5/20 Webinar "Fundamentals and Applications of Neural Network Molecular Dynamics: AI-Driven Material Design"

The era when AI was merely a tool waiting for human instructions has ended, leading to coexistence with humans! Instead of being immersed in specialized fields, a cross-disciplinary "integrative perspective" is required!

Physical AI: Integrated Technology of Materials, Devices, and Implementation [Features of this Book] - A radical shift in design philosophy. A complete and detailed explanation of the "four-in-one" strategy of materials, components, structures, and signal processing! - The reintegration of matter and intelligence. An essential latest report for developers that delves into the core of next-generation device development! - From self-healing materials to soft robotics. A stunning vision of the future opened up by physical intelligence! - Going beyond GAFA. A scenario for dominance in 2050 interpreted through implementation technology and device evolution! - Comprehensive corporate analysis. Identifying technological challenges and business opportunities, providing guidance for investment and development! - A condensed overview of the latest trends in MEMS and flexible devices. The societal changes brought about by advanced sensing! - Sustainable manufacturing. A sharp analysis of the challenges of sustainable materials and social implementation! - From autonomous driving to healthcare. A roadmap to 2050, a bible for technological integration!

• Technical and Reference Books

Systematically analyze the structural changes in power supply for AI data centers from four perspectives: "market," "power architecture," "material DX," and "implementation technology"!

World AI Data Center Battery: Latest Industry Report ~1500V High Voltage and Material DX Transforming the Next Generation DC Infrastructure~ 【Features of this Book】 - Challenging the physical limits of 1500V high voltage! Insulation and BMS design for next-generation DC architecture! - Exploration of new materials through MI (Material Informatics). Atomic-level interface control! - Response characteristics to the steep dynamic loads unique to AI. Innovations in electrode interfaces controlling capacitive behavior! - Extending lifespan in high-temperature environments from theory to implementation. An overview of thermal stability design that breaks free from reliance on air conditioning! - Public release of negative electrode material performance matrix! Analyzing the fragmented technology roadmap from the perspective of materials science! - The conflict between dry process powder design and thick film formation. Process innovations that break through energy density limits! - Crystal structures and operational evaluation data for post-lithium 3 technologies (Na/Ni-Zn/Fe-Air)! - Technical benchmarking of hyperscaler power strategies. R&D guidelines looking towards 2027!

• Secondary Cells/Batteries
• Technical and Reference Books

Focusing on high-speed optical communication technologies and materials for AI data center applications, analyzing industry and market trends!

**Features of this Book** - Comparison of transmission distances between boards, within and between data centers, and long distances! - Investigation of Co-Packaged Optics (CPO) due to the growing demand for high-speed transmission driven by AI proliferation! - Research on the technological trends of E polymers used in optical modulators and optical switches! - Trends and background of optical module light sources using VCSEL chips for data centers! - Characteristics of glass substrates that are compatible with optical transmission and the development of glass interposers? - Investigation of development trends for silicon photonics-based receivers and electro-optic modulators! - Unique polymer waveguide manufacturing methods developed by companies and the required waveguide materials! - Key points, types, and trends of adhesives used for optics/optical fibers? - Methods and challenges of connecting optical fibers and the integration of silicon photonics with optical fibers! **Table of Contents** Part 1: Optical Fibers Part 2: Optical Fiber Components Part 3: Optoelectronic Integration Part 4: Adhesives and Bonding *For a detailed table of contents, please refer to the related link URL.*

• Technical and Reference Books
• others

Focusing on cooling technologies and materials for AI data centers with increasing demand, analyzing industry and market trends!

**Features of this Book** - Industry analysis of DLC, liquid immersion cooling, and hybrid cooling methods! Market forecast up to 2030! - Research on the characteristics of single-phase and two-phase immersion cooling systems, the companies adopting them, their backgrounds, and the industry! - What are the reasons for the increasing adoption of mineral oil as a cooling fluid? An analysis of the strategies of entering companies! - What are the strategies of various companies regarding the non-use of fluorine and low content after 3M's announcement of withdrawal from PFAS manufacturing? - Research on bio-based coolants, silicone oils, their characteristics, and the companies and industries involved! - Industry analysis of cooling equipment such as chillers, cooling towers, heat exchangers, and CDU, along with the features of each company's products! - Advantages and disadvantages of container-type data centers, and the background supporting their use in AI development! **Structure of this Book** Part 1: Cooling Systems Part 2: Liquid Cooling Part 3: Equipment and Devices Part 4: Analysis of Trends in Countries, Companies, and Products *For a detailed table of contents, please refer to the related link URL.*

• server
• Server Cooler
• others

A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.

- The data center cooling market in 2030 is expected to expand to ● billion yen, a ●% increase compared to 2023! Investigating the background! - Researching the technology trends of silicon photonics and the background for the adoption of PIC! - Exploring market forecasts for Si, SiC, GaN, and Ga2O3 semiconductors, their backgrounds, and developments in various applications! - Why are NVIDIA and AMD adopting CoWoS technology? What are the challenges? What is TSMC's strategy? - Advantages and disadvantages of interposers, industry trends, and movements of TSMC, Intel, and Samsung! - The intensifying global HBM market share competition and the business opportunities for Japanese companies that accompany it! - Investigating the required performance and technology trends for underfill, market forecasts, and company-specific shares! - The market for FC-BGA substrates for AI servers/data centers, company-specific shares, and corporate strategies! 【Table of Contents】 Part I: AI Data Centers Part II: Cooling and Thermal Management Part III: Optical Communication Related Part IV: Next-Generation Semiconductors Part V: Packaging Technology Part VI: High-Multilayer Substrates and Low-Dielectric Resins *For a detailed table of contents, please refer to the related link URL.

• Other semiconductors
• Database
• EAI/ETL/WEB application server

Chuo Automobile Industry Co., Ltd. will be exhibiting at the "PV EXPO International Photovoltaic Power Generation Exhibition" held at Intex Osaka. A variety of products and technologies will be showcased, ranging from advanced solar cells to the construction, maintenance, and operation of solar power plants, with experts from around the world attending the exhibition. This event, where people and information gather "in real life" from all over the world, is an important platform to accelerate the solar power business through face-to-face interactions. We sincerely look forward to your visit.

Rineo Solutions will be exhibiting at EdgeTech+ 2025. At the venue, we will introduce the total solutions from the Cybertrust Group that can be widely used from the design to the operational phase of embedded Linux development. We invite you to visit the Cybertrust/Rineo Solutions booth during your visit. ■ Products Scheduled for Display SBOM and Vulnerability Management "Timesys Vigiles" Embedded Linux Ultra-Fast Boot Solution "LINEOWarp!!" "Embedded Linux Maintenance Service" Long-Term Usable IoT and Embedded Linux OS "EMLinux" SBOM-Compatible Vulnerability Management Tool "Miracle Vul Hammer" ■ Announcement of Presentations At this exhibition, there will be two presentations by members of Cybertrust/Rineo Solutions. We plan to introduce useful information for the development and operation of embedded Linux products, so please join us.

The JIMTOF2026 has started today, October 26! When you visit, please be sure to stop by our booth. (Booth number: East 1 E1014) ▼JIMTOF2026 Special Page https://www.somax.co.jp/notice02/ We sincerely look forward to your visit!

● Dates: November 12 (Thursday) to November 14 (Saturday), 2026 10:00 AM to 4:00 PM (Final day, the 14th, until 3:00 PM) ● Venue: Okaya City Comprehensive Gymnasium ● Exhibition Name: Suwa Area Industrial Messe 2026 ● Our Booth: East 156 ● Exhibition Content: We will showcase our main products in six categories, including "Linear Encoders," "Linear Displacement Sensors," "Sensors for Unmanned Transport Vehicles," "Magnetic Proximity Switches," "High-Precision Magnetic Sensors/Switches," and "Inclinometers/Inclinometer Detectors," as well as other magnetic application devices. ● Pre-registration for attendance: Free, but please register in advance. ● For other inquiries, please contact us using the options below: · Phone inquiries · Inquiry form Sales and technical staff will be on-site, so we welcome consultations on matters beyond the exhibited products. Feel free to stop by. We look forward to your visit.

We will be exhibiting at the "Powder Technology Exhibition 2026" held at Tokyo Big Sight. During the event, we will showcase various products. We invite all related parties to come and visit us. 【Suppliers】 ・Hielscher