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Solve problems such as electronic device failures due to siloxane and impacts during transportation with the non-silicone case "Gel Base"!

When transporting precision parts, do you have any of these concerns? - The product was damaged due to impact during transport... - Electronic components failed due to siloxane emitted from silicone cases... - Static electricity affected the parts... The transport case 'Gelbase' developed by Exile protects products from shaking and impact during transport with its soft urethane gel sheet and the gel's self-adhesiveness. Additionally, because it is non-silicone, there is no risk of siloxane, which can cause failures during transport, and it is also treated to prevent static electricity, contributing to a reduction in defective products during transport. You can choose the sheet shape, size, color, and height according to your application. ★ Currently offering samples ★ If you are interested, please check the materials or contact us through our website. 【Features】 ■ Non-silicone ■ No adhesive transfer to parts ■ Stackable trays and cases ■ Can be picked up without a vacuum device due to surface irregularities

• Other electronic parts

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. During transport, it protects precision parts from vibrations and is also highly effective for fixing semiconductor components. It can be used with peace of mind as it is free of adhesive materials and siloxane. During transport, parts are securely fixed, and they can be easily picked up by creating a vacuum with a vacuum device. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe transportation. ■ Minimal change in adhesive strength over time! The adhesive strength remains stable over time, maintaining ease of pickup. ■ No siloxane influence due to non-silicone specifications! Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no transfer of adhesive to the parts.

• Other electronic parts

Protects IC chips and electronic components from vibrations, ensuring safe storage and transportation! This is a domestically produced semiconductor component transport case with a short delivery time and silicone-free specifications.

Gelbase can be used for the transportation of small components such as IC chips and electronic parts within factories, during processes, and for overseas shipping. It protects semiconductor components from vibrations and also serves as a tray for securing devices during transport. Even when overseas products are hard to obtain due to domestic manufacturing, we achieve small lot sizes and short delivery times! It can be used safely as it is free from adhesive materials and siloxanes. 【Features】 - The soft gel material protects IC chips and other components from vibrations and shocks during transport, preventing damage. - The materials/separators are non-silicone, so there is no influence from siloxanes. - A self-adhesive gel is used on the loading surface, ensuring no adhesive transfer to the components since no adhesive materials are used. - Being domestically produced allows for short delivery times. ⇒ While overseas products may take several months from order to delivery, we can deliver immediately because it is made in Japan. - Supports small lot sizes. ⇒ Available for sale in quantities of 10 or more. - No vacuum device is needed during pickup. - Anti-static processing.

• Other electronic parts

Sample giveaway! For holding and storing precision parts and chips. Protects precision parts and allows for pickup without a vacuum device!

The soft gel prevents damage during the transport of precision parts from vibrations and other factors. Since it does not use adhesive materials, there is no risk of glue transfer to the parts, and there is also no concern about siloxane transfer as silicone is not used in the material. 【Key Points of Gel Base】 ■ Non-Silicone! There is no concern about transfer since silicone is not used in the material. ■ No glue transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no glue transfer to the parts. ■ Anti-static treatment! Conductivity is imparted to the material, preventing electrostatic damage to the parts. ■ Stackable trays and cases! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up without a vacuum device! The cloudy mesh type has a surface with irregularities, allowing for pickup without a vacuum device. *For more details, please download the materials or contact us through our website.

• Other electronic parts

Protect semiconductor chips and precision devices from vibrations for safe storage and transportation! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. It protects precision parts from vibrations and is also highly effective for securing devices during the transport of components like semiconductors. It can be used with peace of mind as it is free of adhesive materials and siloxanes. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe handling. ■ No silicone used, so there is no impact from siloxanes. Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! The loading surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. ■ Anti-static treatment! It prevents static destruction of components. ■ Trays and cases can be stacked! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up even without a vacuum device!

• Other electronic parts

Are you struggling with product defects in chips and precision parts? Prevent device failures with adhesive-free, non-silicone holding sheets!

The soft gel prevents damage during the transport of precision parts due to vibrations and other factors. Since it does not use adhesive materials, there is no risk of glue transfer to the parts, and there is also no concern about siloxane transfer as it does not use silicone in the material. This is a non-silicone sheet that can be attached to cases for temporary fixation of parts or laid on workbenches for holding. **Key Points of the Gel Base** - **Non-Silicone!** The material does not contain silicone. - **No Glue Transfer to Parts!** The load-bearing surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. - **Static Electricity Prevention!** The material is endowed with conductivity to prevent static destruction of parts. - **Can Be Cut with Scissors, Size Adjustable!** The sheet can be cut with scissors, allowing you to use it according to the size of your cases or trays. - **Can Be Picked Up Without a Vacuum Device!** The cloudy mesh type has a textured surface, allowing for pickup without a vacuum device.

• Other electronic parts

Gently removes dust with the softness and stickiness of the gel! Catches fine dust without damaging circuit boards and other surfaces!

The soft gel prevents damage from vibrations during the transport of precision parts. Since it does not use adhesive materials, there is no worry about glue transfer to the parts. 【Important Points of the Gel Cleaner Pen】 ■ Does not scratch parts! Due to its soft material, it can remove dust without scratching chips or devices. ■ No glue transfer to parts! It uses self-adhesive gel to pick up dirt, so it does not use adhesive materials, and there is no transfer of glue to the device. ■ Reusable! Dirt can be transferred to a transfer sheet or washed away with water, allowing it to be cleaned effectively. Once dried, its adhesive properties are restored, making it reusable. ■ For picking parts! Utilizing the gel's adhesion, it can also be used for picking up small parts. ■ Choose from different pen tip shapes! There are four types of pen tip shapes available, allowing you to choose according to your needs. *For more details, please download the materials or contact us through our website.

• Other electronic parts

Are you troubled by dirt on your fingertips while working? Simply grip to remove fine dust from the gloves. Can be reused by washing with water!

Tip remover is a fingertip adhesive gel designed to remove dirt and grease from gloves. It allows you to remove foreign substances attached to gloves without interrupting your workflow. Its hollow structure makes it easy to grip and conforms well to your fingers. By gently rubbing it with your palm under running water, dirt is removed, and the adhesive power is restored. ★Using a dedicated cleaner also allows for disinfection★ 【Important Points of Tip Remover】 ■ Easy-to-grip structure that effectively catches fine dust on fingertips! Made from soft gel material. Its hollow structure adheres closely to the fingertips. ■ No silicone or plasticizers used in the materials. ■ No adhesive materials used! It utilizes the gel's self-adhesive properties to remove dirt. It does not transfer glue to gloves and does not become sticky. It can be installed in any preferred location such as desks, walls, or ceilings according to your needs, and can also be removed. (Note: Installation may not be possible depending on the material of the surface.) ■ Wash with water to remove dirt! Can be washed completely! When it gets dirty, washing it with water restores its adhesive properties, allowing for repeated use. Using a dedicated cleaner also enables disinfection. *For more details, please download and view the catalog.

• Other safety and hygiene products

About ROAD: The "Roundtable on the Purpose of Autonomous Driving (ROAD)" conference series has evolved into a unique platform for interdis-ciplinary dialogue and international collaboration in the field of autonomous driving and autonomous mobility. Established in 2016, ROAD has brought together researchers, industry leaders, and public sector stakeholders from six countries across three continents. Based on this background, the upcoming ROAD 2026 will focus on "safety” and "driving AI”—the final pieces of the autonomous driving puzzle—to advance discussions on establishing the foundational framework for ensuring safety quality and obtaining regular-tory approval for autonomous driving. We also intend to discuss the international commonalities and differences regarding the social value brought about by ADS vehicles in terms of automation, intelligent driving, and mobility. We have established a total of five compelling themes for the Round Workshops, consisting of two topics related to “The Last Piece” and three topics related to the social value of ADS, as shown below. 1) Round Workshop 1 - Horizons of E2E Driving AI → Can AI Understand the Driving Environment Like Humans? 2) Round Workshop 2 - Beyond the Unknown: Safety Cases for ADS → Can Safety Ever Be Proven? 3) Round Workshop 3 - Envisioning Smart City Mobility → Can Smart City Mobility Bridge the Mobility Divide? 4) Round Workshop 4 - Logistics Enhancement Through Autonomous Tracking → Will Logistics Become Human-Free? 5) Round Workshop 5 - The Evolution of CASE: SDV/AIDV → Will Automakers Become AI Companies? We hope you’ll all join us!

[Speaker] Masashi Sugita, President and CEO of LEX Style Co., Ltd. [Key Lecture Content] The power consumption of AI servers used in data centers has significantly increased, making traditional air cooling insufficient for operation. This lecture will organize the requirements for introducing a liquid cooling system into air-cooled data centers and explain the implementation method using free cooling with specific design details. When handling high-density AI servers, energy efficiency is required, and the widely used energy efficiency indicator, as well as the Ministry of Economy, Trade and Industry's Resource and Energy Agency's PUE regulation of "1.3 or below," will be explained along with practical operational insights. [Lecture Items] 1. Heat dissipation methods for high-density, high-heat AI servers 2. Basics and importance of PUE/pPUE 3. PUE regulation of "1.3 or below" by the Ministry of Economy, Trade and Industry's Resource and Energy Agency 4. AI server implementation and requirements for new data centers 5. Summary and future outlook 6. Q&A / Business card exchange

[Key Lecture Content] 1. Promotion of SAF Introduction Yasushi Yamashita, Director, Carbon Neutral Promotion Office, Aviation Bureau, Ministry of Land, Infrastructure, Transport and Tourism 1. Importance of SAF in the decarbonization of the aviation sector 2. Initiatives to promote the introduction of SAF 3. Q&A / Business card exchange 2. Japan Airlines' Challenge Towards Net Zero CO2 Emissions by 2050 Kazuki Hirotani, Group Leader, GX Planning Group, Sustainability Promotion Department, Japan Airlines Co., Ltd. 1. Introduction of our five initiatives for CO2 emission reduction 2. Initiatives for reducing fuel consumption (introduction of fuel-efficient aircraft, operational improvements) 3. Initiatives for fuel transition (sustainable aviation fuel SAF) 4. Initiatives for reductions outside the value chain (carbon credits, new removal technologies) 5. Initiatives to deepen collaboration with society 6. Q&A / Business card exchange

[Instructor] Yuichiro Kabushiki, Partner Lawyer at TMI Comprehensive Law Office [Key Lecture Content] With the spread of AI, there is growing attention on the civil liability of developers, providers, and users of AI. The Ministry of Economy, Trade and Industry will publish "Guidelines on the Interpretation and Application of Civil Liability in AI Utilization" in April 2026, and the Ministry of Justice will also establish an expert meeting to examine civil liability related to unauthorized use of images and voices generated by AI in the same month. As the full enforcement of the AI Promotion Act and the revision of AI guidelines are underway, it is necessary to design and operate governance based on the potential responsibilities that may arise retrospectively. In this seminar, based on the guidelines from the Ministry of Economy, Trade and Industry and drawing on litigation practice experience as a judge and lawyer, we will organize the basic framework for assessing civil liability and explain fundamental methods for designing and operating governance based on risk analysis. Furthermore, we will examine the framework for civil liability and the design and operation of governance using hypothetical cases that are likely to pose practical issues.

In this seminar, we will welcome Mr. Satoru Hayami from Waseda University, who will explain the latest trends in AI utilization in manufacturing, as well as the evolution of technologies such as agent-based AI and physical AI, and the opportunities and key points for practical application in the manufacturing industry. Furthermore, Mr. Tsubasa Shibata, representative of Next Opt, will introduce processes aimed at practical implementation, incorporating actual case studies from manufacturing sites. We hope you will envision the "potential for AI utilization in your company" and take home hints that will lead to improvements in your operations starting tomorrow. We look forward to your participation.