Cross-sectional observation of substrate-mounted components.

Observations before and after reliability testing and cross-sectional observations! Here are examples of observations of various implemented components.

We would like to introduce our service for "various cross-sectional observations of mounted components on circuit boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, you can see that numerous components are tightly soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can prevent normal operation. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

• Contract Analysis
• Contract measurement
• Other contract services

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

Introducing the perspectives from which analysis and analytical techniques should be advanced!

Our company supports customers in solving their challenges and issues not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point for problem-solving and provides assistance in unraveling issues for our customers. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other analyses

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Surface treatment contract service
• Other contract services

You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

Our company conducts "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks and voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, while for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Inspection
• Other contract services

With our advanced technology, we can also create cross-sections of highly challenging samples!

The CCD camera module is composed of a complex structure that integrates electronic and mechanical technologies, including sensors, control elements, and AF drive mechanisms, all within a small housing. Additionally, a variety of materials such as metal, glass, and resin are used, making cross-section preparation difficult. Our company can produce cross-sections of such high-difficulty samples with advanced technology. 【Cross-section of CCD Camera Module】 ■ Multiple lenses and filters are built into the small housing ■ Products with AF functionality also incorporate mechanisms for focus adjustment and control elements *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Analysis Services

Introducing examples of aluminum welding observation. Internal observation through X-ray fluoroscopy and CT inspection allows for clearer observation after cross-section preparation!

Here are some examples of observations of aluminum spot welds. In internal observations using X-ray radiography, voids were observed inside the weld, and in internal observations using X-ray CT, it was confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching treatment, we were able to observe the condition of the weld more clearly. 【Overview】 ■ Internal observation using X-ray radiography - Non-destructive testing and X-ray radiographic observation were conducted - Voids were observed inside the weld ■ Internal observation using X-ray CT - Non-destructive testing and X-ray CT observation were conducted - It was confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section suitable for the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.

• Other contract services

Introducing a case study on the cross-section preparation of a large sample (65mm × 28mm) and the observation of its internal structure!

We present an observation case of a large sample (expansion valve) measuring 65mm × 28mm. This sample uses magnetic materials, and due to distortion in the images during SEM observation, we primarily conducted observations using an optical microscope. From the appearance and X-ray radiographic observation, it was found that there are some areas that are not visible in the X-ray. [Overview] ■ Appearance and X-ray radiographic observation ■ Cross-sectional observation using an optical microscope *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Contract Inspection
• Other contract services

Calculating the crack rate of ball joints and implementing it according to customer specifications!

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within the allowable standards. The evaluation standards after the solder durability test can be individually defined based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement

Three types of Pb-free soldered products were subjected to reliability testing! We will introduce the main objectives of each test and the results of cross-sectional observations.

We would like to introduce the cross-sectional observation of Pb-free solder after reliability testing conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints through observations of crack progression, we recommend the TC test, which allows for cross-sectional observation after extraction at each cycle. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.

• Solder

On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

The date for the "Tokai Area Electrical and Electronic WEB Technology Seminar" for the 2026 fiscal year has been decided. Registration has started, so if you are interested, please apply. Multiple participants from one company are allowed, so please make use of this opportunity to acquire basic knowledge. 【April】Basic Knowledge of Resistors 【May】Technical Course on Capacitors 【June】Basics of Motors and How to Choose the Optimal Driver 【July】Fundamentals of IC Socket and Connector Selection 【September】Basics of Magnets 【October】Failure Phenomena of Chip Resistors and Their Countermeasures 【November】Temperature Protection Design Using Thermal Fuses

NDT Mart & Rental Co., Ltd. began selling its new product, the handheld magnet "YokeLite-100V," on December 25, 2025. ◆ Handheld Magnet "YokeLite-100V" The YokeLite-100V is an AC handheld magnet (gap-type magnetizer) used for magnetic particle testing (MT). With a compact design weighing approximately 2.4 kg, it is easy to handle and allows for efficient non-destructive testing work on-site. It generates a powerful alternating magnetic field, supporting the detection of defects such as cracks in welds and on metal surfaces. It features a variable yoke structure, enabling flexible adaptation to various inspection targets, including curved surfaces, corners, and fillet welds. It ensures a lifting power of over 4.5 kg, providing sufficient magnetization capability required for magnetic particle testing. Additionally, by equipping optional UV lights or white lights, it can accommodate a wide range of inspection methods, including fluorescent magnetic particle testing and visual inspections, offering excellent cost performance. This handheld magnet is useful for defect inspection and quality control in the fields of manufacturing, plant equipment, and welding inspection. It combines lightweight design with high inspection performance, contributing to improved work efficiency.

NDT Mart & Rental Co., Ltd. began selling its new electromagnetic ultrasonic thickness gauge, 'EMAT WIFI', on January 19, 2026. ◆ Electromagnetic Ultrasonic Thickness Gauge 'EMAT WIFI' The 'EMAT WIFI' is a thickness gauge that uses the electromagnetic ultrasonic (EMAT) method, which does not require a couplant (contact medium). Unlike conventional ultrasonic thickness gauges (UT), there is no need to apply a couplant; thickness measurements can be taken simply by placing the probe on the measurement target, making it ideal for beginners and screening in large-scale sites. It can measure materials with paint, scale, thick linings, and slight surface roughness, significantly reducing the hassle of pre-treatment. Additionally, it is equipped with WiFi communication capabilities, allowing for the confirmation and management of measurement data and waveforms in conjunction with smartphones and tablets. This facilitates smooth sharing of measurement results and data management on-site. It is optimal for measuring wall thickness and conducting corrosion inspections of plant equipment, piping, tanks, and steel structures. It contributes to the efficiency and reliability of thickness measurements in the field of non-destructive testing (NDT), such as maintenance inspections and equipment diagnostics.

NDT Mart & Rental Co., Ltd. began sales of its new dual thickness gauge, the 'CT3500', on January 28, 2026. ◆ Dual Thickness Gauge 'CT3500' The 'CT3500' is a portable thickness gauge that supports a wide range of coating measurements from thin films to thick films. It employs a dual measurement method using electromagnetic and eddy current techniques, allowing for automatic differentiation between ferrous and non-ferrous substrates to measure coating thickness. The measurement range accommodates up to 3,500μm, making it suitable for measuring coatings from general painting to heavy anti-corrosion coatings and linings. With a measurement speed of approximately 0.2 seconds, it allows for efficient measurements even in inspection tasks that require multiple points. It is not only compact and easy to carry, but its display features an inclined design that is easy to see from both above and the front. Additionally, the upside-down display and background color (white/black) switching enhance visibility in dark, narrow, and outdoor environments, making it suitable for quality control within factories as well as for equipment inspections and painting checks in outdoor settings. It can be utilized for a wide range of applications, including painting management of bridges and steel structures, anti-corrosion coating measurements for pipes and tanks, and quality control in manufacturing sites. The 'CT3500' is a high-performance portable thickness gauge that provides stable measurements from thin to thick films, designed for field use.