Cross-sectional observation of substrate-mounted components.

Observations before and after reliability testing and cross-sectional observations! Here are examples of observations of various implemented components.

We would like to introduce our service for "various cross-sectional observations of mounted components on circuit boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, you can see that numerous components are tightly soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can prevent normal operation. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

• Contract Analysis
• Contract measurement
• Other contract services

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

Introducing the perspectives from which analysis and analytical techniques should be advanced!

Our company supports customers in solving their challenges and issues not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point for problem-solving and provides assistance in unraveling issues for our customers. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other analyses

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Surface treatment contract service
• Other contract services

You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

Our company conducts "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks and voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, while for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Inspection
• Other contract services

With our advanced technology, we can also create cross-sections of highly challenging samples!

The CCD camera module is composed of a complex structure that integrates electronic and mechanical technologies, including sensors, control elements, and AF drive mechanisms, all within a small housing. Additionally, a variety of materials such as metal, glass, and resin are used, making cross-section preparation difficult. Our company can produce cross-sections of such high-difficulty samples with advanced technology. 【Cross-section of CCD Camera Module】 ■ Multiple lenses and filters are built into the small housing ■ Products with AF functionality also incorporate mechanisms for focus adjustment and control elements *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Analysis Services

Introducing examples of aluminum welding observation. Internal observation through X-ray fluoroscopy and CT inspection allows for clearer observation after cross-section preparation!

Here are some examples of observations of aluminum spot welds. In internal observations using X-ray radiography, voids were observed inside the weld, and in internal observations using X-ray CT, it was confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching treatment, we were able to observe the condition of the weld more clearly. 【Overview】 ■ Internal observation using X-ray radiography - Non-destructive testing and X-ray radiographic observation were conducted - Voids were observed inside the weld ■ Internal observation using X-ray CT - Non-destructive testing and X-ray CT observation were conducted - It was confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section suitable for the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.

• Other contract services

Introducing a case study on the cross-section preparation of a large sample (65mm × 28mm) and the observation of its internal structure!

We present an observation case of a large sample (expansion valve) measuring 65mm × 28mm. This sample uses magnetic materials, and due to distortion in the images during SEM observation, we primarily conducted observations using an optical microscope. From the appearance and X-ray radiographic observation, it was found that there are some areas that are not visible in the X-ray. [Overview] ■ Appearance and X-ray radiographic observation ■ Cross-sectional observation using an optical microscope *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Contract Inspection
• Other contract services

Calculating the crack rate of ball joints and implementing it according to customer specifications!

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within the allowable standards. The evaluation standards after the solder durability test can be individually defined based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement

Three types of Pb-free soldered products were subjected to reliability testing! We will introduce the main objectives of each test and the results of cross-sectional observations.

We would like to introduce the cross-sectional observation of Pb-free solder after reliability testing conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints through observations of crack progression, we recommend the TC test, which allows for cross-sectional observation after extraction at each cycle. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.

• Solder

<Title> Development of Gene Expression Control Technology through RNA Hacking In the latest presentation paper, we have utilized Abby. Associate Professor Yosuke Katsuta from Kumamoto University Graduate School of Advanced Science and Technology, Analytical Chemistry Laboratory (also co-founder of StapleBio), will be giving a presentation in an online seminar. He is working on the development of RNA hacking technology aimed at controlling gene expression by utilizing short nucleic acids named Staple to change the higher-order structure of target mRNA. He will present the latest data focusing on the results of cell experiments and animal experiments in the development of this technology. Related paper on the presentation content: Staple oligomers induce a stable RNA G-quadruplex structure for protein translation inhibition in therapeutics | Nature Biomedical Engineering

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! With one molding process, different products with similar shapes or varying dimensions can be molded at the same time. This allows for the verification of multiple types in a short period.

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.