Examples of semiconductor observation using mechanical polishing.

Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.

We would like to introduce an example of "observation of semiconductors through mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those produced by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metallurgical microscope. The observation modes of the metallurgical microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metallurgical microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Observations before and after reliability testing and cross-sectional observations! Here are examples of observations of various implemented components.

We would like to introduce our service for "various cross-sectional observations of mounted components on circuit boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, you can see that numerous components are tightly soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can prevent normal operation. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices

Comprehensive analysis of the structure of MEMS components using a combination of non-destructive and destructive methods!

This document introduces the structural analysis of MEMS components. It includes "non-destructive observation of accelerometers" using X-ray imaging to observe the internal structure of the package, as well as "optical microscope and SEM observation after mechanical polishing of accelerometers" and "cross-sectional observation of microphones (CROSS BEAM FIB/SEM)." Please feel free to download and take a look. [Contents] ■ Non-destructive observation of accelerometers ■ Optical microscope and SEM observation after mechanical polishing of accelerometers ■ Cross-sectional observation of microphones (CROSS BEAM FIB/SEM) *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

We are publishing the main cross-section manufacturing methods, processing conditions, advantages & disadvantages, etc.!

This document introduces methods for preparing cross-sections. When conducting observations, analyses, or evaluations, there may be a need to prepare cross-sections. By selecting or combining methods that are appropriate for the purpose, material, and structure, it is possible to obtain highly reliable results. In mechanical processing, we include main cross-section preparation methods such as "mechanical polishing" and "microtome." In ion beam processing, methods like "FIB" and "ion polisher (CP)" are also featured. We encourage you to read it. [Contents] ■ Main cross-section preparation methods ■ Processing conditions ■ Advantages & disadvantages *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Contract measurement
• Contract Inspection

We will thoroughly evaluate and verify the LED from all angles.

■Comprehensive Capability Consistent evaluation resistance from reliability testing to electrical characteristic measurement, optical characteristic measurement, and further analysis. ■Rich Analytical Methods - Forward bias analysis / Reverse bias analysis - Detection from visible to infrared - Emission analysis / OBIRCH analysis ■Special Technology By filtering the visible light range, we can detect weak emissions from abnormal areas without missing them.

• Bullet-shaped LED
• Chip type LED
• LED Module

Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.

In our "LED Failure Analysis," we conduct failure analysis of LEDs using advanced sample preparation techniques and semiconductor failure analysis equipment to investigate the causes of non-lighting and brightness degradation. In the "LED Defect Mode Discrimination," we performed lighting tests after lens polishing and observed the resin of the LED, polishing it to stages a, b, and c, conducting lighting observations for (a) and (b), and optical observations of the chip through the resin for (c). Additionally, we also have categories such as "Electrical Normal" and "Open, High Resistance." 【Initial Diagnostic Items for LED Packages】 ■ Electrical Characteristics Measurement ■ Visual Inspection ■ Lens Polishing / Internal Optical Observation of the Package ■ Lighting Test (Brightness Distribution Observation) *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Analysis Services

You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

Our company conducts "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks and voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, while for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Inspection
• Other contract services

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Surface treatment contract service
• Other contract services

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

• Contract Analysis
• Contract measurement
• Other contract services

We have added a new **"Glossary"** to the Hyper CLT sheet website. In the civil engineering and construction industries, there are many specialized terms such as "CLT," "NETIS," "temporary roads," and "wooden lightweight sheets." Therefore, we have introduced related terms in an easy-to-understand manner so that those who are encountering Hyper CLT sheets for the first time can understand the products and technologies. Hyper CLT sheets are wooden lightweight sheets for civil engineering that utilize wood CLT and are registered under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS technology as **"TH-250021-A."** We hope that by not only conveying the features of the product but also sharing the underlying technologies and terminology, users will feel a closer connection to Hyper CLT sheets. We will continue to enhance our website and provide clear information related to wood, NETIS, civil engineering, and CLT.

Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily understandable at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

On September 15, 2026, we issued a press release regarding the wooden lightweight sheet "Hyper CLT Sheet." The Hyper CLT Sheet is a civil engineering sheet that utilizes CLT (Cross-Laminated Timber) stacked in an orthogonal direction. It can be used in various locations such as temporary roads, access routes, heavy machinery work yards, and material storage areas. The 5×10 version weighs approximately 230 kg, making it relatively lightweight and easy to install, remove, and relocate. Additionally, it offers environmental benefits such as reducing glare and metallic sounds typical of wood, as well as CO2 fixation. Furthermore, it can be proposed for the use of new technologies in public works as a **registered technology with the Ministry of Land, Infrastructure, Transport and Tourism "TH-250021-A."** Through this press release, we aim to expand the new wooden lightweight sheet that combines wood, NETIS, civil engineering, and CLT to more construction sites.

● The production time for cast prototypes can be shortened! Since model making is not required, the production time for prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or varying dimensions, can be molded at the same time in one molding process. This allows for the verification of multiple types in a short period.

The "HA-T Series" is an energy-saving automatic door sensor that opens only for those who wish to enter, whether on a busy street or in a narrow passageway. The automatic door opens simply by bringing your hand close, addressing hygiene concerns even in facilities used by a large number of people. You can choose between "Non-vision Mount Type/HA-T401" and "Non-vision Built-in Type/HA-T520" depending on the application and installation location. 【Recommended for such places!】 ☑ Entrance facing a busy corridor ☑ Presence of counters or signs near the door ☑ Buildings facing narrow passages ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors 【Features】 ● Adaptable to various door types with four detection spot settings ● Reduces unnecessary opening and closing, contributing to energy-saving by minimizing wasteful power consumption ● Equipped with a light touch function, allowing the door to open and close just by waving your hand, ensuring hygiene ● Can also be used as a wide detection range non-vision infrared sensor ◎ For more details, please download the materials or contact us.