog to view.

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