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  3. Measurement and Analysis
  4. Other measuring instruments
  5. Coating thickness gauge
  6. SEMI-compliant 12-inch wafer thickness and shape measurement system

SEMI-compliant 12-inch wafer thickness and shape measurement system

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MIRA PRO

last updated:Nov 26, 2025

プレシテック・ジャパン
プレシテック・ジャパン
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12" wafer full inspection accelerated, can also be used for full inspection of wafers.

The TTV, Bow, and Warp measurements of the entire wafer can be performed. With a measurement speed of up to 70,000 points per second, it is possible to measure the entire surface in about 2 minutes with a pitch of 160 µm in the XY direction. This is a full system equipped with software compliant with SEMI standards. The sensors used can be selected from our spectral interference sensor 2IT DW series, allowing for high-precision measurements with a Z resolution of 1 nm or better. The high-speed measurement of the entire wafer is made possible by our area scanner FSS310, which is incorporated into the system.

    Coating thickness gauge
MIRA.png

SEMI-compliant 12-inch wafer thickness and shape measurement system

MIRA.png
MIRA.png
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■Overview - A system that integrates hardware (enclosure, optical thickness sensor, area scanner, electrical cabinet) and software (SEMI-compliant software). - High-speed measurement of up to 70kHz (measuring a 12" wafer in about 2 minutes at an XY pitch of 160um). - Z resolution of 1nm or more. ■Thickness Measurement Range The thickness measurement range varies depending on the optical sensor below. CHRocodile 2 IT DW 250: 15~1500um CHRocodile 2 IT DW 500: 26~2500um CHRocodile 2 IT DW 1000: 66~7200um *Thickness is the optical length. To convert to Si thickness, divide the above thickness by the refractive index of Si.

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P7

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12' wafer inspection

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Data Sheet: High-Speed Full Wafer Measurement System for 12" Wafers

Data Sheet: High-Speed Full Wafer Measurement System for 12" Wafers

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2026 OPIE Exhibition Information

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We will be exhibiting at OPIE 26' held at Pacifico Yokohama from April 22 to 24. Our booth will be L-37 (Light and Imaging Sensor & Imaging EXPO). We plan to showcase the 3D line sensor CLS2, a single-point thickness sensor, a distance sensor, and Enovasense, which can measure the thickness of opaque objects.

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Semicon Japan 2024

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We will be exhibiting at Semicon Japan 2024, which will be held at Tokyo Big Sight from December 11 (Wednesday) to December 12 (Friday). If you are interested, please come to the venue. ■ Products to be exhibited 1. Spectral interference optical thickness sensor CHRocodile 2 DW/ 2IT 2. Area scanner for measuring the thickness and shape of 12" wafers - Flying Spot Scanner (FSS) 3. Chromatic aberration confocal optical line sensor CLS2.0 4. Chromatic aberration confocal line camera CVC 5. Chromatic aberration confocal optical single-point sensor CHRocodile Mini 6. Non-contact thickness measurement sensor for opaque materials Enovasnese 7. Sensor for detecting internal defects non-contactly - Field sensor

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The 1st Kyushu Semiconductor Industry Exhibition

  • Seminar・Event

We will be exhibiting at the Kyushu Semiconductor Industry Exhibition held at Marine Messe Fukuoka on September 25 (Wednesday) and September 26 (Thursday), 2024. If you are interested, please come to the venue. ■ Products to be exhibited - Spectral interference optical thickness sensor CHRocodile 2 DW/2IT - Chromatic aberration confocal optical line sensor CLS2.0 - Chromatic aberration confocal optical single-point sensor CHRocodile 2S, C, Mini *This time, there will be no actual display of the FSS for 12" wafer thickness mapping measurement, but if you need an explanation or would like to request a demo, please come to our booth.

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プレシテック・ジャパン

プレシテック・ジャパン

Testing, Analysis and Measurement

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Presitech is a specialist in laser material processing and optical measurement technology. We are not just a supplier of systems and components, but a professional partner in ensuring a smooth processing process for our customers. We offer consultations from the foundational stage and accurately consult with customers on their requests and objectives. We understand that the key to success in unique processing processes lies in the four components of exhibition, monitoring, processing, and control. Only by doing so can we provide appropriate solutions for our customers' applications. Our high-quality products, such as laser processing heads, quality monitoring systems, and optical measurement systems for spacing/thickness measurement, allow customers to directly benefit from our decades of experience. Our optical sensors are characterized by the highest precision and dynamic adaptability. Furthermore, they detect accurate values even in high-speed measurements.

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