6/2 Webinar "AI Data Center Heat Dissipation/Cooling Technology"

Systematically analyze the structural changes in power supply for AI data centers from four perspectives: "market," "power architecture," "material DX," and "implementation technology"!

World AI Data Center Battery: Latest Industry Report ~1500V High Voltage and Material DX Transforming the Next Generation DC Infrastructure~ 【Features of this Book】 - Challenging the physical limits of 1500V high voltage! Insulation and BMS design for next-generation DC architecture! - Exploration of new materials through MI (Material Informatics). Atomic-level interface control! - Response characteristics to the steep dynamic loads unique to AI. Innovations in electrode interfaces controlling capacitive behavior! - Extending lifespan in high-temperature environments from theory to implementation. An overview of thermal stability design that breaks free from reliance on air conditioning! - Public release of negative electrode material performance matrix! Analyzing the fragmented technology roadmap from the perspective of materials science! - The conflict between dry process powder design and thick film formation. Process innovations that break through energy density limits! - Crystal structures and operational evaluation data for post-lithium 3 technologies (Na/Ni-Zn/Fe-Air)! - Technical benchmarking of hyperscaler power strategies. R&D guidelines looking towards 2027!

• Secondary Cells/Batteries
• Technical and Reference Books

Focusing on cooling technologies and materials for AI data centers with increasing demand, analyzing industry and market trends!

**Features of this Book** - Industry analysis of DLC, liquid immersion cooling, and hybrid cooling methods! Market forecast up to 2030! - Research on the characteristics of single-phase and two-phase immersion cooling systems, the companies adopting them, their backgrounds, and the industry! - What are the reasons for the increasing adoption of mineral oil as a cooling fluid? An analysis of the strategies of entering companies! - What are the strategies of various companies regarding the non-use of fluorine and low content after 3M's announcement of withdrawal from PFAS manufacturing? - Research on bio-based coolants, silicone oils, their characteristics, and the companies and industries involved! - Industry analysis of cooling equipment such as chillers, cooling towers, heat exchangers, and CDU, along with the features of each company's products! - Advantages and disadvantages of container-type data centers, and the background supporting their use in AI development! **Structure of this Book** Part 1: Cooling Systems Part 2: Liquid Cooling Part 3: Equipment and Devices Part 4: Analysis of Trends in Countries, Companies, and Products *For a detailed table of contents, please refer to the related link URL.*

• server
• Server Cooler
• others

A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.

- The data center cooling market in 2030 is expected to expand to ● billion yen, a ●% increase compared to 2023! Investigating the background! - Researching the technology trends of silicon photonics and the background for the adoption of PIC! - Exploring market forecasts for Si, SiC, GaN, and Ga2O3 semiconductors, their backgrounds, and developments in various applications! - Why are NVIDIA and AMD adopting CoWoS technology? What are the challenges? What is TSMC's strategy? - Advantages and disadvantages of interposers, industry trends, and movements of TSMC, Intel, and Samsung! - The intensifying global HBM market share competition and the business opportunities for Japanese companies that accompany it! - Investigating the required performance and technology trends for underfill, market forecasts, and company-specific shares! - The market for FC-BGA substrates for AI servers/data centers, company-specific shares, and corporate strategies! 【Table of Contents】 Part I: AI Data Centers Part II: Cooling and Thermal Management Part III: Optical Communication Related Part IV: Next-Generation Semiconductors Part V: Packaging Technology Part VI: High-Multilayer Substrates and Low-Dielectric Resins *For a detailed table of contents, please refer to the related link URL.

• Other semiconductors
• Database
• EAI/ETL/WEB application server

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

We will showcase our new product "BLFF," a palletizing foam gripper that weighs only 1.9 kg and measures 350mm×250mm, ideal for bulk picking. We will also introduce various products that cater to different work applications, including durable suction cups and solutions for bag handling. Additionally, we are implementing energy-saving proposals by replacing ejectors to reduce compressed air consumption, which has become a challenge in many industries. If you have any issues with adhesion or transport, please feel free to consult with us at the venue. ■ Lightweight Foam Gripper for Collaborative Robots "CVGC Series" Despite weighing only 1.9 kg, this gripper has a theoretical lifting force of 100 kg, maximizing the payload capacity of collaborative robots. ■ Gripper for Films This gripper is designed to transport thin films gently, minimizing marks left on the surface. By utilizing 3D printing, we can accommodate highly flexible shape designs tailored to specific workpieces and applications. ■ Energy Saving Comparison Panel "Why does a single ejector consume less compressed air compared to a multi-stage ejector?" You can actually verify the differences in compressed air consumption through a comparative display using a flow meter and actual equipment.

We will be exhibiting at Smart Factory JAPAN, held at Tokyo Big Sight from November 18 (Wednesday) to November 20 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that integrate with both products! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Smart Factory JAPAN 2026 Overview ■■ Dates: November 18 (Wednesday), 19 (Thursday), 20 (Friday), 2026 Opening Hours: 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Hall 1-3 Our Booth Number: F-20 Registration: Nikkan Kogyo Shimbun 6 Exhibition Joint Site When visiting, please register in advance from your My Page and bring a printed admission ticket. Business meeting requests are also possible, so please make use of this opportunity.

We will be exhibiting at the Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition, held at Marine Messe Fukuoka from December 2 (Wednesday) to December 4 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that help improve efficiency and reform in manufacturing sites! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Overview of the 4th Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition ■■ Dates: December 4 (Wednesday), 5 (Thursday), 6 (Friday), 2026 Opening hours: 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka Our booth number: 14-18 When visiting, please register in advance through the dedicated page and bring your printed visitor badge.

Announcement of participation in the "12th Robot and Aerospace Festival Fukushima 2026 / 5th Drone Summit." 【Date and Time】 　November 27, 2026 (Wednesday) 10:00 AM - 5:00 PM Business Exhibition 　November 28, 2026 (Thursday) 10:00 AM - 4:00 PM General Exhibition 【Venue】 　Big Palette Fukushima (52 Minami 2-chome, Koriyama City, Fukushima Prefecture) 【Exhibits】 　Cardboard Insulated Box 　Craft Cooler Cube