2026 OPIE Exhibition Information

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

The "CHRocodile 2 IT sensor" can measure the thickness of wafers during work processing.

In the semiconductor industry, it is necessary to measure the physical thickness of wafers at multiple manufacturing stages, such as CMP and mechanical grinding. To monitor and optimize the entire process, it is important to have a grasp of the thickness; however, this task is currently mainly performed using mechanical contact probes. These probes have significant drawbacks, including the need for contact with the wafer, surface damage, and reference values for thickness measurement from the chuck table, and they also wear out, necessitating frequent replacements. Our "CHRocodile 2 IT sensor" can measure the thickness of wafers during processing using non-contact, non-destructive optical measurement technology. 【Features】 - Optical sensor provides more accurate results than conventional contact measurement devices. - Direct feedback improves the reproducibility of wafer thickness from several micrometers to less than 0.5 micrometers. - High-speed measurement and non-contact passive probes allow for the acquisition of a large amount of thickness data across the entire wafer area simply by moving the probe over the sample. - Variability in wafer thickness is revealed from the results, enabling the management of variability during the grinding process. *Product details can be viewed in the materials available for download in PDF format.

• Sensors

12" wafer full inspection accelerated, can also be used for full inspection of wafers.

The TTV, Bow, and Warp measurements of the entire wafer can be performed. With a measurement speed of up to 70,000 points per second, it is possible to measure the entire surface in about 2 minutes with a pitch of 160 µm in the XY direction. This is a full system equipped with software compliant with SEMI standards. The sensors used can be selected from our spectral interference sensor 2IT DW series, allowing for high-precision measurements with a Z resolution of 1 nm or better. The high-speed measurement of the entire wafer is made possible by our area scanner FSS310, which is incorporated into the system.

• Coating thickness gauge

Capable of measuring the total thickness of 12-inch wafers. High-speed measurement without the influence of vibrations, without a scanning stage. Suitable for online, offline, and wafer inspection applications.

The Flying Spot Scanner 310 is an optical measuring device that can perform wide-area (up to φ310) scans using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. It can measure thickness, dimensional shapes, and inspect surface defects based on the principle of spectral interference. Additionally, due to the coaxial optical system for incident and reflected light, it is possible to obtain good results even on glossy surfaces. 【Features】 ■ Wide-area scan φ310mm ■ High resolution XY20um Beam spot diameter 40um, high Z resolution through spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit for device integration (DLL, etc.) available ■ Applications Thickness measurement of 12-inch wafer surfaces, thickness measurement of bonded wafers, void inspection *For more details, please refer to the documentation.

• 3D measuring device
• Coating thickness gauge

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. ■Features - Non-contact measurement of the thickness of opaque materials is possible, eliminating the need for destructive testing. - A wide measurement range from a minimum of 10nm to a maximum of 1mm. - High precision measurements of 0.5% to 3% or less are achievable, recommended for those lacking accuracy. - Capable of measuring various combinations of materials regardless of the base material. ■Applications Used in a wide range of fields including the automotive industry, aerospace industry, consumer goods, industrial products, medical industry, and semiconductors, for various applications such as coating thickness, metal plating thickness, and paint film thickness. *Currently, Enovasense is a group company of the German optical sensor manufacturer Precitec. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Coating thickness gauge

In addition to the conventional chromatic aberration confocal method and spectral interference method, a thickness measurement sensor utilizing laser heating has also emerged. It can measure the thickness of both transparent and opaque materials non-contactly.

Presitech is a German manufacturer of non-contact sensors. It develops and manufactures optical sensors using chromatic aberration confocal method and spectral interference method. At the end of 2022, it acquired the French company Enovasense, adding sensors that utilize laser heating to measure the thickness of opaque materials to its lineup. The company specializes in high-speed and high-precision thickness measurement, which is used for inspecting wafers, coatings, films, paint films, anti-corrosion coatings, and more. It offers a wide measurement range, tolerance angles, and can accommodate various materials, including line sensors and area scanners suitable for full surface measurement. There are numerous achievements in integrating these sensors into semiconductor manufacturing equipment, and they are also used in LCD manufacturing equipment and inline inspection of films. Additionally, they are utilized as embedded sensors for tabletop machines such as standalone units. Enovasense's sensors have also demonstrated success in measuring coating thickness for aerospace-related components. *For product details, please refer to the materials available for download in PDF format. Feel free to contact us with any inquiries.*

• Sensors

Affordable distance sensors for measuring film and coating thickness, as well as non-contact thickness measurement. Strong performance on slopes, achieving a distance direction resolution of 20nm!

Our optical distance sensor/thickness sensor 'CHRocodile C / CHRocodile Mini' from PreciTech Japan is a compact non-contact sensor with a wide measurement range. It is robust against slopes and offers high resolution in the distance direction starting from 20nm, all at an affordable price of approximately 1 million yen (excluding tax). 【Examples of Use Cases】 ● Complete inspection through height and distance measurement of manufactured products within equipment ● Quality improvement through thickness management of glass, film, and graphite coatings ⇒ Adopted by manufacturers of production equipment, inspection equipment, and integrators. 【Features】 ・Combines high resolution with a price point that lowers the purchasing barrier ・Non-contact measurement of film and coating thickness ・Strong against slopes with an angle tolerance of up to ±45 degrees ・Distance direction resolution starting from 20nm ・Flexible software creation possible with the provided software development kit ・Can be embedded in equipment ・Compatible with rough and mirror surfaces, independent of surface or shape *For product details, please refer to the materials available for download in PDF format. Feel free to contact us for inquiries.

• Distance measuring device

Embedded optical sensor for high-precision and high-speed measurement of thickness and shape.

This is a single-point sensor using a chromatic aberration confocal method from Pretech, characterized by high precision and high-speed measurement. It has a proven track record in reducing measurement time for thickness and shape, as well as in full inspection. Due to the chromatic aberration confocal method, it is also possible to use probes with a large angular tolerance. There is also a budget sensor lineup available, starting from approximately 800,000 yen. *For more details, please refer to the materials. Feel free to contact us as well.*

• Distance measuring device

We will be exhibiting at the "Automotive World Nagoya" held at Aichi Sky Expo in Aichi Prefecture. New technologies on cutting-edge themes in the automotive industry, such as autonomous driving, vehicle electrification, connected cars, and lightweighting, will be showcased all in one place. It will be an excellent opportunity for business discussions and technical consultations with automobile manufacturers, auto parts manufacturers, and suppliers from the Chubu and Kinki regions. We sincerely look forward to your visit.

[Instructor] Miki Yoshinobu, President and CEO of Toraizu Co., Ltd. (Former Chief of Staff at SoftBank) [Key Lecture Content] During his time as Chief of Staff at SoftBank, the instructor developed a "super practical project management technique to reach goals in the shortest and fastest way" after being given numerous challenging projects by President Masayoshi Son. "This project management skill is not something that is only necessary for special projects. In today's rapidly changing environment, routine work is fundamentally disappearing. It is becoming essential to continuously reassess everything from a zero-based perspective. In other words, whether it's creating materials requested by a superior or engaging in sales activities, everything has become 'project-like work.' Therefore, in this seminar, we will clearly explain the basics of project management and practical methods for the field."

[Archive Distribution] How to Standardize Black Box Legacy Systems and Field Operations and Transition to a New System Legacy systems that have become black boxes after many years since their introduction. Amid urgent calls for renewal due to the "2025 Cliff" and the "Logistics 2024 Problem," many responsible individuals feel pressure with concerns like "I don't know how to write an RFP," "I'm worried about missing requirements," and "I can't afford to fail." In this seminar, we will thoroughly explain the "steps to create a successful RFP" to lead logistics DX to success. We will specifically discuss the standardization of operations that abandon current practices and data integration strategies. Additionally, we will introduce common pitfalls through actual failure cases. [Recommended for] - Logistics planners, IT system personnel, and DX promotion staff from shipper companies and logistics companies. - Those who are tasked with renewing black box legacy systems and feel pressure, or those who are anxious about "missing requirements" and "vendor selection." - Recommended for those seeking practical insights from writing a correct RFP to standardizing current operations, internal adjustments, and ROI calculation tips. [Speaker] Technology Services Division SI Department Manager Tomoya Mitsuhashi

Global Information, in collaboration with the partner research company Howe Sound Research, will host a free co-sponsored webinar titled "How AI is Transforming the In Vitro Diagnostics (IVD) Market: Technological Innovations and Business Opportunities Driving Growth." ■ Content We will explain the changes brought about by AI in the IVD market and future growth opportunities. We will cover how AI technologies, including machine learning, deep learning, and advanced data analytics, are being utilized across a wide range of diagnostic fields such as clinical chemistry, molecular diagnostics, pathology, genomics, immunoassays, microbiology, and point-of-care testing (POCT). ■ Language Japanese and English *The presentation will be conducted in English (with Japanese subtitles). ■ Speaker Speaker: Greg Powell, President of Howe Sound Research ■ Agenda *The schedule/content below is subject to change. 1. About Howe Sound Research 2. Gradual and significant changes in IVD 3. Perspectives on IVD products 4. The impact of AI 5. Present and future 6. New approaches to R&D 7. Summary

This seminar will provide a detailed explanation of how to integrate data between Salesforce and other systems. There are three methods for data integration with Salesforce: the "Data Loader," which is provided free of charge by Salesforce, the "Web API" developed individually, and the highly extensible "Data Integration Tools (EAI Tools)." We will compare the advantages and disadvantages of each method and provide tips for finding the most suitable integration method for your company's needs, incorporating actual case studies. <Recommended for> - Those who are struggling with data integration between Salesforce and core systems - Those who find that the burden on the field is a challenge, hindering the utilization of Salesforce - Those who want to easily integrate data with peripheral systems