2026 OPIE Exhibition Information

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

The "CHRocodile 2 IT sensor" can measure the thickness of wafers during work processing.

In the semiconductor industry, it is necessary to measure the physical thickness of wafers at multiple manufacturing stages, such as CMP and mechanical grinding. To monitor and optimize the entire process, it is important to have a grasp of the thickness; however, this task is currently mainly performed using mechanical contact probes. These probes have significant drawbacks, including the need for contact with the wafer, surface damage, and reference values for thickness measurement from the chuck table, and they also wear out, necessitating frequent replacements. Our "CHRocodile 2 IT sensor" can measure the thickness of wafers during processing using non-contact, non-destructive optical measurement technology. 【Features】 - Optical sensor provides more accurate results than conventional contact measurement devices. - Direct feedback improves the reproducibility of wafer thickness from several micrometers to less than 0.5 micrometers. - High-speed measurement and non-contact passive probes allow for the acquisition of a large amount of thickness data across the entire wafer area simply by moving the probe over the sample. - Variability in wafer thickness is revealed from the results, enabling the management of variability during the grinding process. *Product details can be viewed in the materials available for download in PDF format.

• Sensors

12" wafer full inspection accelerated, can also be used for full inspection of wafers.

The TTV, Bow, and Warp measurements of the entire wafer can be performed. With a measurement speed of up to 70,000 points per second, it is possible to measure the entire surface in about 2 minutes with a pitch of 160 µm in the XY direction. This is a full system equipped with software compliant with SEMI standards. The sensors used can be selected from our spectral interference sensor 2IT DW series, allowing for high-precision measurements with a Z resolution of 1 nm or better. The high-speed measurement of the entire wafer is made possible by our area scanner FSS310, which is incorporated into the system.

• Coating thickness gauge

Capable of measuring the total thickness of 12-inch wafers. High-speed measurement without the influence of vibrations, without a scanning stage. Suitable for online, offline, and wafer inspection applications.

The Flying Spot Scanner 310 is an optical measuring device that can perform wide-area (up to φ310) scans using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. It can measure thickness, dimensional shapes, and inspect surface defects based on the principle of spectral interference. Additionally, due to the coaxial optical system for incident and reflected light, it is possible to obtain good results even on glossy surfaces. 【Features】 ■ Wide-area scan φ310mm ■ High resolution XY20um Beam spot diameter 40um, high Z resolution through spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit for device integration (DLL, etc.) available ■ Applications Thickness measurement of 12-inch wafer surfaces, thickness measurement of bonded wafers, void inspection *For more details, please refer to the documentation.

• 3D measuring device
• Coating thickness gauge

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. ■Features - Non-contact measurement of the thickness of opaque materials is possible, eliminating the need for destructive testing. - A wide measurement range from a minimum of 10nm to a maximum of 1mm. - High precision measurements of 0.5% to 3% or less are achievable, recommended for those lacking accuracy. - Capable of measuring various combinations of materials regardless of the base material. ■Applications Used in a wide range of fields including the automotive industry, aerospace industry, consumer goods, industrial products, medical industry, and semiconductors, for various applications such as coating thickness, metal plating thickness, and paint film thickness. *Currently, Enovasense is a group company of the German optical sensor manufacturer Precitec. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Coating thickness gauge

In addition to the conventional chromatic aberration confocal method and spectral interference method, a thickness measurement sensor utilizing laser heating has also emerged. It can measure the thickness of both transparent and opaque materials non-contactly.

Presitech is a German manufacturer of non-contact sensors. It develops and manufactures optical sensors using chromatic aberration confocal method and spectral interference method. At the end of 2022, it acquired the French company Enovasense, adding sensors that utilize laser heating to measure the thickness of opaque materials to its lineup. The company specializes in high-speed and high-precision thickness measurement, which is used for inspecting wafers, coatings, films, paint films, anti-corrosion coatings, and more. It offers a wide measurement range, tolerance angles, and can accommodate various materials, including line sensors and area scanners suitable for full surface measurement. There are numerous achievements in integrating these sensors into semiconductor manufacturing equipment, and they are also used in LCD manufacturing equipment and inline inspection of films. Additionally, they are utilized as embedded sensors for tabletop machines such as standalone units. Enovasense's sensors have also demonstrated success in measuring coating thickness for aerospace-related components. *For product details, please refer to the materials available for download in PDF format. Feel free to contact us with any inquiries.*

• Sensors

Affordable distance sensors for measuring film and coating thickness, as well as non-contact thickness measurement. Strong performance on slopes, achieving a distance direction resolution of 20nm!

Our optical distance sensor/thickness sensor 'CHRocodile C / CHRocodile Mini' from PreciTech Japan is a compact non-contact sensor with a wide measurement range. It is robust against slopes and offers high resolution in the distance direction starting from 20nm, all at an affordable price of approximately 1 million yen (excluding tax). 【Examples of Use Cases】 ● Complete inspection through height and distance measurement of manufactured products within equipment ● Quality improvement through thickness management of glass, film, and graphite coatings ⇒ Adopted by manufacturers of production equipment, inspection equipment, and integrators. 【Features】 ・Combines high resolution with a price point that lowers the purchasing barrier ・Non-contact measurement of film and coating thickness ・Strong against slopes with an angle tolerance of up to ±45 degrees ・Distance direction resolution starting from 20nm ・Flexible software creation possible with the provided software development kit ・Can be embedded in equipment ・Compatible with rough and mirror surfaces, independent of surface or shape *For product details, please refer to the materials available for download in PDF format. Feel free to contact us for inquiries.

• Distance measuring device

Embedded optical sensor for high-precision and high-speed measurement of thickness and shape.

This is a single-point sensor using a chromatic aberration confocal method from Pretech, characterized by high precision and high-speed measurement. It has a proven track record in reducing measurement time for thickness and shape, as well as in full inspection. Due to the chromatic aberration confocal method, it is also possible to use probes with a large angular tolerance. There is also a budget sensor lineup available, starting from approximately 800,000 yen. *For more details, please refer to the materials. Feel free to contact us as well.*

• Distance measuring device

Connectors exist in very large numbers in the world. It is very difficult for customers to find connectors that match their specific applications from among them. The "Product Finder" on the ODU website serves as a tool to help find the right connector products. You can search for the optimal connector from various approaches, such as matching it to your cable, electrical specifications, waterproofing, etc. The connectors you search for will provide information on electrical specifications, durability, and also CAD data. In the online seminar, we will introduce how easy and quick it is to search for connectors using the "Product Finder" in a live format. ------------ Date and Time: November 19, 2026 (Thursday) 14:00 - 14:35 Venue: Online (A URL for the venue will be sent via email after you register) Speakers: Miho Kato, Sales Department, Kamex ONE Co., Ltd. Masaru Kimura, Sales Manager, ODU Japan Co., Ltd. ------------

KAI Group will be exhibiting at the "Advanced Materials Technology Exhibition 2026" held at Tokyo Big Sight. This exhibition widely introduces advanced materials and technologies in the industrial sector, covering everything from materials to their processing. It provides an essential venue for business discussions that are crucial for the development of new technologies and products in advanced fields. We plan to showcase industrial blades, cutters, and scissors with exceptional sharpness, leveraging the technology we have cultivated through our razor products. We sincerely look forward to your visit.

We will be exhibiting products that have undergone surface treatment through thermal spraying. Specifically, we will showcase products that have been ceramic thermally sprayed on metal rolls and aluminum alloy products that have undergone hard surface treatment. We provide a comprehensive service for thermal spraying repairs of parts that have lost thickness due to wear, surface modification of metal components, and other related machining processes. Exhibition Dates: November 11 (Wednesday) to 13 (Friday), 2026 - 3 days Opening Hours: 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Hall 2

Kinoshita Corporation will exhibit at "N-Plus 2026," held at Tokyo Big Sight from November 11 (Wednesday) to 13 (Friday), as a member of the Japan Nonwoven Fabric Association's joint pavilion. In this exhibition, we will introduce a wide range of products, including the water-soluble and biodegradable nonwoven fabric "Haibios," themed "Returning to Paper," as well as the pulp nonwoven fabric "Kinari-to," which can be thermoformed. Additionally, we will have a mini sound absorption experience corner where you can actually test the differences in sound using our pulp-based sound-absorbing material "Otocell." We will showcase the various possibilities of our airlaid nonwoven fabrics through actual product displays and demonstrations. Please come and see our products and samples at the venue.

We will be exhibiting at the 46th Nano Testing Symposium (NANOTS2026) held at the Senri Life Science Center in Toyonaka City, Osaka Prefecture! Booth: Senri Room (6F) No. 28 We will be introducing our latest analytical technology services, so please stop by! We sincerely look forward to your visit.