Confirmation of chiplet package structure by mechanical polishing.

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

• Contract Analysis
• Contract measurement
• Other contract services

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Surface treatment contract service
• Other contract services

You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

Our company conducts "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks and voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, while for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Inspection
• Other contract services

Observations before and after reliability testing and cross-sectional observations! Here are examples of observations of various implemented components.

We would like to introduce our service for "various cross-sectional observations of mounted components on circuit boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, you can see that numerous components are tightly soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can prevent normal operation. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metallurgical microscope. The observation modes of the metallurgical microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metallurgical microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Circuit board design and manufacturing

Cross-section preparation for structural observation and defect analysis of semiconductors! Cross-section preparation comparable to FIB and CP is possible.

We would like to introduce an example of "observation of semiconductors through mechanical polishing" conducted by our company. While there are advantages and disadvantages, it is possible to create cross-sections with mechanical polishing that are comparable to those produced by FIB or CP. Based on years of accumulated know-how, our company will propose the most appropriate processing methods according to the observation purpose, sample composition, and structure. If you have any concerns, please feel free to contact us at the information below. 【Observation Examples】 ■ Semiconductor_Si ■ Compound Semiconductor_GaN ■ Compound Semiconductor_GaP ■ Compound Semiconductor_GaAs *For more details, please refer to the PDF materials or feel free to contact us.

• Wafer processing/polishing equipment

Due to the advantages and disadvantages, it is necessary to choose according to the sample form, observation range, purpose, etc.!

At our company, we created a cross-section of the CMOS image sensor component associated with VR goggles manufactured by Company A through mechanical polishing while keeping the component in its original state, and we conducted structural observations of the CMOS sensor component. During the observation of the sensor component structure and sensor surface, we removed the glass filter and observed the surface of the CMOS sensor, where it was noted that the arrangement of the color filters was in a configuration known as a Bayer filter. In addition to mechanical polishing, methods for creating cross-sections include processing with ion beams such as FIB and CP, as well as microtome methods. Consultations are free, so please feel free to contact us if you are unsure about the method for creating cross-sections. [Overview] ■ Observation of sensor component structure and sensor surface ■ Cross-section creation by mechanical polishing ■ SEM observation of the sensor chip surface layer *For more details, please download the PDF or feel free to contact us.

• Other analysis and evaluation services

Observation of the sensor chip surface, creating a cross-section through mechanical polishing in the mounted state, and conducting structural observation of the device!

We would like to introduce the "Tracking Camera Cross-Section Observation" through mechanical polishing. Regarding the structure of the tracking camera components, the lens can be confirmed when viewed from above, and while it cannot be clearly seen in the X-ray image, the lens is incorporated into the convex part. Additionally, the cross-sectional structure is the same as that of the RGB sensor, featuring a back-illuminated CMOS structure. However, since color information is not necessary for the tracking camera, there is no color filter layer. A jagged uneven shape was observed on the surface of the photodiode. 【Features】 ■ The cross-sectional structure is a back-illuminated CMOS structure, similar to that of the RGB sensor. ■ There is no color filter layer since color information is not needed for the tracking camera. ■ A jagged uneven shape was observed on the surface of the photodiode. *For more details, please download the PDF or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

In power company tower construction, there are sites in mountainous areas and narrow access roads where careful planning is needed for the movement of heavy machinery and materials. One solution being utilized in such locations is the wooden lightweight mat "Hyper CLT Mat," made from CLT (Cross-Laminated Timber). This mat can be used for temporary roads, access routes, heavy machinery work yards, and material storage areas, with a 5×10 panel weighing approximately 230 kg, making it relatively lightweight. It is easy to install, remove, and relocate even with small machinery, making it convenient for tower construction sites where work locations are scattered, allowing for flexibility in usage according to the progress of the site. Additionally, it offers environmental benefits such as reducing glare and metal noise, as well as CO2 fixation, thanks to its wooden composition. The Hyper CLT Mat is registered as a technology under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS system as "TH-250021-A." As a wooden lightweight mat combining wood, NETIS, civil engineering, and CLT, its applications are expanding in infrastructure sites, including tower construction.

We handle EEMB's 3.7V high-capacity lithium polymer batteries (Li-Po). With high energy density, they can secure a lot of power even in limited spaces, and their thin and lightweight pouch structure enhances design flexibility for devices. In addition to our standard lineup, we also accommodate custom dimensions and shapes, as well as custom designs for battery packs. 【Applications】 - Smartphones, tablets - Medical devices, card readers - Control devices, smartwatches - Power tools, IoT devices, etc. The nominal voltage is 3.7V. We have obtained various safety standards and certifications such as UN38.3 (transport), IEC/EN62133, UL1642, PSE, CE, KC, ISO9001/14001, and REACH (the applicable scope varies by product). If you let us know your intended use and environment, we can suggest specifications that meet your requirements.

Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily understandable at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

The Hyper CLT ground panel is currently registered as **Ministry of Land, Infrastructure, Transport and Tourism NETIS registered technology "TH-250021-A."** The next goal is to achieve NETIS "VE." To do this, it is important not to be satisfied with just the registration, but to accumulate practical results in actual civil engineering sites. By being used in various locations such as temporary roads, access roads, heavy machinery work yards, and material yards, we will further confirm the practicality and effectiveness of wooden CLT. The Hyper CLT ground panel is a civil engineering material that is lightweight, easy to install and remove, and possesses unique characteristics of wood, such as glare reduction, suppression of metallic sounds, and CO2 fixation. We aim to transform the new combination of wood, NETIS, civil engineering, and CLT into a more trusted technology. While steadily building evaluations and achievements on-site, we will strive for NETIS "VE" as the next stage.

SPACECOOL Co., Ltd. is pleased to announce the introduction of our developed radiative cooling material "SPACECOOL" into fruit and vegetable sales carts in India. Local vendors have reported that it is particularly helpful in maintaining the freshness of leafy vegetables, which are prone to spoilage when exposed to heat. Produce that previously had to be discarded after about two days can now remain in a saleable condition for up to four days under similar conditions. By extending the saleable period, not only can waste be reduced, but the frequency of purchases from wholesale markets can also be minimized, leading to savings in fuel costs and travel time. This introduction is part of the SPACES program, funded by the Shell Foundation and the UK government's Foreign, Commonwealth & Development Office (FCDO). Trane Technologies is collaborating on the cooling technology aspect, and Intellecap is participating as the implementation partner. The program aims to address the escalating heat stress in low-income communities in India. Moving forward, our company will continue to contribute to measures against escalating heat stress and promote the introduction of radiative cooling technology worldwide to support sustainable and energy-efficient cooling.