5/20 Webinar "Fundamentals and Applications of Neural Network Molecular Dynamics: AI-Driven Material Design"

The era when AI was merely a tool waiting for human instructions has ended, leading to coexistence with humans! Instead of being immersed in specialized fields, a cross-disciplinary "integrative perspective" is required!

Physical AI: Integrated Technology of Materials, Devices, and Implementation [Features of this Book] - A radical shift in design philosophy. A complete and detailed explanation of the "four-in-one" strategy of materials, components, structures, and signal processing! - The reintegration of matter and intelligence. An essential latest report for developers that delves into the core of next-generation device development! - From self-healing materials to soft robotics. A stunning vision of the future opened up by physical intelligence! - Going beyond GAFA. A scenario for dominance in 2050 interpreted through implementation technology and device evolution! - Comprehensive corporate analysis. Identifying technological challenges and business opportunities, providing guidance for investment and development! - A condensed overview of the latest trends in MEMS and flexible devices. The societal changes brought about by advanced sensing! - Sustainable manufacturing. A sharp analysis of the challenges of sustainable materials and social implementation! - From autonomous driving to healthcare. A roadmap to 2050, a bible for technological integration!

• Technical and Reference Books

Systematically analyze the structural changes in power supply for AI data centers from four perspectives: "market," "power architecture," "material DX," and "implementation technology"!

World AI Data Center Battery: Latest Industry Report ~1500V High Voltage and Material DX Transforming the Next Generation DC Infrastructure~ 【Features of this Book】 - Challenging the physical limits of 1500V high voltage! Insulation and BMS design for next-generation DC architecture! - Exploration of new materials through MI (Material Informatics). Atomic-level interface control! - Response characteristics to the steep dynamic loads unique to AI. Innovations in electrode interfaces controlling capacitive behavior! - Extending lifespan in high-temperature environments from theory to implementation. An overview of thermal stability design that breaks free from reliance on air conditioning! - Public release of negative electrode material performance matrix! Analyzing the fragmented technology roadmap from the perspective of materials science! - The conflict between dry process powder design and thick film formation. Process innovations that break through energy density limits! - Crystal structures and operational evaluation data for post-lithium 3 technologies (Na/Ni-Zn/Fe-Air)! - Technical benchmarking of hyperscaler power strategies. R&D guidelines looking towards 2027!

• Secondary Cells/Batteries
• Technical and Reference Books

Focusing on high-speed optical communication technologies and materials for AI data center applications, analyzing industry and market trends!

**Features of this Book** - Comparison of transmission distances between boards, within and between data centers, and long distances! - Investigation of Co-Packaged Optics (CPO) due to the growing demand for high-speed transmission driven by AI proliferation! - Research on the technological trends of E polymers used in optical modulators and optical switches! - Trends and background of optical module light sources using VCSEL chips for data centers! - Characteristics of glass substrates that are compatible with optical transmission and the development of glass interposers? - Investigation of development trends for silicon photonics-based receivers and electro-optic modulators! - Unique polymer waveguide manufacturing methods developed by companies and the required waveguide materials! - Key points, types, and trends of adhesives used for optics/optical fibers? - Methods and challenges of connecting optical fibers and the integration of silicon photonics with optical fibers! **Table of Contents** Part 1: Optical Fibers Part 2: Optical Fiber Components Part 3: Optoelectronic Integration Part 4: Adhesives and Bonding *For a detailed table of contents, please refer to the related link URL.*

• Technical and Reference Books
• others

Focusing on cooling technologies and materials for AI data centers with increasing demand, analyzing industry and market trends!

**Features of this Book** - Industry analysis of DLC, liquid immersion cooling, and hybrid cooling methods! Market forecast up to 2030! - Research on the characteristics of single-phase and two-phase immersion cooling systems, the companies adopting them, their backgrounds, and the industry! - What are the reasons for the increasing adoption of mineral oil as a cooling fluid? An analysis of the strategies of entering companies! - What are the strategies of various companies regarding the non-use of fluorine and low content after 3M's announcement of withdrawal from PFAS manufacturing? - Research on bio-based coolants, silicone oils, their characteristics, and the companies and industries involved! - Industry analysis of cooling equipment such as chillers, cooling towers, heat exchangers, and CDU, along with the features of each company's products! - Advantages and disadvantages of container-type data centers, and the background supporting their use in AI development! **Structure of this Book** Part 1: Cooling Systems Part 2: Liquid Cooling Part 3: Equipment and Devices Part 4: Analysis of Trends in Countries, Companies, and Products *For a detailed table of contents, please refer to the related link URL.*

• server
• Server Cooler
• others

A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.

- The data center cooling market in 2030 is expected to expand to ● billion yen, a ●% increase compared to 2023! Investigating the background! - Researching the technology trends of silicon photonics and the background for the adoption of PIC! - Exploring market forecasts for Si, SiC, GaN, and Ga2O3 semiconductors, their backgrounds, and developments in various applications! - Why are NVIDIA and AMD adopting CoWoS technology? What are the challenges? What is TSMC's strategy? - Advantages and disadvantages of interposers, industry trends, and movements of TSMC, Intel, and Samsung! - The intensifying global HBM market share competition and the business opportunities for Japanese companies that accompany it! - Investigating the required performance and technology trends for underfill, market forecasts, and company-specific shares! - The market for FC-BGA substrates for AI servers/data centers, company-specific shares, and corporate strategies! 【Table of Contents】 Part I: AI Data Centers Part II: Cooling and Thermal Management Part III: Optical Communication Related Part IV: Next-Generation Semiconductors Part V: Packaging Technology Part VI: High-Multilayer Substrates and Low-Dielectric Resins *For a detailed table of contents, please refer to the related link URL.

• Other semiconductors
• Database
• EAI/ETL/WEB application server

The "International Fermentation and Brewing Food Industry Exhibition" is Japan's only specialized exhibition that brings together ingredients, materials, research equipment, manufacturing facilities, testing equipment, and packaged products related to fermentation and brewing. In 2013, "Washoku" (Japanese cuisine) and in 2024, "Traditional Sake Brewing" were registered as UNESCO Intangible Cultural Heritage, increasing interest in Japan's fermentation and brewing industry. This exhibition will be grandly held at Tokyo Big Sight as a platform to promote the development of the industry and the richness of food culture to the world, and to spread Japan's proud fermented and brewed foods.

Gathering the wisdom of the DOWA Group towards the realization of a decarbonized society! We would like to introduce the initiatives of each DOWA Group company. We look forward to seeing you at our booth!

Heat pipes are passive heat transfer devices that utilize latent heat of vaporization in a two-phase system and do not require driving energy. Heat pipes have very high thermal conductance, with their equivalent thermal conductivity being several hundred times higher than that of a copper rod of the same size. The primary application of heat pipes is in the cooling of computers and electronic products. Recently, AI servers and data centers have gained attention; for example, nVidia's GPUs can reach heat generation of up to 1 kW, employing water-cooled cold plates and 3D vapor chambers. Air cooling is limited to 800 W, while nVidia's Ruben GPU can reach 2 kW, utilizing water-cooled microchannel cold plates, among others. In response to further increases in heat generation, vapor chamber composite cold plates, two-phase pump loop cooling, and impingement cooling have been developed. Additionally, recent cooling cases for batteries, motors, and IGBTs in electric vehicles will be discussed.

In the past, thermal design primarily focused on complex heat transfer through convection and radiation to the atmosphere. However, with the increase in surface-mounted components and power density, the heat dissipation pathways are gradually shifting to thermal conduction through substrates and enclosures. One of the key heat dissipation devices to promote heat transfer in limited spaces is TIM (Thermal Interface Material). A wide variety of TIMs have been developed in the market, and in recent years, key areas where TIMs are widely used include AI data centers and automotive equipment centered around electric vehicles (EVs). In this course, we will first explain the overview of heat dissipation design in AI data centers and automotive equipment, and in the latter half, we will provide a detailed explanation of the thermal and mechanical properties of TIMs in these two fields, as well as important considerations when selecting TIMs.

An explanation of the economic viability, technology, projects, and industry trends and outlook for thermal energy storage and thermoelectric batteries, which are attracting attention for their use in unused heat utilization, energy storage, and renewable energy load leveling. Part 1 Technological and business outlook for thermal energy storage and thermoelectric batteries both domestically and internationally Part 2 Fundamentals, components, technology, and application outlook of thermophotovoltaic (TPV) power generation systems