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  6. Laminated board ◆ Adhesive-free 'polyimide laminated board' can be produced! ◆

Laminated board ◆ Adhesive-free 'polyimide laminated board' can be produced! ◆

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last updated:Jul 07, 2021

河村産業
河村産業
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It is a heat-resistant laminated board that integrates polyimide film without adhesive.

Kawamura Industries' "Polyimide Laminate (PI-Plate)" is a laminate made by layering and thermally bonding polyimide film that has been activated on its surface through plasma treatment. **Features of Kawamura Industries' "Polyimide Laminate"** - Excellent heat resistance due to being adhesive-free → Continuous: 200°C / Short-term: 400°C - Exhibits excellent mechanical properties derived from polyimide film - Laminates can be produced in sizes up to 480mm x 1,100mm - Maximum thickness of 10mm (proven) *Please feel free to consult us regarding thicknesses over 10mm. *For examples of properties, please refer to the PDF document or feel free to contact us.

    Processing ContractOther polymer materialsOther contract services
ポリイミド積層板(製品画像).jpg

Laminated board ◆ Adhesive-free 'polyimide laminated board' can be produced! ◆

ポリイミド積層板(製品画像).jpg
ポリイミド積層板(製品画像).jpg
  • Related Link - https://www.kawamura-s.co.jp/product_nobonding/

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basic information

【Processing Dimensions】  ■Maximum Width: 480mm  ■Maximum Length: 1,100mm  ■Maximum Thickness: 10mm  *Please feel free to consult us for sizes exceeding 10mm. *Please consult us for sizes larger than those mentioned above.

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Applications/Examples of results

Semiconductor production equipment components

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Polyimide laminate

Polyimide laminate

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We will be exhibiting at the Thermal Tech 2026 event held on April 24, 2026.

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We will be exhibiting at the Thermal Tech 2026 event held at the Osaka Industrial Creation Center. At this exhibition, we will introduce our unique material technologies to engineers who face challenges in material selection for high-temperature environments, focusing on polyimide sheets suitable for high heat resistance and insulation applications. As attendance is by prior registration, please apply through the related link before your visit, and we encourage you to stop by our booth. We sincerely look forward to your visit. ◆ Our main exhibition content - PI Plates (Polyimide Laminates) - SUS/Polyimide Substrates ◆ Exhibition Details ◆ Exhibition Name: Thermal Tech 2026 (Pre-registration required) Pre-registration Method: Please apply via the URL in the related link Date and Time: April 24, 2026 (Friday) 10:30 AM - 4:30 PM Venue: Osaka Industrial Creation Center, 3rd and 4th Floors (Reception on the 4th Floor)

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We will exhibit at the High-Performance Materials Week Osaka held from May 14 to 16, 2025.

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We are pleased to announce that we will be exhibiting at the "High-Performance Materials Week Osaka - Recycle Tech Japan" held at Intex Osaka. We invite you to visit our booth when you attend. We look forward to seeing you. This time, we will mainly showcase unique polyimide materials. ◆ Exhibition Details ◆ Exhibition Name: Recycle Tech Japan [Osaka] *Registration is required for entry. Pre-registration Method: Please register using the URL from the related link. Date and Time: May 14 (Wed) to May 16 (Fri), 2025 Venue: Intex Osaka Remarks: We will be co-exhibiting at the booth of the Osaka Industrial Bureau. Booth Number: '8-48'

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We will be exhibiting at the Adhesive and Bonding Technology Exhibition 2024 held on May 24, 2024.

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We are pleased to announce that we will be exhibiting at the Adhesive and Adhesion Technology Exhibition 2024, held at the Osaka Industry Creation Center. Attendance is by complete advance registration only. We warmly invite you to visit our booth when you come. Under the theme "Kawamura Industries: ROLL to ROLL Vacuum Plasma Surface Treatment!" we will showcase not only ROLL to ROLL processing with vacuum plasma treatment but also continuous thermal lamination processing, vacuum thermal pressing, and composite technologies that combine these methods. ◆ Exhibition Details ◆ Exhibition Name: Adhesive and Adhesion Technology Exhibition 2024 *Advance registration required Advance Registration Method: Please register using the URL in the related link. Date and Time: May 24, 2024 (Friday) 10:30 AM - 4:30 PM Venue: Osaka Industry Creation Center, 3rd and 4th Floors *Reception on the 4th Floor

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We are exhibiting at the "Mie Prefecture Manufacturing Companies Virtual Exhibition" held from February 1 to 28, 2023.

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We are currently exhibiting at the "Mie Prefecture Manufacturing Companies Virtual Exhibition" hosted by the Mie Prefectural Government. No prior registration is required, and you can enter via the related link or the QR code in the related materials. If you have any questions, please feel free to contact us through our booth inquiry. ◆ Exhibition Details ◆ Exhibition Name: Mie Prefecture Manufacturing Companies Virtual Exhibition (WEB Exhibition) Date and Time: February 1 (Wednesday) to February 28 (Tuesday), 2023 Our Booth: A17

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河村産業

河村産業

Manufacturing and processing contract

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Our company specializes in insulation processing, electronic materials, and microfabrication, achieving high quality, high performance, and timely production through high technology and refined skills.

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