Confirmation of chiplet package structure by mechanical polishing.

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

• Contract Analysis
• Contract measurement
• Other contract services

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Surface treatment contract service
• Other contract services

You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

Our company conducts "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks and voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, while for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Inspection
• Other contract services

Observations before and after reliability testing and cross-sectional observations! Here are examples of observations of various implemented components.

We would like to introduce our service for "various cross-sectional observations of mounted components on circuit boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, you can see that numerous components are tightly soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can prevent normal operation. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metallurgical microscope. The observation modes of the metallurgical microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metallurgical microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.

We would like to introduce an example of "observation of semiconductors through mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those produced by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment

Due to the advantages and disadvantages, it is necessary to choose according to the sample form, observation range, purpose, etc.!

At our company, we created a cross-section of the CMOS image sensor component associated with VR goggles manufactured by Company A through mechanical polishing while keeping the component in its original state, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the surface of the CMOS sensor, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the method for creating cross-sections. [Overview] ■ Observation of sensor component structure and sensor surface ■ Cross-section creation by mechanical polishing ■ SEM observation of the sensor chip surface layer *For more details, please download the PDF or feel free to contact us.

• Other analysis and evaluation services

Observation of the sensor chip surface, creating a cross-section through mechanical polishing in the mounted state, and conducting structural observation of the device!

We would like to introduce the "Tracking Camera Cross-Section Observation" through mechanical polishing. Regarding the structure of the tracking camera components, the lens can be confirmed when viewed from above, and while it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is the same as that of the RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode. 【Features】 ■ The cross-sectional structure is a back-illuminated CMOS structure, similar to that of the RGB sensor. ■ There is no color filter layer since color information is not needed for the tracking camera. ■ A jagged uneven shape was observed on the surface of the photodiode. *For more details, please download the PDF or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

We will be exhibiting at the "Mechanical Elements Technology Exhibition" held at Tokyo Big Sight starting next Wednesday, July 1st. This time, we will focus on field challenges such as "adhesion," "wear," and "corrosion," which many customers have consulted us about, and we will showcase various coating solutions that contribute to solving these issues along with actual samples. You will be able to directly confirm the characteristics such as slip resistance, non-stick properties, and durability by touching the actual coatings at the venue. ■ Featured Technologies and Products - Thermo Pro Release High-temperature durable fluoropolymer coating (for thermal welding and thermal crimping processes) - NonStick STC Thin film non-stick coating (for precision molds and industrial blades) - PEEKCOAT PEEK coating boasting high wear resistance and chemical resistance ■ Exhibition Overview 【Exhibition Name】Monozukuri World 2026 Mechanical Elements Technology Exhibition 【Dates】July 1 (Wednesday) to July 3 (Friday), 2026 【Venue】Tokyo Big Sight 【Booth Number】E6-47 (East Hall 1) We sincerely look forward to your visit.

The temporary sheets used at civil engineering sites are important not only for their performance but also for transportation efficiency and costs. The "Hyper CLT Sheet," utilizing wooden CLT, is lightweight, weighing approximately 230 kg for the 5×10 version and about 460 kg for the 5×20 version, making it easier to handle during transportation compared to steel sheets. By improving the efficiency of loading, unloading, moving on-site, and installation/removal tasks, it also contributes to reducing the labor involved in truck arrangements and heavy machinery operations. It is easy to handle even in narrow sites or where transportation conditions are limited, and can be used for a wide range of applications such as temporary roads, heavy machinery scaffolding, access routes, and pedestrian pathways. Its lightweight nature makes it manageable even for small machinery, contributing to reduced worker burden and shortened processes. Additionally, it is a material that is easy to propose in terms of glare reduction, noise reduction, and environmental considerations, unique to wood. The Hyper CLT Sheet is a registered technology under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS as "TH-250021-A." As a substitute for steel sheets, it is a new civil engineering material that can simultaneously propose cost reductions in transportation, improved workability, creativity, and safety measures. It can also be utilized for differentiation in public works and general contractor sites, enhancing on-site evaluations. It is particularly recommended for remote sites where transportation costs are a concern.

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding repair methods can change the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

The "Hotron Non-Contact Switch" allows you to open and close doors without directly touching door knobs or switches, making it hygienic! You can choose from two types: the "Hand Wave Sensor," which only requires you to wave your hand, and the "Foot Switch," which only requires you to place your foot in front of it. It reduces the risk of virus and bacteria transmission in places where hygiene is a concern, such as food factories, restaurants, hospitals, and nursing facilities. 【Features】 ○ Reduces the risk of virus transmission by allowing door operation without contact ○ A wide variety of options to choose from based on application and location ○ Ideal for places where hygiene is a priority, such as food factories and medical facilities ○ Prevents unnecessary detection due to the switch mechanism 【Product Lineup】 ■ Hand Wave Sensor Series ○ Exposed waterproof type, front, down, and side-facing types "PF-R5" ○ Exposed type, front-facing type "PF-R1" ○ Embedded type, front-facing type "PF-U2" ○ Exposed type, downward wide type "PF-R4" ■ Foot Switch Series ○ Slim type with wide opening, vertical beam type "PF-01S" ○ Slim type with wide opening, horizontal beam type "PF-03S" ○ Standard type, horizontal beam type "PF-05" ◎ For more details, please download the catalog or contact us.

In facilities operating nurse call systems, we have made the bed exit sensor wireless, allowing it to notify in conjunction with the nurse call system. By simply connecting the mat sensor "Foldable Thin Matt-kun," the body movement call "Ugo-kun," and the wheelchair body movement call "Ayumi-chan" to the transmitter HB-RS, you can make the bed exit sensor wireless. The infrared sensor "Just Place Pole-kun" has the transmitter HB-RS built-in. This helps prevent accidents caused by falls, slips, or wandering, contributing to the efficiency of medical operations. 【Features】 ○ Wireless conversion by simply connecting existing sensors to the transmitter HB-WSK. ○ The bed exit sensor notifies wirelessly in conjunction with the nurse call system. ○ Up to 5 transmitters can be registered with a single receiver. ○ The communication distance between the transmitter and receiver is approximately 10 meters. ◎ For more details, please contact us or download the catalog.