2026 OPIE Exhibition Information

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

The "CHRocodile 2 IT sensor" can measure the thickness of wafers during work processing.

In the semiconductor industry, it is necessary to measure the physical thickness of wafers at multiple manufacturing stages, such as CMP and mechanical grinding. To monitor and optimize the entire process, it is important to have a grasp of the thickness; however, this task is currently mainly performed using mechanical contact probes. These probes have significant drawbacks, including the need for contact with the wafer, surface damage, and reference values for thickness measurement from the chuck table, and they also wear out, necessitating frequent replacements. Our "CHRocodile 2 IT sensor" can measure the thickness of wafers during processing using non-contact, non-destructive optical measurement technology. 【Features】 - Optical sensor provides more accurate results than conventional contact measurement devices. - Direct feedback improves the reproducibility of wafer thickness from several micrometers to less than 0.5 micrometers. - High-speed measurement and non-contact passive probes allow for the acquisition of a large amount of thickness data across the entire wafer area simply by moving the probe over the sample. - Variability in wafer thickness is revealed from the results, enabling the management of variability during the grinding process. *Product details can be viewed in the materials available for download in PDF format.

• Sensors

12" wafer full inspection accelerated, can also be used for full inspection of wafers.

The TTV, Bow, and Warp measurements of the entire wafer can be performed. With a measurement speed of up to 70,000 points per second, it is possible to measure the entire surface in about 2 minutes with a pitch of 160 µm in the XY direction. This is a full system equipped with software compliant with SEMI standards. The sensors used can be selected from our spectral interference sensor 2IT DW series, allowing for high-precision measurements with a Z resolution of 1 nm or better. The high-speed measurement of the entire wafer is made possible by our area scanner FSS310, which is incorporated into the system.

• Coating thickness gauge

Capable of measuring the total thickness of 12-inch wafers. High-speed measurement without the influence of vibrations, without a scanning stage. Suitable for online, offline, and wafer inspection applications.

The Flying Spot Scanner 310 is an optical measuring device that can perform wide-area (up to φ310) scans using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. It can measure thickness, dimensional shapes, and inspect surface defects based on the principle of spectral interference. Additionally, due to the coaxial optical system for incident and reflected light, it is possible to obtain good results even on glossy surfaces. 【Features】 ■ Wide-area scan φ310mm ■ High resolution XY20um Beam spot diameter 40um, high Z resolution through spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit for device integration (DLL, etc.) available ■ Applications Thickness measurement of 12-inch wafer surfaces, thickness measurement of bonded wafers, void inspection *For more details, please refer to the documentation.

• 3D measuring device
• Coating thickness gauge

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. ■Features - Non-contact measurement of the thickness of opaque materials is possible, eliminating the need for destructive testing. - A wide measurement range from a minimum of 10nm to a maximum of 1mm. - High precision measurements of 0.5% to 3% or less are achievable, recommended for those lacking accuracy. - Capable of measuring various combinations of materials regardless of the base material. ■Applications Used in a wide range of fields including the automotive industry, aerospace industry, consumer goods, industrial products, medical industry, and semiconductors, for various applications such as coating thickness, metal plating thickness, and paint film thickness. *Currently, Enovasense is a group company of the German optical sensor manufacturer Precitec. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Coating thickness gauge

In addition to the conventional chromatic aberration confocal method and spectral interference method, a thickness measurement sensor utilizing laser heating has also emerged. It can measure the thickness of both transparent and opaque materials non-contactly.

Presitech is a German manufacturer of non-contact sensors. It develops and manufactures optical sensors using chromatic aberration confocal method and spectral interference method. At the end of 2022, it acquired the French company Enovasense, adding sensors that utilize laser heating to measure the thickness of opaque materials to its lineup. The company specializes in high-speed and high-precision thickness measurement, which is used for inspecting wafers, coatings, films, paint films, anti-corrosion coatings, and more. It offers a wide measurement range, tolerance angles, and can accommodate various materials, including line sensors and area scanners suitable for full surface measurement. There are numerous achievements in integrating these sensors into semiconductor manufacturing equipment, and they are also used in LCD manufacturing equipment and inline inspection of films. Additionally, they are utilized as embedded sensors for tabletop machines such as standalone units. Enovasense's sensors have also demonstrated success in measuring coating thickness for aerospace-related components. *For product details, please refer to the materials available for download in PDF format. Feel free to contact us with any inquiries.*

• Sensors

Affordable distance sensors for measuring film and coating thickness, as well as non-contact thickness measurement. Strong performance on slopes, achieving a distance direction resolution of 20nm!

Our optical distance sensor/thickness sensor 'CHRocodile C / CHRocodile Mini' from PreciTech Japan is a compact non-contact sensor with a wide measurement range. It is robust against slopes and offers high resolution in the distance direction starting from 20nm, all at an affordable price of approximately 1 million yen (excluding tax). 【Examples of Use Cases】 ● Complete inspection through height and distance measurement of manufactured products within equipment ● Quality improvement through thickness management of glass, film, and graphite coatings ⇒ Adopted by manufacturers of production equipment, inspection equipment, and integrators. 【Features】 ・Combines high resolution with a price point that lowers the purchasing barrier ・Non-contact measurement of film and coating thickness ・Strong against slopes with an angle tolerance of up to ±45 degrees ・Distance direction resolution starting from 20nm ・Flexible software creation possible with the provided software development kit ・Can be embedded in equipment ・Compatible with rough and mirror surfaces, independent of surface or shape *For product details, please refer to the materials available for download in PDF format. Feel free to contact us for inquiries.

• Distance measuring device

Embedded optical sensor for high-precision and high-speed measurement of thickness and shape.

This is a single-point sensor using a chromatic aberration confocal method from Pretech, characterized by high precision and high-speed measurement. It has a proven track record in reducing measurement time for thickness and shape, as well as in full inspection. Due to the chromatic aberration confocal method, it is also possible to use probes with a large angular tolerance. There is also a budget sensor lineup available, starting from approximately 800,000 yen. *For more details, please refer to the materials. Feel free to contact us as well.*

• Distance measuring device

This is a webinar that explains the basic concepts of nonlinear regression and practical analytical methods using JMP. We will welcome Mr. Fukushima, who is in charge of biostatistics at Takumi Information Technology and has extensive experience in the pharmaceutical industry and knowledge of statistical analysis, as our instructor. Target Audience: - Those who want to learn about nonlinear regression and understand it from the basics. - Those involved in data analysis in fields such as pharmaceuticals and manufacturing, who are interested in utilizing nonlinear models. - Those interested in data analysis using JMP and want to apply it in practice. Program: - Part 1: Introduction to Data Visualization and Nonlinear Regression An overview of the basics of nonlinear regression using non-clinical trials in the pharmaceutical industry as a subject. - Part 2: Features of Nonlinear Regression in JMP and Examples of Its Use in Quality Control An explanation focusing on the functions and features of nonlinear regression in JMP. ▼ Details & Registration https://www.jmp.com/ja/events/live-webinars/non-series/2026/06-25-nlr

[Key Lecture Content] 1. Promotion of Solar Panel Recycling Yuta Okazaki, Director, System Planning Office, General Affairs Division, Environmental Restoration and Resource Recycling Bureau, Ministry of the Environment 1. Previous efforts regarding the disposal and recycling of solar panels 2. Laws related to the promotion of resource recovery from solar cell waste 3. Q&A / Business card exchange 2. Expansion of Solar Power Generation and Formation of a Positive Cycle for Panel Resource Recycling Akihou Kawai, Analyst, Materials Team, Industrial Research Department, Mizuho Bank 1. Policy trends surrounding solar power generation 2. Trends in the solar power generation industry 3. Resource recycling related to solar power generation and panels 4. Examples of initiatives by businesses towards resource recycling - Towards glass recycling 5. Examples of initiatives by businesses towards resource recycling - Towards efficient collection 6. Examples of initiatives by businesses towards resource recycling - Guarantees and insurance for solar power generation equipment and related trends 7. Awareness of issues and directions for problem-solving regarding resource recycling of solar panels 8. Q&A / Business card exchange

[Key Lecture Content] 1. New Trends in the Submarine Cable Market: Current Status and Outlook Mr. Takuya Makiyama, Senior Researcher, Mobility and Communication Policy Headquarters, Mitsubishi Research Institute 1. Why are submarine cables attracting attention now? 2. Overview of the submarine cable market 3. Major players and changes in industry structure 4. Future outlook and expectations 5. Q&A / Business card exchange 2. Submarine Cables Supporting International Communication and KCS's Initiatives Mr. Tomonori Shinto, Executive Officer and Senior Managing Director, Technical Operations Headquarters, KDDI Cable Ship Co., Ltd. 1. Business introduction 2. Overview of submarine cables 3. Various operations related to submarine cables 4. Current status and challenges of the submarine cable industry 5. Q&A / Business card exchange

[Speaker] Ayaka Hiraki, Fellow at Deloitte Tohmatsu Research Institute, General Incorporated Association [Key Lecture Content] Due to high tariff measures and withdrawal from international organizations by the second Trump administration in the United States, military operations in Venezuela, and attacks on Iran, the world is indeed "Under Destruction." As the economy and cutting-edge technologies become intertwined with security, this lecture will analyze the trends in the defense industries of Japan, Europe, and the United States from three perspectives: "modular security," "total defense," and "the rise of artificial intelligence (AI)," while examining the potential and challenges of Japan's defense industry. [Lecture Topics] 1. Changes in Japan's security environment 2. Three points to consider for future security systems (1) Modular security architecture (2) Total defense (3) AI 3. Initiatives in Japan, Europe, and the United States (1) Europe: European defense industry strategy and strategic autonomy (2) United States: National security strategy under the Trump administration (2025 NSS) and defense innovation (3) Japan: Key points of the FY2026 budget and trends towards the revision of three strategic documents 4. Future outlook for the defense industry - possibilities and challenges regarding participation 5. Q&A

[Speaker] Anderson Mori & Tomotsune Law Office Foreign Law Joint Enterprise Partner Attorney Eiji Kobayashi [Lecture Topics] 1. FIT/FIP System in Solar Power Generation Business (1) Overview of FIT/FIP System Based on Renewable Energy Law (2) Background of Amendments to Renewable Energy Law Related to Solar Power Generation Business (3) Key Practical Points in Current Renewable Energy Law 2. Amendments and Regulations Related to Solar Power Generation Business (1) Forest Law (2) Electricity Business Law (3) Environmental Impact Assessment (4) Landscape Law (5) Others 3. Q&A Session