We will exhibit at the Total Solution Exhibition for Electronic Devices 2025.

2025 Electronics Packaging Society Technical Award Winner!" "55th Mechanical Industry Design Award IDEA Winner!

Takaya Corporation has announced a new model of its flying probe tester, the "APT-2400F/APT-2600FD series," which reliably detects various defects in printed circuit boards through ultra-high-speed inspection. Equipped with cutting-edge inspection technology that can check the placement and connections of fine components with high precision, it ensures that even minor defects and risks are not overlooked, strongly supporting the improvement of product quality. Additionally, thanks to the company's unique control mechanisms and sensing technology, reliable inspections can be achieved even in fluctuating environments, contributing to quality management by reducing recall risks. Furthermore, it features a user-friendly interface that anyone can intuitively operate, helping to alleviate burdens in workplaces where labor shortages are becoming serious, while still ensuring high inspection accuracy and contributing to increased productivity. *For more details, please download the PDF document or feel free to contact us.*

• Circuit Board Inspection Equipment

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F is a next-generation flying probe tester that boasts industry-leading probing accuracy capable of inspecting high-density mounted circuit boards. With its unique control mechanisms and sensing technology, it achieves highly reliable electrical testing in all environments. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your circuit boards. We can conduct a series of tests including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measurement, recording and measuring instruments

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F-SL is a large model that maintains the basic performance of the APT-2400F while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it is capable of inspecting long boards up to W985×D610mm. It can accommodate component heights of up to 60mm on the top and 120mm on the bottom, and can handle board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

• Other measurement, recording and measuring instruments

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototyping to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.*

• Circuit Board Inspection Equipment

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD-SL is a large model that maintains the basic performance of the APT-2600FD while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. On July 31, 2025, at the Keidanren Kaikan in Otemachi, Chiyoda-ku, Tokyo, this product received the "Nikkankogyo Shimbun 110th Anniversary Award" at the "55th Mechanical Industry Design Award IDEA" ceremony. The judging committee praised the design philosophy that balances inspection efficiency and reliability, providing an opportunity for our technological and product design capabilities to be widely recognized. *For more details, please feel free to contact us.*

• Circuit Board Inspection Equipment

Data collection and accumulation from RFID devices, along with the visualization of the collected data, realized through cloud services!

Feature 1: No Development Required for RFID Control RFID devices are autonomous, so PC control and software development are unnecessary. RFID can be easily implemented as one of the IoT edge devices. RFID devices compatible with MQTT communication send the RFID reading data to the cloud. Feature 2: Data Collection We provide an IoT platform as a cloud service. If you can connect to the internet, you can store IC tag data in the cloud. Feature 3: API Service Data accumulated in the cloud can be retrieved via API. It can be easily utilized in dashboard displays and higher-level systems. Feature 4: Visualization We provide a standard dashboard that allows you to analyze work performance using a web browser. - Average work time per process - Work time aggregation by line - Average work time ratio by worker, etc.

• IC tag

TAKAYA IoT platform utilizing cloud environment

In recent years, with the promotion of work style reform, there has been an increasing demand for improved productivity and the correction of long working hours, necessitating companies to accurately grasp the actual working hours and tasks of their employees. However, the accuracy of data collection remains unclear. Particularly in the manufacturing industry, many cases still use handwritten forms, leading to challenges such as missing entries and mistakes that make it difficult to obtain accurate performance information. Against this backdrop, our company has developed an "RFID Work Performance Collection System" that allows performance data to be transmitted simply by placing an RFID tag on an autonomous RFID reader. Since there is no need to record at the start and completion of work, workers can naturally and accurately record their working hours without being conscious of it. Because performance data can be easily collected, more time can be allocated to data analysis, allowing for effective utilization as profit improvement data for reviewing personnel allocation and understanding and improving the status of each process.

• Other operation management software

The existing system remains unchanged! You can easily implement inventory inspection for inbound and outbound using RFID.

Attach IC tags to managed items and realize the collection of inventory data for inbound and outbound operations as well as stocktaking using RFID. This package absorbs the challenges of reader-writer control in building an RFID system, so there is no need for RFID development on the customer's side. It integrates with upper-level systems via CSV or API, allowing for the introduction of RFID into existing WMS or core systems in a plug-in manner. This is a simple and easy-to-understand package specifically designed for RFID data collection. 【Features】 ■ Bulk Reading The bulk reading feature of RFID significantly improves the efficiency of inbound and outbound inventory operations. Additionally, operations can be tailored to the customer's environment and business needs, whether using handheld devices or gates. ■ IC Tag Issuance The package includes an IC tag issuance function using RFID-compatible label printers. Even if IC tags cannot be attached at the manufacturing (sourcing) stage, they can be issued within the company. ■ Integration with Upper-Level Systems It integrates with upper-level systems via API or CSV. Existing systems can remain unchanged while introducing the RFID system in a plug-in manner.

• IC tag

Since it's a cloud service, no server is needed! You can start with just one handy device.

Attach IC tags to managed items and realize the collection of inbound and outbound records, as well as inventory counts, using RFID. This package absorbs the challenges of reader-writer control in building an RFID system, eliminating the need for RFID development on the customer's side. It integrates with upper systems via CSV or API, allowing for the introduction of RFID into existing WMS or core systems with a plug-in feel. It is a simple and easy-to-understand package specialized for RFID record collection. 【Features】 ■ Start immediately As a cloud service, no server is required. You can start with just one handheld device, making it ideal for Proof of Concept (PoC). ■ Bulk reading The bulk reading feature of RFID significantly streamlines inbound and outbound inventory operations. Additionally, operations can be tailored to the customer's environment and business, whether using handheld devices or gates. ■ IC tag issuance The package includes an IC tag issuance function using RFID-compatible label printers. Even if IC tags cannot be attached at the manufacturing (sourcing) stage, they can be issued in-house. ■ Integration with upper systems It integrates with upper systems via API or CSV. Existing systems can remain unchanged while introducing the RFID system with a plug-in feel.

• IC tag

We will be holding the second webinar on aluminum foil, which received great acclaim last time. This is an opportunity to deepen your knowledge about aluminum foil, so please join us. 【Webinar Details】 Content: Introduction to the Manufacturing Methods and Functional Aluminum Foils vol.2 Date: February 20 (Friday) Time: 15:00 - 16:00 Participation Fee: Free How to Participate: A Zoom viewing URL will be sent to those who register by the day before. Capacity: 100 people 【Recommended for the Following Individuals】 - Those who have challenges related to metal foils or resin films - Those interested in joint research with foil manufacturers or new business development - Those interested in functional aluminum foils with high smoothness, high corrosion resistance, high strength, and luxurious designs ▼ Register here (Microsoft Forms) https://forms.cloud.microsoft/r/UA5g4N2fGU (dummy) ▼ If you have any further questions, please contact us at the email address below. foil-marketing@toyal.co.jp

This is a seminar introducing the new features of the latest version, Ver. 30, of the general-purpose 2D CAD system "EASYDRAW." Customers currently using EASYDRAW can achieve further efficiency and utilize convenient features by taking advantage of the new functionalities, so we encourage you to consider attending this seminar.

In aerospace, automotive, and other fields, rapid advancements in material development and manufacturing technology are being made to achieve further weight reduction aimed at improving fuel efficiency and reducing carbon dioxide emissions. This seminar will provide an easy-to-understand explanation for beginners about the trends in new material development at advanced companies that are energetically working towards ultra-lightweight solutions using lightweight materials such as carbon fiber, aluminum, and ceramics, as well as various additive manufacturing (AM) and manufacturing technologies and product case studies utilizing these materials through complex shape integration, lattice/honeycomb structure fabrication, porous structure fabrication, and topology optimization with 3D printers, which are impossible with conventional processing methods and technologies. The lightweighting of parts that can significantly differentiate from conventional and competitor parts is an urgent and critical issue, and intense technological development competition is unfolding both domestically and internationally. 3D printers, which are seen as the next-generation manufacturing method, offer a completely new perspective on AM technology, enabling the creation of innovative and attractive lightweight parts that are difficult to achieve with existing processing methods and technologies, as well as realizing short-term, low-cost, and high-quality manufacturing. Development cannot be expected to progress along the lines of existing technologies. By merging lightweight materials with 3D printing and utilizing topology optimization, astonishing weight reduction of parts can be achieved. We encourage you to take on this challenge.

At the beginning of this seminar, we will focus on the research and development related to ceramics 3D additive manufacturing that the National Institute of Advanced Industrial Science and Technology has been working on. We will discuss 3D additive manufacturing, powder preparation for manufacturing, debinding and sintering processes, as well as case studies of ceramics 3D additive manufacturing centered on alumina and reaction-sintered silicon carbide. Next, we will introduce Canon's latest developments in high-performance ceramic materials that significantly reduce "shrinkage" during sintering, which excel in selective laser melting (SLM) for 3D printers. We will also cover the characteristics of parts that can be manufactured using this method, layering technology, target fields, contract manufacturing services, and collaboration with Metal Research Institute, which has started high-precision semi-conductor part manufacturing services using metal 3D printers with these materials. After that, we will have advanced explanations from instructors of Shin-Toh V-Ceramics and As One about the development trends of various ceramics 3D printers from world-leading companies 3DCeram Sinto and Lithoz. We will discuss the latest additive manufacturing technologies that enable the creation of innovative parts, rapid part development, prototyping, and manufacturing, significant reductions in the number of parts, lightweight miniaturization, and reductions in manufacturing processes and workforce through the production of complex shapes, hollow and porous structures, and lattice structures that were previously impossible.

The complex shape manufacturing, integrated manufacturing, lattice/honeycomb structure manufacturing, porous structure manufacturing, hybrid structure manufacturing, direct manufacturing from 3D data, as well as topology optimization and collaboration with generative design, which were difficult with conventional processing methods and technologies, can lead to the creation of innovative aluminum parts that are not found in traditional or other companies. This includes rapid development, prototyping, and manufacturing of parts, dramatic reductions in the number of parts, ultra-lightweight and compact designs, and significant reductions in manufacturing time, costs, processes, and workforce. In this seminar, pioneering users such as J·3D, ODEC, and the pioneers of white copper, who are utilizing metal 3D printers to rapidly develop, prototype, and manufacture complex aluminum parts, will specifically explain the key points and precautions for introduction and utilization, various manufacturing methods and technologies, unique next-generation AM technologies developed in-house, and groundbreaking case studies that significantly differentiate their parts from those of other companies, sharing both success and failure stories. With the remarkable advancements in metal AM technology, the use of metal 3D printers for aluminum parts manufacturing will become commonplace in a few years. The secrets to success will be discussed by instructors with numerous research achievements and extensive manufacturing experience, providing clear and concrete lectures for those considering implementation, beginners with interest, and those who are new to the field.