The 1st Kyushu Semiconductor Industry Exhibition

Affordable distance sensors for measuring film and coating thickness, as well as non-contact thickness measurement. Strong performance on slopes, achieving a distance direction resolution of 20nm!

Our optical distance sensor/thickness sensor 'CHRocodile C / CHRocodile Mini' from PreciTech Japan is a compact non-contact sensor with a wide measurement range. It is robust against slopes and offers high resolution in the distance direction starting from 20nm, all at an affordable price of approximately 1 million yen (excluding tax). 【Examples of Use Cases】 ● Complete inspection through height and distance measurement of manufactured products within equipment ● Quality improvement through thickness management of glass, film, and graphite coatings ⇒ Adopted by manufacturers of production equipment, inspection equipment, and integrators. 【Features】 ・Combines high resolution with a price point that lowers the purchasing barrier ・Non-contact measurement of film and coating thickness ・Strong against slopes with an angle tolerance of up to ±45 degrees ・Distance direction resolution starting from 20nm ・Flexible software creation possible with the provided software development kit ・Can be embedded in equipment ・Compatible with rough and mirror surfaces, independent of surface or shape *For product details, please refer to the materials available for download in PDF format. Feel free to contact us for inquiries.

• Distance measuring device

Optical sensor for measuring a wide range of thickness from 0.5 to 200 um. High-speed sampling at 5 kHz. Ideal for monitoring applications during processing.

Non-contact optical thickness measurement. Applicable for thickness measurement of semiconductor wafers where high precision is required. The new product 'CHRocodile 2 SX' is a device that can measure the thickness of materials such as wafers and coatings without contact. It supports high-speed sampling of up to 5 kHz, making it suitable for inline applications. In addition to measuring the thickness of semiconductor wafers like Si, it can also measure the thickness of films, resins, glass, solar cells, and more. In particular, when thickness monitoring is desired during wafer grinding, it can measure thicknesses from 200 µm to 0.5 µm for Si wafers. 【Features】 ■ Wide range of thickness measurement, compatible with various materials With a rich lineup of probes, it can measure thicknesses from thin films (around 2 µm) to thick films (1000 µm) at optical lengths, and from 0.5 to 200 µm for Si. ■ High resolution (sub-micron, minimum 3 nm @ optical length) ■ Contributes to reducing development costs and shortening development lead times, with a software development kit (DLL, etc.) available for device integration ■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation.

• Coating thickness gauge

Capable of measuring the total thickness of 12-inch wafers. High-speed measurement without the influence of vibrations, without a scanning stage. Suitable for online, offline, and wafer inspection applications.

The Flying Spot Scanner 310 is an optical measuring device that can perform wide-area (up to φ310) scans using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. It can measure thickness, dimensional shapes, and inspect surface defects based on the principle of spectral interference. Additionally, due to the coaxial optical system for incident and reflected light, it is possible to obtain good results even on glossy surfaces. 【Features】 ■ Wide-area scan φ310mm ■ High resolution XY20um Beam spot diameter 40um, high Z resolution through spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit for device integration (DLL, etc.) available ■ Applications Thickness measurement of 12-inch wafer surfaces, thickness measurement of bonded wafers, void inspection *For more details, please refer to the documentation.

• 3D measuring device
• Coating thickness gauge

Non-contact optical thickness measurement. Applicable even for thickness measurements of semiconductor wafers where high precision is required.

The new product "CHRocodile 2LR ver2" is a device that can non-contact measure the thickness of materials such as wafers and coatings. It adopts a new detector different from the previous "CHRocodile 2LR," allowing for approximately twice the thickness measurement range and more precise measurements. It can also be applied inline, and the CHRocodile 2LR has a proven track record with many customers. It is capable of measuring the thickness of semiconductor wafers like Si, as well as films, resins, glass, and solar cells. It supports interference film thickness of up to 16 layers. 【Features】 　■ Wide thickness measurement range, compatible with various materials 　　　With a rich lineup of probes, it covers thicknesses from thin films (around 32μm) to thick films (3900μm). (The high-precision measurement range is 16~1900μm with linearity of 0.35μm) 　■ High resolution (sub-micron, minimum 1nm) 　■ Contributes to reducing development costs and shortening development lead times, 　　　with a software development kit (DLL, etc.) available for device integration 　■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation.

• Coating thickness gauge
• Other inspection equipment and devices

In addition to the conventional chromatic aberration confocal method and spectral interference method, a thickness measurement sensor utilizing laser heating has also emerged. It can measure the thickness of both transparent and opaque materials non-contactly.

Presitech is a German manufacturer of non-contact sensors. It develops and manufactures optical sensors using chromatic aberration confocal method and spectral interference method. At the end of 2022, it acquired the French company Enovasense, adding sensors that utilize laser heating to measure the thickness of opaque materials to its lineup. The company specializes in high-speed and high-precision thickness measurement, which is used for inspecting wafers, coatings, films, paint films, anti-corrosion coatings, and more. It offers a wide measurement range, tolerance angles, and can accommodate various materials, including line sensors and area scanners suitable for full surface measurement. There are numerous achievements in integrating these sensors into semiconductor manufacturing equipment, and they are also used in LCD manufacturing equipment and inline inspection of films. Additionally, they are utilized as embedded sensors for tabletop machines such as standalone units. Enovasense's sensors have also demonstrated success in measuring coating thickness for aerospace-related components. *For product details, please refer to the materials available for download in PDF format. Feel free to contact us with any inquiries.*

• Sensors

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

The "CHRocodile 2 IT sensor" can measure the thickness of wafers during work processing.

In the semiconductor industry, it is necessary to measure the physical thickness of wafers at multiple manufacturing stages, such as CMP and mechanical grinding. To monitor and optimize the entire process, it is important to have a grasp of the thickness; however, this task is currently mainly performed using mechanical contact probes. These probes have significant drawbacks, including the need for contact with the wafer, surface damage, and reference values for thickness measurement from the chuck table, and they also wear out, necessitating frequent replacements. Our "CHRocodile 2 IT sensor" can measure the thickness of wafers during processing using non-contact, non-destructive optical measurement technology. 【Features】 - Optical sensor provides more accurate results than conventional contact measurement devices. - Direct feedback improves the reproducibility of wafer thickness from several micrometers to less than 0.5 micrometers. - High-speed measurement and non-contact passive probes allow for the acquisition of a large amount of thickness data across the entire wafer area simply by moving the probe over the sample. - Variability in wafer thickness is revealed from the results, enabling the management of variability during the grinding process. *Product details can be viewed in the materials available for download in PDF format.

• Sensors

The "CHRocodile 2 DPS color aberration confocal sensor" is equipped with two independent measurement channels.

In grinding operations, it is necessary to adjust the thickness of the wafer during processing. If using a non-contact, non-destructive optical measurement method, the thickness of the wafer can be monitored during processing without applying stress to the workpiece or damaging it, making it a suitable solution. Our "CHRocodile 2 DPS Chromatic Aberration Confocal Sensor" is equipped with two independent measurement channels. The sensor processes two chromatic aberration probes and synchronizes measurements and outputs in real-time, providing the final height and thickness of the wafer. 【Features】 ■ Development of chromatic aberration probes for harsh environments based on over 10 years of know-how in CMP and grinding interference measurement. ■ Non-contact measurement of wafer thickness in harsh environments. ■ Data acquisition rate of 10 kHz per probe. *For more details, please refer to the PDF document or feel free to contact us.

• Sensors

Use an appropriate light source wavelength for doped wafers to accommodate challenging doped wafer thickness measurements.

The "CHRocodile 2DW Series" is a device that can non-contact measure the thickness of materials such as wafers and coatings. It is capable of measuring doped wafers and can be applied in-line, with a proven track record among many customers. In addition to measuring the thickness of semiconductor wafers like sapphire, Si, and SiC, it can also measure the thickness of films, resins, glass, and solar cells. It supports interference film thickness of up to 16 layers. 【Features】 　■ Wide range of thickness measurement, compatible with various materials 　　　With a rich lineup of probes, it covers thickness from thin films (a few micrometers) to thick films (780 micrometers). It supports doped wafers. 　■ High resolution (sub-micron, minimum 1nm) 　■ Contributes to reducing development costs and shortening development lead times, 　　　with a software development kit (DLL, etc.) available for device integration 　■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation. Feel free to contact us with any inquiries.

• Other measurement, recording and measuring instruments
• Sensors

12" wafer full inspection accelerated, can also be used for full inspection of wafers.

The TTV, Bow, and Warp measurements of the entire wafer can be performed. With a measurement speed of up to 70,000 points per second, it is possible to measure the entire surface in about 2 minutes with a pitch of 160 µm in the XY direction. This is a full system equipped with software compliant with SEMI standards. The sensors used can be selected from our spectral interference sensor 2IT DW series, allowing for high-precision measurements with a Z resolution of 1 nm or better. The high-speed measurement of the entire wafer is made possible by our area scanner FSS310, which is incorporated into the system.

• Coating thickness gauge

Advantech Toyo will be exhibiting at the trade show "JASIS 2026," which will be held at Makuhari Messe International Exhibition Hall. At this exhibition, manufacturers of analytical and scientific instruments will gather to showcase cutting-edge scientific and analytical systems and solutions. At our booth, we will display filter products for microbiological testing and environmental analysis, water quality testing products, pure and ultra-pure water production equipment, and culture-related equipment. Additionally, we will also showcase analytical balances from Mettler Toledo, along with equipment from other well-regarded manufacturers in the industry. Our sales and technical staff will be available to assist with product selection, so please feel free to stop by!

[Speakers] Nomura Research Institute, Ltd. Global Manufacturing Consulting Department Group Manager Hirokazu Shimo Senior Consultant Shoki Tokugawa Senior Consultant Wataru Hashimoto Consultant Masaaki Amano Consultant Tomoya Nakamura [Presentation Items] 1. Key Development Themes of Major OEMs 2. Development Approaches of Each OEM 2-1. Toyota 2-2. Tesla 2-3. Suzuki 2-4. Nissan 2-5. Honda 3. Development Approaches of Suppliers 4. Key Points for Strengthening Development Capabilities 5. Q&A / Business Card Exchange

[Speaker] Ayaka Motomura, Consultant, Business Transformation Unit, NTT Data Management Research Institute [Key Lecture Content] With the advancement of Physical AI, telecommunications carriers have the opportunity to evolve from being "companies that provide lines" to companies that connect and control AI and the physical world in real-time. This seminar will organize the changes in communication demand brought about by Physical AI and the business opportunities for telecommunications carriers, while explaining the role of AIOps as the first step towards entry. Furthermore, it will discuss strategies for monetizing in the Physical AI market by deploying the operational intelligence accumulated through AIOps to network APIs and industry-specific services, as well as the layers that telecommunications carriers should hold. [Lecture Topics] Chapter 1: The Competitive Structure of the "Real World" Rewritten by Physical AI Chapter 2: Reasons Why Opportunities for "Reversal" Arise for Telecommunications Carriers in the Era of Physical AI Chapter 3: The First Step Towards Physical AI Chapter 4: Shifting AIOps from "Defense" to "Offense" Chapter 5: The Layers to Hold in the Era of Physical AI [Q&A / Business Card Exchange]

[Instructor] Partner Ryoji Mori, Eichi Law Office [Key Lecture Content] This lecture will explain the revised Personal Information Protection Act of 2028. The three-year review this time is a major revision, and it is essential to first understand where and how the revisions have been made, as well as the overall picture of the amendments. Next, we will explain the individual amendments that are practically important. The key points are as follows, but it is important to note that both the strengthening and relaxation of obligations are occurring simultaneously, increasing overall complexity. At the time of the lecture, it is expected that subordinate laws and guidelines will not yet be published, but we will discuss points that require attention upon publication. We will distinguish between what is necessary across businesses and what varies by industry. [Lecture Items] 1. Expansion of consent exceptions: Relaxation of the difficulty of obtaining consent and expansion of academic research institutions 2. Statistical exceptions: System content and how to read complex provisions (plus learning about acceptability from controversies) 3. Strengthening regulations on biometric information and children's information: Caution required for age verification 4. Contactable personal-related information: Changes in external transmission responses 5. Review of outsourcing regulations: Addition and removal of obligations for contractors 6. Administrative fines: Narrow target range and low amounts (not worth fearing) 7. Q&A / Business card exchange

[Instructor] Innovation Analyst Andy Kondo [Key Lecture Content] *The latest content will be added (changed) as appropriate based on the on-site survey of IAA Transportation 2026.* From September 15 to 20, 2026, the largest commercial vehicle exhibition in Europe, IAA Transportation, will be held in Hanover, Germany. It is a gathering place for manufacturers of commercial vehicles such as trucks and buses, as well as the parts, energy, and software that support them, occurring every two years. The cost structure of logistics, urban transportation and the environment, energy transition, decarbonization efforts, and a microcosm of the industry will reveal the future business environment just a step ahead. In this seminar, an innovation analyst who has been observing major global exhibitions such as CES and Hannover Messe for many years will report shortly after the event based on on-site coverage. Has autonomous driving become the main focus in commercial vehicles? Where is the energy transition for large vehicles settling in terms of batteries, hydrogen, and alternative fuels? How far have Chinese companies come? Based on photos taken at the venue and observations of actual products, the seminar will delve into the implications for Japanese companies.