Notice of Participation in the Okayama Technology Exhibition (OTEX) 2023

Thank you for visiting the Okayama Technology Exhibition (OTEX) 2023. You can view the catalog of the exhibited products.

Thank you to everyone who visited our booth at the "Okayama Technology Exhibition (OTEX) 2023" held at Convex Okayama from November 7 (Tuesday) to 8 (Wednesday), 2023. In response to requests such as "I want to take a closer look at the exhibits again" and "I want to see the related catalogs and panels up close," we are now making available the product catalogs and display panels introduced at the Takaya booth. Please take a look.

• Circuit Board Inspection Equipment

Top class in industry share!! "Takaya," the company that gathers trust and support from around the world for its circuit board inspection equipment.

The "electronic circuit board" is one of the important components widely used in various fields as a fundamental part for controlling electronic devices. The "board inspection equipment" developed by the Industrial Equipment Division is an "in-circuit tester" designed to inspect whether all components function correctly and whether there are any installation defects after various electronic components have been mounted on this "electronic circuit board" (ICT: In-Circuit Test). Among these, the "flying probe tester," which uses a needle called a "probe" that is rapidly moved by a robotic arm to directly contact the electronic components on the board for inspection, is a flagship product developed by Takaya ahead of the world. This device enables the quick detection of various defects that occur during manufacturing. Additionally, it allows for rapid adaptation to a wide range of boards through program changes. It has established an indispensable and solid position in modern manufacturing, which is characterized by small-batch production of diverse products.

• Circuit Board Inspection Equipment

RFID technology enhances the value of diverse business models even further. It is active across a wide range of industrial fields, from security to factory automation and logistics.

The core business of the RF Division is the development, manufacturing, and sales of products that use radio frequency. Since 1996, we have developed various products including radio wave-based store security gates, 2.45GHz RFID readers/writers, and 13.56MHz RFID readers/writers, with Takaya products actively used across a wide range of industries from security to factory automation and logistics. We not only offer our own planned products but also provide OEM/ODM supply, contract development, EMS services, and system solutions, contributing to the creation of added value in diverse business models.

• IC tag

Providing custom security solutions for various industries and businesses. One-stop support from infrastructure assistance to software development.

The core business of the Solutions Division is IT services for enterprises. By effectively utilizing the experience, know-how, and personnel that the Takaya Group has cultivated through various system developments, along with the latest IT technologies, we provide optimal solutions to the IT challenges faced by our customers. For example, our highly skilled system engineers respond to the diverse needs of customers with systems such as RFID process management systems, attendance management systems, access control systems, warehouse management systems, and parts management systems. Utilizing advanced research, analysis, and design capabilities, we propose and build optimal systems ranging from infrastructure support such as server implementation and network construction to software development, maintenance, and operation, providing one-stop IT solutions.

• Process Control System

Supporting cutting-edge technology in the digital network era, responding to industry-specific needs with "high quality," "short delivery times," and "low costs."

The advancements in technology in the field of communication imaging show no signs of stopping. The new digital network market is rapidly expanding, and there is a demand for technological capabilities and production systems that can supply cutting-edge products in a timely manner. In response to the needs of this era and the industry, the EMS (Electronics Manufacturing Service) Business Division is responsible for designing and manufacturing based on customer contracts. We cater to a wide range of needs, from simple assembly-type EMS through component supply to integrated EMS that encompasses all processes from development and design to final product production, as well as small-lot production of various types and mass production of small models. By bringing together the "wisdom," "skills," and "experience" of Takaya's engineers and flexibly combining them, we provide EMS solutions that address various challenges.

• EMS

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

In this seminar, you will learn the following: - The mixing mechanism and examples of Awatori Nentaro - Stirring methods and heat generation countermeasures according to material viscosity - The latest automation models and syringe filling technology using Awatori Nentaro We will provide not only the basic information about Awatori Nentaro but also the latest updates. During the live demonstration, we will clearly explain how actual materials are mixed and the operation screen of the temperature management solution app for Shinky. Additionally, equipment and optional items will be displayed in the venue, allowing you to consult while viewing the actual products. Please register early!

An explanation of the "detailed risk assessment of hazardous areas," which is essential as the first step in promoting "smart security" and "DX transformation" in hazardous material facilities. We will clearly convey the evaluation methods and points to consider in implementation, incorporating comparisons of old and new evaluation methods as well as recent case studies. There will also be a Q&A session on the day. If you have any questions in advance, please fill them out in the participation input form. You are also welcome to ask questions on the day! We look forward to your participation. Date and Time: October 16, 2026 (Friday) 13:30 - 14:30 (Web seminar via eams)

■Title: "The Complete Picture of Advanced Semiconductor Packaging Technology - From 2.5D/3D and Chiplets to Thermal and Power Solutions, Reliability Evaluation, and PFAS Compliance -" ――A systematic explanation of advanced packaging technologies that support the evolution of AI semiconductors. In addition to the latest technological trends in 2.5D/3D packaging, chiplets, CoWoS, TSV, and glass core substrates, you will learn broadly about manufacturing processes, yield improvement, failure analysis, reliability evaluation, PFAS regulatory compliance, and thermal and power design. Practical case studies and evaluation analysis techniques directly related to work will also be explained in detail. - Basics of semiconductor packaging technology and the evolution of trends - Latest trends in 2.5D/3D and chiplet technology - Reliability testing and failure analysis techniques - Key points for yield improvement - PFAS regulatory compliance and sustainable materials - Thermal and power design technologies for advanced packaging aimed at AI - Engineers and researchers from chemical, electronics, electrical, and automotive manufacturers - Personnel involved in semiconductor backend processes and assembly technologies - Personnel involved in materials and equipment development - Those who want to systematically learn about advanced packaging technologies

■Title: "Fundamentals and Applications of Non-Fluorinated Water-Repellent and Oil-Repellent Coatings, Development Trends" In light of the strengthened PFAS regulations, this presentation will clearly explain non-fluorinated water-repellent and oil-repellent coatings, covering the basics of water-repellent and oil-repellent technologies, the trends in PFAS regulations in various countries, and the latest developments in alternative technologies. It will also introduce the characteristics and application examples of various materials such as silicone-based, urethane-based, polyolefin-based, and hybrid materials, providing knowledge that will be useful for product development and material selection. - Basic knowledge of water repellency and oil repellency - Fundamentals of fluorinated water-repellent and oil-repellent coatings - Overview of PFAS regulations in Europe, the United States, and Japan - Technical trends in non-fluorinated water-repellent and oil-repellent coatings - Characteristics and application examples of various non-fluorinated materials - Planning and development personnel considering the adoption of water-repellent and oil-repellent coatings - Engineers involved in products utilizing coatings - Personnel considering fluorinated alternative materials - Young engineers and students who want to learn about water-repellent and oil-repellent technologies