谷電機工業 List of Products and Services

The development team at Company A was conducting evaluation experiments with several printing machine manufacturers in anticipation of mass production of a new communication device for mobile terminals, focusing on solder bumping through screen printing. However, they were not achieving satisfactory results. In response, we proposed utilizing the filling pressure control feature of the press-fit squeegee unit equipped in our printing machine "TD-4420 series" with the following suggestions: - "Proposing pressurization conditions that allow 100% solder paste filling within the mask opening." - "Recommending the use of high-viscosity solder paste of approximately 280 Pa·s, which cannot be handled by conventional printing machines, as a countermeasure against solder bridging." The issues that had been troublesome during evaluation experiments with other manufacturers' printing machines were resolved quite easily, allowing them to start mass production as planned without significantly revising the new product's production process. [Proposed Product] - Solder paste printing machine "TD-4420" - Squeegee unit - Wet cleaner *For more details, please refer to the PDF document or feel free to contact us.*

• Printing Machinery
• Other mounting machines
• Other semiconductor manufacturing equipment

This document introduces the "solder paste printing machine" handled by Tani Electric Industry. It includes features, as well as printing results for fine printing, bump printing, and thick film printing. The information is presented clearly along with illustrations, so please take a moment to read it. 【Contents (excerpt)】 ■Feature 1: Press-fit cassette squeegee ■Feature 2: Dry cleaner ■Feature 3: Backup plate separation ■Further fine printing: Squeegee ■Further fine printing: Others *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment
• Solder
• Processing Contract

The "Solder Paste Printer TD-4420" is a paste insertion type printer equipped with a housing-type squeegee unit. By controlling the pressurization mechanism within the squeegee unit, we provide optimal printing conditions for a wide range of printing needs. By realizing "hybrid squeegeeing," which combines contact printing and off-contact printing, we challenge the limits of screen printing. The metal mask cleaner is equipped with both dry and wet methods, completely automating the removal of particles and flux. Bumping services and cleaning services are conducted in a Class 10,000 clean room. (Main equipment) - Solder paste printer "TD-4420" - N2 reflow oven - Flux cleaning machine - Flattening device - Bump height measurement device - X-ray observation device (Main solder bumping achievements) - Graphic memory - Automotive microcontrollers - Analog devices - Data storage memory *For more details, please refer to the PDF document. Evaluation demos in the clean room (Class 10,000) are also possible. Please feel free to contact us.

• Soldering Equipment
• Solder
• Processing Contract

We would like to introduce the "past development cases" of Guden Machinery Co., Ltd. Various products have been developed, such as the "Aqua Fryer," inspired by the process of frying tempura, and the "Color Image Encryption Software," which uses color image data as an encryption key. All of these are products for which patents have been obtained in the past. 【Examples】 ■ Cream solder printing device ■ Aqua Fryer ■ Color image encryption software (FCN) ■ Low-temperature sauna *For more details, please refer to the PDF materials or feel free to contact us.

• Printed Circuit Board
• Contract manufacturing

We would like to introduce a case study of "Printed Circuit Board Assemblies" from Guden Electric Industry Co., Ltd. We have transactions involving "communication devices (mobile phones and smartphones)," as well as "industrial equipment" and "automotive equipment (headlights)." Our company has established a quality policy that emphasizes "ensuring customer satisfaction" to continuously gain the trust of our customers, and we are always responsible for quality assurance and environmental conservation. Please feel free to contact us when you need our services. 【Case Studies】 ■ Communication Devices (Mobile Phones and Smartphones) ■ Industrial Equipment (Various Manufacturing Devices) ■ Industrial Equipment (Medical Devices) ■ Automotive Equipment (Headlights) ■ Amusement *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Contract manufacturing

We would like to introduce a case study of the "Touch Panel and LCD Monitor Assemblies" from Guden Electric Industrial Co., Ltd. We have transactions including "LCD monitors for ticket vending machines and information displays in transportation," "LCD monitors for ATMs in financial institutions," and "LCD monitors for in-vehicle use." Our company is committed to ensuring customer satisfaction as part of our quality policy, and we always respond responsibly to quality assurance and environmental conservation to maintain the trust of our customers. If you have any inquiries, please feel free to contact us. 【Case Studies】 ■ LCD monitors for ATMs in financial institutions ■ LCD monitors for ticket vending machines and information displays in transportation ■ LCD monitors for various testing devices in medical institutions ■ LCD monitors for various manufacturing devices in industrial machinery ■ LCD monitors for in-vehicle use *For more details, please refer to the PDF materials or feel free to contact us.

• Touch Panel
• LCD display
• Contract manufacturing

The "Solder Paste Printer TD-4420" is a paste press-in type printer equipped with a housing-type squeegee unit. By controlling the pressurization mechanism within the squeegee unit, we provide optimal printing conditions for a wide range of printing needs. By realizing "hybrid squeegeeing," which combines contact printing and off-contact printing, we challenge the limits of screen printing. The metal mask cleaner is equipped with both dry and wet methods, completely automating the removal of particles and flux. Bumping services and cleaning services are conducted in a Class 10,000 clean room. (Main Equipment) - Solder Paste Printer "TD-4420" - N2 Reflow Oven - Flux Cleaning Machine - Flattening Device - Bump Height Measurement Device - X-ray Observation Device (Main Solder Bumping Achievements) - Graphic Memory - Automotive Microcontrollers - Analog Devices - Data Storage Memory *For more details, please refer to the PDF document. Evaluation demos in a Class 10,000 clean room are also available. Please feel free to contact us.

• Soldering Equipment
• Solder
• Processing Contract

The product "Solder Paste Printer TD-4420" is a printing machine that uses a paste injection method and is equipped with a housing-type squeegee unit. (Examples of Use) - Formation of solder bumps on flip chip interposer substrates (bump pitch 150–200μm) - Formation of solder bumps on 6/8 inch wafers for printed devices (bump pitch 120–150μm) - Formation of solder bumps on 4 inch wafers for wireless communication devices (bump pitch 150–170μm) (Features of the Squeegee Unit) - The paste is stored in a cartridge with a structure that is shielded from outside air, which helps prevent deterioration such as oxidation. - The rotation pressure of the roller shaft inside the cartridge ensures that the paste is reliably filled into the mask opening. - The automatic replenishment and automatic stirring functions maintain a constant amount and viscosity of the paste within the cartridge. - The printing method does not leave paste on the mask after squeegeeing, which can reduce paste loss. *For more details, please refer to the PDF document. Evaluation demonstrations in a clean room (Class 10,000) are also possible. Please feel free to contact us.

• Soldering Equipment

We would like to introduce the "Printed Circuit Board Assembly and Processing Contract Service" offered by Guden Machinery Industry. We are equipped with a Class 100,000 clean environment and focus on four T's: diverse varieties, large quantities, short delivery times, and meticulousness. We establish a production system tailored to our customers' needs, operating 24 hours a day. Additionally, we have implemented our own developed solder printing machines across all lines, ensuring compliance with RoHS directives, including lead-free measures, through effective on-site management. 【Features】 - Three automatic visual inspection devices installed across all lines - A diverse production system with 15 SMT lines - 24-hour operation accommodating everything from small batches to short-term mass production - A production system tailored to customer needs - On-site management compliant with RoHS directives, including lead-free measures *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing
• Contract manufacturing
• Processing Contract

We would like to introduce the "Solder Bumping Service" offered by Guden Machinery Co., Ltd. We are equipped with a dedicated solder paste printing machine (TD-4422) and a bump flattening device (TD-2011) specifically designed for bumping, all within a dedicated clean room. We provide pre-solder processing services supported by the high technical capabilities of our product development group. Using solder paste allows for low costs, and since it is not plated, we can achieve short delivery times. Additionally, we can accommodate narrow pitches of 120μm. We have over 10 years of experience in solder bumping (SOP) for the following applications: - Graphic memory - Automotive microcontrollers - Analog devices - Data storage memory 【Features】 ■ Solder bumps formed by paste printing ■ Low cost using solder paste ■ Short delivery times as it is not plated ■ Accommodates narrow pitches of 120μm * For more details, please refer to the PDF document or feel free to contact us. Evaluation demos in a clean room (Class 10,000) are also available. Please do not hesitate to reach out.

• Solder
• Processing Contract
• Soldering Equipment

The business of Guden Machinery Co., Ltd. consists of three core areas: SMT (Surface Mount Technology) related business, semiconductor related business, and product development business. We possess different businesses in printed circuit board assembly, assembly of LCD products, repair services, and the manufacturing and sales of our own developed equipment, allowing us to meet our customers' needs 100%. Our business model involves the product development business supporting the core SMT related business and semiconductor related business from both software and hardware perspectives. 【Business Overview】 ■ SMT related business ■ Semiconductor related business ■ Product development business *For more details, please refer to the PDF materials or feel free to contact us.

• Processing Contract
• Contract manufacturing

We achieve high-quality and low-cost production through our unique production technology and know-how. Our strength lies in providing one-stop services, from the assembly of printed circuit boards utilizing the features of our in-house developed solder paste printing machines to the unit assembly and repair services for touch panels and display products. In addition, we are also capable of producing products that comply with ISO 13485 for medical devices, as well as ISO 9001 and ISO 14001 certifications.

• EMS
• Prototype Services
• Other contract services

The pre-solder service [bumping service] utilizes printing machines and precision bumping machines developed in-house to form fine solder bumps on substrates. We have established an environment that allows for the provision of stable quality products by installing equipment in a clean room managed at Class 10,000. The main processes are as follows: 1. Micro bump formation through solder paste printing (Main achievements) - Formation of 150μm pitch bumps on organic substrates - Formation of 100μm pitch bumps on silicon wafers 2. Flux cleaning using water-based cleaning agents (Main achievements) - Flux cleaning of organic substrates/wafers after micro bump formation - Flux cleaning of automotive/medical substrates after component mounting 3. Flattening of micro bumps using precision press machines 4. Visual inspection of micro bumps 5. Foreign matter inspection using appearance inspection machines *For more details, please download the materials or contact us.

• Wafer
• Memory
• Other semiconductors

This is a printing machine that solely pursues stable high-quality printing. It is equipped with a uniquely developed press-in squeegee unit, capable of meeting various printing needs from high-density patterns to large-diameter thick film printing. (Main Features) ● The cartridge, which is shielded from outside air, stores solder paste, preventing deterioration such as oxidation. ● The rotation pressure of the roller shaft inside the cartridge reliably fills the solder paste into the mask opening. ● The automatic solder paste replenishment function maintains a constant amount of solder paste within the cartridge. ● The automatic stirring mechanism keeps the viscosity of the solder paste inside the cartridge consistent. ● After squeegeeing, the machine automatically recovers the solder paste each time, leaving no solder paste on the mask. ● By combining contact printing and off-contact printing, the "hybrid squeegeeing" accommodates a variety of printing forms. *For more details, please request materials or view the PDF data available for download.

• Other mounting machines
• Other semiconductor manufacturing equipment
• Printing Machinery