We are exhibiting at the "Mie Prefecture Manufacturing Companies Virtual Exhibition" held from February 1 to 28, 2023.

We perform high-precision slitting of various materials according to their intended purpose.

At Kawamura Industries, we have been performing slitting processes on insulating paper, plastic films, and metal foils since our founding. We can customize processing according to various environments, including general and clean environments (clean class = 1,000), and we select processing methods that do not produce burrs or slitting debris based on the materials used. **Features of Kawamura Industries' "Slitting Process"** - Supports high-precision slitting with a width tolerance of less than 20μm - Equipped with a yellow room, allowing slitting of photosensitive materials - Slitting can be performed after laminating backup films or protective films *For processing conditions, please refer to the PDF document or feel free to contact us.*

• Bag making machine/slitter
• Processing Contract
• plastic

This is a surface treatment technology that dramatically improves the adhesion of fluororesin films and polyimide films, which have been considered difficult to bond until now.

At Kawamura Industries, we apply plasma treatment to films, metal foils, non-woven fabrics, and more, performing surface modifications such as hydrophilization and hydrophobization. This treatment significantly improves the adhesion of various films and allows for the removal and purification of organic substances from the substrate surface. It can effectively remove residues such as rolling oils that are difficult to completely eliminate with wet cleaning. Additionally, it is possible to bond various materials together without the use of adhesives. **Features of Kawamura Industries' 'Vacuum Plasma Treatment'** - Dramatically improves adhesive strength - Effectively removes rolling oils and organic substances, purifying the surface - Enables adhesive-free bonding of various materials - Selects suitable gas types and plasma treatment conditions for each project - Treatment effects last for an extended period - Continuous processing is possible with roll-to-roll technology *For more details, please refer to the PDF document or feel free to contact us.*

• Surface treatment contract service

By simply dissolving the powder in a solvent and drying it, you can obtain a transparent and high-heat-resistant polyimide film!

Kawamura Industries' "KPI-MX300F" is a polyimide powder material that can dissolve in various solvents. The films obtained by dissolving in a solvent and then heating and drying have minimal coloring and high transparency, which is a significant feature. **Features of Kawamura Industries' "KPI-MX300F"** - Can dissolve in various solvents - Produces transparent, high-heat-resistant polyimide films - The resulting films have minimal coloring and high transparency *For property values, please refer to the PDF document or feel free to contact us.*

• Composite Materials
• Other polymer materials
• Organic Natural Materials

It is a heat-resistant laminated board that integrates polyimide film without adhesive.

Kawamura Industries' "Polyimide Laminate (PI-Plate)" is a laminate made by layering and thermally bonding polyimide film that has been activated on its surface through plasma treatment. **Features of Kawamura Industries' "Polyimide Laminate"** - Excellent heat resistance due to being adhesive-free → Continuous: 200°C / Short-term: 400°C - Exhibits excellent mechanical properties derived from polyimide film - Laminates can be produced in sizes up to 480mm x 1,100mm - Maximum thickness of 10mm (proven) *Please feel free to consult us regarding thicknesses over 10mm. *For examples of properties, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Other polymer materials
• Other contract services

Features: ● Compatible with Intel Processor Core 3 and N series ● DDR5 SODIMM ×1 (up to 32GB) (sold separately) ● VGA ×1 + HDMI ×2 ● LAN ×4 (IEEE 802.3 at/af PoE compatible, total 80W) ● 9V–36V DC input (with protection circuit) ● Wide temperature range -20℃ to 60℃ ● Onboard TPM 2.0

Features: ● Equipped with Intel N series processors (N250/N150) ● Fanless design ● Ultra-thin compact chassis (30mm thick) ● Supports DDR5 memory ● Dual display output ● Dual Gigabit LAN ● Abundant M.2 expansion slots ● Equipped with TPM 2.0 * This model does not include memory, storage, or OS.

Features: ● Equipped with Intel Core Processor Series 2 ● Space-saving design of 150 × 270 × 225mm ● Supports ECC-compatible DDR5 memory ● Abundant storage configurations ● Dual 5G/4G communication expansion support ● Compatible with NVIDIA RTX PRO 4000 Blackwell SFF ● Flexible PCIe expansion ● Wide power input for industrial applications ● Operating temperature range of -20℃ to 45℃ ● Standard TPM 2.0 included * This model does not include memory, storage, or OS.

Fukuda Co., Ltd., which develops, manufactures, and sells leak testing equipment to inspect airtightness and sealing performance, provides a technical document that clearly explains the methods and theories of airtight testing, titled "Technical Manual." We are offering it as a PDF file. Please take this opportunity to download and view it!

What is a leak test system specifically for small electronic components? It is a device used for leak testing small electronic components that require airtightness, such as crystal devices, ceramic oscillators, optical devices, power semiconductors, CAN devices, laser diodes, MEMS devices, SAW filters, small relays, and capacitors. Leak testing of sealed products requires two types of inspections: gross leak testing and fine leak testing. We offer fully automatic machines that can perform the entire process in one unit, as well as dedicated machines (custom-made) and convenient tabletop types for sampling inspections.